Copper Clad Laminate (CCL)
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ABF 基板 - 将欣兴电子(Unimicron)和南亚 PCB(NYPCB)评级上调至超配-Global Technology -ABF Substrates – Upgrading Unimicron and NYPCB to OW
2026-02-24 14:16
February 22, 2026 09:00 PM GMT Global Technology ABF Substrates – Upgrading Unimicron and NYPCB to OW An AI-driven ABF substrate up-cycle will last to the end of the decade, driving growth to accelerate and margins to expand. The stocks have started to move, but this cycle will be much stronger and more sustainable – fueling multiple expansion. Key Takeaways Based on the fundamental backdrop above, these are the stock implications – it's not too late. We upgrade Unimicron to OW (from EW) and NYPCB to OW (fr ...
AI PCB:高频高速覆铜板及十大核心材料详解(附50页PPT)
材料汇· 2026-01-25 15:49
Core Viewpoint - The PCB industry is experiencing significant growth and transformation, driven by advancements in technology and increasing demand across various sectors, including telecommunications, consumer electronics, and automotive applications [9][10][18]. Group 1: PCB Classification - PCBs are classified based on material type, layer count, and structure, including ordinary boards, high-frequency boards, high-speed boards, single-sided boards, double-sided boards, multi-layer boards, rigid boards, flexible boards, rigid-flex boards, HDI boards, and packaging substrates [5][6][8][9]. - Ordinary boards are primarily made from FR4 copper-clad laminates and are widely used in various fields with lower signal integrity requirements [5]. - High-frequency boards require materials with stable dielectric properties and low loss factors, mainly used in wireless communication and automotive applications [5]. Group 2: PCB Industry Chain - The PCB industry chain consists of upstream raw materials, midstream manufacturing, and downstream applications, with raw materials including copper foil, wood pulp, electronic cloth, resins, and inks [10][11]. - The downstream applications of PCBs are extensive, covering communication devices, consumer electronics, computers, automotive electronics, industrial control, and medical devices [10][11]. Group 3: Market Trends and Forecasts - The global PCB market is projected to grow significantly, with a compound annual growth rate (CAGR) of 5.2% from 2024 to 2029, driven by increasing demand for high-density and high-performance PCBs [13][14]. - The Chinese PCB market is expected to recover, with a forecasted market size of approximately 4,333.21 billion yuan by 2025, following a decline in 2023 [18]. Group 4: Downstream Demand Growth - The demand for PCBs is increasing across various sectors, including telecommunications, where the shift to higher-speed products is evident, and in the server industry, where AI server demand is driving growth [18]. - In the automotive sector, the integration of electronics in vehicles is expected to increase, with automotive electronics projected to account for 49.6% of the total vehicle value by 2030 [18]. Group 5: Copper Foil as a Key Material - Copper foil is a critical raw material in PCB manufacturing, accounting for a significant portion of the cost structure, with its demand driven by the growth of high-end PCBs [32][34]. - The production process of copper foil involves several steps, including copper dissolution, foil manufacturing, surface treatment, and packaging [43]. Group 6: High-End Copper Foil Demand - The demand for high-end copper foil is increasing due to advancements in 5G communication and AI technologies, with a focus on low-profile copper foils for high-density applications [48][49]. - The global high-end copper foil market is largely dominated by foreign companies, but domestic firms are gradually entering the supply chain [49][50].
台湾 PCB 及覆铜板行业:AI GPUASIC 带动 AI 上行周期延续;首评联茂电子(EMC_TUC),给予买入评级-Taiwan PCB & Laminates_ Sustained AI Upcycle on AI GPU_ASIC; Initiate on EMC_TUC with Buy
2026-01-15 06:33
Summary of Taiwan PCB & Laminates Conference Call Industry Overview - The focus is on the copper clad laminate (CCL) sector, which is expected to see unit and average selling price (ASP) growth in 2026E [1] - The recent share price correction in the sector is viewed as healthy, as initial expectations for M9-grade CCL adoption were overly optimistic [1][3] - AI server production is anticipated to ramp up more aggressively in 2026 compared to 2025, driven by the launch of more AI ASICs [1][2] Core Insights - **AI Demand and Production Bottlenecks**: Despite concerns about an AI bubble, demand for AI servers is expected to remain strong in 2026 due to unresolved production bottlenecks in the AI supply chain [2][11] - **ASP Growth Drivers**: The CCL sector is expected to benefit from spec migration and price hikes on low-end products, with multiple favorable ASP trends anticipated from 2026E onward [3][31] - **Southeast Asia Capacity Expansion**: While there is ongoing capacity expansion in Southeast Asia (SEA), production efficiency is likely lower than expected, leading to a preference for Chinese capacity in the short term [4][11] Company-Specific Insights - **Initiation of Coverage**: Coverage has been initiated on EMC and TUC with target prices set at NT$2,100 and NT$600, respectively, reflecting strong growth potential in high-end CCL for AI applications [1] - **EMC and TUC Positioning**: EMC is recognized as a leading player in high-end CCL for AI GPU/ASIC, while TUC is noted for its strength in high-end networking applications [1][27] Market Dynamics - **AI as a Growth Driver**: AI-driven server and networking demand is projected to underpin structural growth in the PCB industry, with server and data storage PCB demand expected to grow at an ~11% CAGR from 2025 to 2029 [14][15] - **Material Shortages**: Key materials such as low dielectric constant (Dk) glass fiber and high-end HVLP copper foil are in significant shortage, impacting the competitive landscape of the CCL industry [32][61] Risks and Considerations - **Investment Risks**: Key risks include slower-than-expected AI server demand and challenges in CCL upgrades [4] - **Supply Chain Challenges**: The transition to higher-grade materials like HVLP4 copper foil may lead to supply bottlenecks, as upgrading production lines can take 1-2 years [62][63] Conclusion - The CCL sector is poised for growth driven by AI demand, with specific companies like EMC and TUC positioned to capitalize on this trend. However, challenges such as material shortages and production inefficiencies in SEA could impact overall market dynamics.
