Core Points - The company has approved the issuance of non-financial corporate debt financing instruments in the interbank bond market, with a total amount not exceeding RMB 4 billion [1] - The issuance includes medium-term notes up to RMB 2.5 billion and super short-term financing bonds up to RMB 1.5 billion [1] - The company has completed the issuance of its first phase of technology innovation bonds for 2025, amounting to RMB 500 million with a term of 270 days and an interest rate of 1.6% [1][2] Financial Strategy - The bond issuance is organized by Zheshang Bank as the lead underwriter, utilizing a book-building and centralized placement method for public issuance in the national interbank bond market [2] - The funds raised from this bond issuance will be used for the company's operational development, optimizing the debt structure, reducing financial costs, and supporting high-quality growth [2]