Core Insights - Broadcom anticipates selling at least 1 million 3D stacked chips by 2027, which could generate significant revenue, potentially worth billions of dollars [2][3] Product Development - The 1 million chip projection includes various designs beyond the initial Fujitsu chip, utilizing a stacking technology that enhances data flow speed and energy efficiency [3][4] - Broadcom's stacking technology allows customers to create chips with greater processing power while consuming less energy, addressing the increasing demands of AI applications [4] Market Position - Broadcom's AI chip revenue is expected to double year-over-year to $8.2 billion in its first fiscal quarter, positioning the company as a major competitor to Nvidia and AMD in the semiconductor market [6] - The company collaborates with tech giants like Google and OpenAI to develop custom AI chips, leveraging its engineering expertise to translate designs into manufacturable chips [5][6] Manufacturing Collaboration - Fujitsu is utilizing Broadcom's technology for a data center chip, with Taiwan Semiconductor Manufacturing Co (TSMC) fabricating the chip using advanced 2-nanometer and 5-nanometer processes [7] - Broadcom plans to release two additional products based on its stacking technology in the latter half of the year and aims to sample three more designs by 2027 [8]