Core Viewpoint - The company, Huagong Technology, has successfully registered and issued short-term financing bonds and medium-term notes, aiming to raise a total of up to RMB 20 billion for each type of bond to support its financial activities [2][3]. Group 1: Bond Registration and Approval - Huagong Technology's board approved the application for the registration of short-term financing bonds and medium-term notes, with a maximum registration scale of RMB 20 billion for each type [2]. - The registration for short-term financing bonds and medium-term notes has been accepted, with the registered amounts confirmed at RMB 20 billion each, valid for two years from the date of the acceptance notice [2]. Group 2: Short-term Financing Bond Issuance - The company has completed the issuance of its first short-term financing bond for 2025, named "Huagong Technology Industry Co., Ltd. 2025 First Phase Technology Innovation Bond" [3]. - The bond has a term of 210 days, with a total planned issuance amount of RMB 500 million, which was fully achieved [3]. - The bond was issued at a price of 100 yuan per 100 yuan, with an interest rate of 1.65%, and the main underwriter was China CITIC Bank [3].