生益科技-覆铜板工厂调研:AI 产能扩张;2026 年上半年涨价趋势延续
2026-01-04 11:35
Summary of Shengyi Technology Conference Call Company Overview - **Company Name**: Shengyi Technology (600183.SS) - **Industry**: Copper Clad Laminate (CCL) and Printed Circuit Board (PCB) manufacturing - **Headquarters**: Dongguan, China - **Market Focus**: Consumer electronics, communication, automotive, and data center markets - **Revenue Breakdown**: CCL business accounted for 68% of total revenues in 1H25, followed by PCB business at 29% [3][4] Key Points CCL Price Trends - Shengyi has raised CCL prices multiple times in the past 3-6 months due to rising raw material costs, particularly fiberglass cloth, driven by the ramp-up of AI infrastructure [4] - Management expects the price hike trend to continue into 1H26E, influenced by sustained demand for AI PCBs and a slow response from upstream suppliers to expand capacity [4][8] Margin Improvement - Management is optimistic about margin expansion in the coming years, primarily due to a shift towards high-end CCL products for AI PCBs, which offer higher margins compared to mainstream CCL [4][8] - The product mix has been improving, with expectations for large-scale deliveries of high-end CCL for China CSPs and AI chip manufacturers starting in 2026E [8] Capacity Expansion Strategy - Shengyi plans a 5-year capacity expansion strategy, focusing on AI CCL capacity in the upcoming year, with gradual expansions thereafter based on market demand and supply dynamics [9] - The company has established production sites in Mainland China and overseas (including Thailand) to better serve global-tier clients amid geopolitical tensions [9] Market Dynamics - The demand for high-end CCL is rising not only in AI PCB applications but also in other sectors such as LEO satellites and flexible printed circuits (FPC) used in consumer and automotive electronics [8] - Management is closely monitoring market conditions to optimize the pace of new production line setups, aiming to avoid supply surplus while benefiting from fast capacity ramp-up [9] Competitive Landscape - Shennan Circuits (002916.SZ) is also expanding into AI PCB, having started mass production for AI accelerators and other advanced applications, which aligns with the positive outlook for high-end CCL shipments [2] Additional Insights - The ongoing transition towards AI technologies is expected to significantly influence the demand for high-end CCL, positioning Shengyi favorably in the market [4][8] - The company's proactive approach in capacity planning and product mix enhancement is likely to support its growth trajectory and margin improvement in the competitive landscape of the PCB industry [9]
生益科技:CCL 工厂调研;AI 与数据中心需求带动增长
2025-12-01 00:49
Summary of Shengyi Technology Conference Call Company Overview - **Company**: Shengyi Technology (600183.SS) - **Industry**: Copper Clad Laminate (CCL) manufacturing - **Headquarters**: Dongguan, China - **Key Markets**: Consumer electronics, communication, automotive, and data center markets - **Revenue Breakdown**: CCL business accounted for 68% of total revenues in 1H25, followed by PCB business at 29% [3][4] Key Points Discussed 1. 2026 Outlook - **CCL Pricing**: The company raised CCL pricing in October due to higher raw material costs and supply constraints - **Demand Forecast**: Management is optimistic about rising CCL demand from data center clients in 2026, despite pressures from ongoing raw material price increases - **Market Stability**: Demand from consumer electronics and automotive markets has remained stable, with expected growth from AI/data center sectors supported by high-end CCL capacity expansion [4][4] 2. CCL Capacity Expansion - **Expansion Plans**: Shengyi Technology is actively expanding its CCL capacity, with new production expected to start in Thailand from 1Q26 - **Construction Progress**: The company's 'construction in progress' reached Rmb1.9 billion by the end of 3Q25, up from Rmb470 million at the end of 3Q24 - **Timeline**: Capacity expansion typically takes 14 to 16 months, with Phase I requiring more time due to infrastructure development [8][8] 3. Raw Material Supply - **Price Increases**: Management highlighted recent price hikes in raw materials, particularly fiberglass cloth, which has seen tight supply affecting both thin and thick cloth - **Cost Pressures**: The rising costs and uncertainties in raw material supply could impact