Group 1 - The board of Tongkun Co., Ltd. approved the issuance of ultra-short-term financing bonds, which received a registration quota of 6 billion yuan from the trading association on August 30, 2024 [1] - On September 10, 2025, the company issued the eighth phase of technology innovation bonds in the national interbank market, with a total issuance amount of 500 million yuan, and the funds were fully received on September 11 [1] - The bond, referred to as "25 Tongkun SCP008 (Tech Innovation Bond)," has a term of 260 days and an issuance interest rate of 1.84% [1] Group 2 - There were 8 compliant subscription applications for the bond, amounting to 920 million yuan, while 6 effective subscription applications totaled 570 million yuan [1]