26均普智能MTN001(科创债)
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均普智能:2亿元2026年度第一期科创债完成发行
Zhong Zheng Wang· 2026-02-12 14:05
Group 1 - The company Junpu Intelligent (stock code: 688306.SH) announced the issuance of its first phase of technology innovation bonds for the year 2026, which has been completed in the interbank market [1] - The total issuance scale of this bond is 200 million yuan, with a maturity of 2 years [1] - The bond has been rated AAA, and the issuance interest rate is set at 2.49% [1]
均普智能:完成2亿元2026年度第一期科技创新债券发行
Xin Lang Cai Jing· 2026-02-12 09:12
Core Viewpoint - The company has announced its approval to issue up to 800 million yuan in medium-term notes and short-term financing bonds, with a total issuance amount not exceeding 800 million yuan [1] Group 1 - The company received registration approval from the trading association on January 7, 2026, with a registration quota valid for two years [1] - On February 12, 2026, the company completed the issuance of its first phase of technology innovation bonds for 2026, named "26 Junpu Intelligent MTN001 (Tech Innovation Bond)" [1] - The total planned and actual issuance amount for the technology innovation bond is 200 million yuan, with a maturity of two years and an issuance interest rate of 2.49% [1]