profitability, as Shengyi focuses on CCL products and relies on third-party suppliers [9][9] 4. Expanding Data Center Business - **Market Diversification**: Shengyi has diversified its end markets, expecting increased contributions from AI/computing products that offer higher margins - **Client Engagement**: The company is working with both local and global-tier clients on server and switch products, focusing on the verification of new generation products [10][10] 5. AI PCB Market Insights - **Positive Market Sentiment**: Comments from Shengyi management regarding strong CCL demand from the AI/data center market align with a positive outlook for the AI PCB market growth - **Competitor Insights**: Shennan Circuits (002916.SZ) is also targeting computer/networking applications, indicating a broader industry trend towards AI-related products [2][2] Additional Insights - **Investment in HDI**: Shengyi Electronics, a subsidiary, announced a private placement plan to invest Rmb2.6 billion in HDI for AI computing applications, indicating a strategic focus on high-demand technology sectors [8][8] This summary encapsulates the key discussions and insights from the conference call regarding Shengyi Technology's current position and future outlook in the CCL and data center markets.
建滔积层板:基于近期铜价走强及 A 股同行第三季度业绩,开启 30 天正面看涨期权策略
2025-10-13 01:00
Summary of Kingboard Laminates Holdings (1888.HK) Conference Call Company Overview - **Company**: Kingboard Laminates Holdings (KBL) - **Industry**: Copperclad laminate (CCL) production, primarily for printed circuit boards (PCBs) - **Market Position**: KBL holds approximately 17% global market share in rigid laminates and over 30% in the PRC [17][18] Key Points and Arguments 1. ASP Inflation and Copper Costs - KBL has increased the average selling price (ASP) of copperclad laminate by Rmb10/sheet (~7-8% increase) in mid-August due to rising copper costs, which have surged by ~12% to US$10.7k per tonne [1][11] - A further ASP inflation is anticipated in October, driven by ongoing copper cost increases and improved industry demand due to AI applications [2][16] 2. Utilization Rate (UTR) Improvement - KBL's UTR improved to ~88% in September with shipments of 10 million sheets, compared to an average of 79% in the first half of 2025 [1][3] - The overall CCL industry is experiencing improved demand/supply dynamics, with leading players like SYTECH and Shennan also operating at high capacity [2] 3. Monthly Shipment Growth - Monthly shipments of CCL increased by 8-9% YoY in 3Q25, indicating a consistent improvement in the overcapacity situation within the CCL industry [3] - The gross margin (GM) is expected to improve significantly in 2H25 compared to 1H25 due to higher UTR and ASP inflation [3] 4. Earnings Projections - KBL's net profit is projected to grow from HK$991 million in 2023 to HK$4.747 billion by 2027, with a core EPS growth forecast of 53.1% in 2025 [3][7] - The company is expected to achieve a core profit growth of 58% YoY in 2H25, driven by a low base from 2H24 and increasing UTR [10] 5. Market Dynamics and AI Influence - The demand for AI-related products is expected to boost the CCL sector, with major suppliers reducing production of non-AI CCL due to lower profitability [2][8] - KBL is on track to secure NVDA certification for its fiberglass in 4Q25, which could lead to further re-rating of the stock [1] 6. Valuation and Investment Strategy - KBL is rated as a "Buy" with a target price of HK$20.50, representing a potential upside of 62.4% from the current price of HK$12.62 [4][19] - The investment strategy anticipates a 3-year EPS CAGR of 52% through 2027, following a downturn in 2022-2023 [18] 7. Risks - Key risks include the pace of customer certification for AI-CCL materials, macroeconomic growth in China, and fluctuations in demand for electronic goods [20] Additional Important Information - The correlation between KBL's share price and copper costs is noted to be over 60%, indicating that fluctuations in copper prices significantly impact KBL's market performance [2][14] - The company is positioned to benefit from the ongoing AI boom, which is expected to enhance profitability across the CCL sector [2][8] This summary encapsulates the critical insights from the conference call regarding Kingboard Laminates Holdings, highlighting the company's strategic positioning, market dynamics, and financial outlook.