Core Insights - Alchip Technologies Limited has launched a comprehensive design and manufacturing ecosystem supporting NVIDIA's NVLink Fusion, integrating advanced process technologies and flexible engagement models [1][2] - The NVLink Fusion ecosystem includes Alchip's 2nm and 3nm Design Platforms, a leading 3DIC technology portfolio, and customizable design flow, with a record number of 3nm tape-outs [3][4] - Alchip's design methodology enhances efficiency by reducing turnaround time for design implementation and verification, crucial for AI-driven and high-performance computing sectors [6] Company Overview - Alchip Technologies, founded in 2003 and headquartered in Taipei, Taiwan, specializes in high-performance computing and AI infrastructure ASICs, offering IC and packaging design and production services [8] - The company is recognized for its advanced 2.5D/3D CoWoS packaging and chiplet design, serving global leaders in various sectors including AI, supercomputing, and mobile communications [8]

Core Insights - Alchip Technologies Limited has launched a comprehensive design and manufacturing ecosystem that supports NVIDIA's NVLink Fusion, integrating advanced process technologies and flexible engagement models [1][2][3] Company Overview - Alchip Technologies, founded in 2003 and headquartered in Taipei, Taiwan, specializes in high-performance computing and AI infrastructure ASICs, providing IC and packaging design, and production services [8] - The company is recognized for its advanced 2.5D/3D CoWoS packaging and chiplet design, serving global leaders in various sectors including AI, supercomputing, and mobile communications [8] NVLink Fusion Ecosystem - The NVLink Fusion ecosystem includes Alchip's 2nm and 3nm Design Platforms, a leading 3DIC technology portfolio, and a customizable design flow [3][4] - Alchip has achieved a record number of 3nm tape-outs and is actively engaging customers with its innovative 2nm Design Platform [3] Design Methodology and Capabilities - Alchip's design methodology reduces turnaround time for design implementation and verification by addressing side effects early in the design process [6] - The new 3DIC design flow optimizes power delivery, Die-to-Die electrical interconnect, and system-wide thermal characterization [4][5] Technical Features - The power delivery module of the 3DIC design flow includes power integrity, power grid design, and simulation capabilities [5] - The design flow also enhances power density and mitigates thermal crosstalk effects, contributing to improved system performance [5]