Core Viewpoint - The company is focusing on four core areas: mobile terminals, IoT, vehicle networking, and industrial networking, with a range of eSIM chip packaging products to meet diverse application needs [2] Group 1: Product Development - The company has launched consumer-grade, industrial-grade, and automotive-grade eSIM chip packaging products [2] - In the first half of 2025, the main products for IoT eSIM chip packaging will be in DFN and QFN formats [2] - A new product based on "ultra-thin plastic packaging technology" is expected to enter the verification stage this year, aiding in comprehensive coverage from low-end to high-end application scenarios [2] Group 2: Market Deployment - The company has initiated deployments in smart wearables, smart home, industrial equipment networking, and vehicle communication within the IoT sector [2] - Some products, such as consumer smart wearables, have entered the customer verification stage, indicating a positive market advancement rhythm [2] - This progress is expected to further enhance the company's overall competitiveness [2]