Core Viewpoint - SK Hynix has restructured its High Bandwidth Memory (HBM) development organization into two distinct teams: Custom HBM (C-HBM) for high-performance products tailored to key clients like NVIDIA, and Standard HBM (S-HBM) for general-purpose, large-scale supply products aimed at diverse AI and server customers [1][2][3] Group 1: Organizational Changes - The restructuring aims to enhance technical leadership and expand market share in the rapidly growing general HBM market [1][2] - The previous unified development team was deemed insufficient due to increasing product complexity, prompting the separation into specialized teams [1][2] - Both teams fall under the "Packaging Product Development Division," led by Vice President Lee Gyu-ji, with a focus on customer response and product design [1] Group 2: Market Strategy - C-HBM focuses on ultra-high-performance products with specific customizations for key clients, while S-HBM emphasizes generality, yield, and production efficiency for a broader market [2] - The dual-track strategy is intended to optimize responses to varying product requirements as the AI semiconductor market becomes more sophisticated [2][3] - SK Hynix aims to solidify its dominance in the AI storage market by mastering both high-value products and large-scale supply [2][3] Group 3: Technological Advancements - SK Hynix is accelerating the mass production of its sixth-generation HBM, HBM4, which features 12-layer stacking and can process over 2TB of data per second, representing a 60% speed increase over the previous generation [3] - The company has achieved over 50% market share in the global HBM market, positioning it as the leader and enhancing overall DRAM market competitiveness [3] - The establishment of dedicated development systems for C-HBM and S-HBM is expected to improve development speed and technical responsiveness [3]