Summary of Key Points from the Conference Call Industry and Company Overview - The conference call primarily discusses **Huawei** and its developments in the **data center** and **high-performance computing** sectors, particularly focusing on the **384 node system** and advancements in **liquid cooling** and **high voltage direct current (HVDC)** technologies. Core Insights and Arguments - **384 Node System**: The 384 node system is considered a transitional product with performance improvements over the 920B model, but still lacking in certain precision operations. Future products like the 950 and 960 are expected to enhance performance further [1][3][5] - **HVDC Adoption**: Huawei plans to adopt **800V or higher HVDC** systems to improve power supply efficiency and reduce energy consumption. A mixed mode of AC to DC UPS and HVDC is anticipated to be implemented by 2025-2026 [1][4][10] - **Liquid Cooling Technology**: Liquid cooling has become a standard configuration, with the 920C model reaching a maximum power of **600W**, while the upcoming 950 and 960 models are expected to reach **1,000W** and **1,200W** respectively. Liquid cooling is deemed necessary for high power density applications despite its higher cost compared to air cooling [1][11][14] - **Cost Analysis**: The cost of a liquid cooling system is approximately **20,000 yuan per square meter**, with a total cabinet cost around **120,000 yuan**. In contrast, air cooling systems cost between **15,000 to 20,000 yuan per square meter**, totaling around **80,000 yuan** for a cabinet [14][15] - **Market Projections**: Expected shipments for the 920C model in 2025 are around **300,000 units**, while the 920B is projected at **600,000 units**. The 950 model is set to launch in Q1 2026, but with lower yield rates [3][24][25] Additional Important Insights - **Partnerships**: Huawei's SVDC project collaborates with partners like **Kehua** and **Bank of China** to advance project development [7] - **UPS Systems**: The company utilizes both international brands like **Schneider**, **ABB**, and **Vertiv**, as well as domestic brands like **Kehua** in its UPS solutions, aiming for localization [8] - **Microchannel Technology**: This technology is being explored for high heat dissipation needs, particularly in the 950 series chips, although it currently has high material costs [20][22] - **Future Trends**: The data center industry is expected to gradually transition to liquid cooling systems, especially as power demands increase beyond **30 kW** per cabinet [28][29] - **Reliability Measures**: The 2N configuration in data center power systems ensures high reliability, with a design that allows for 99.9% uptime even in dual power failure scenarios [30][31] This summary encapsulates the key points discussed in the conference call, highlighting Huawei's strategic direction in the data center and cooling technology sectors.