IC封装用载体铜箔
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铜冠铜箔:目前在推进新产品的技术研发及产业化工作
Zheng Quan Ri Bao· 2026-02-02 11:40
Group 1 - The company, Tongguan Copper Foil, is developing a key material for IC packaging, specifically copper foil that plays a crucial role in electrical conductivity and signal transmission in IC packaging substrates [2] - This new generation of electronic information technology relies heavily on the copper foil being developed by the company [2] - The company is currently advancing the technical research and industrialization of this new product [2]
铜冠铜箔:IC封装用载体铜箔正在推进新产品的技术研发及产业化工作
Zheng Quan Ri Bao· 2026-02-02 10:16
Group 1 - The core viewpoint of the article is that the company, Tongguan Copper Foil, is actively advancing the research and development of new products, specifically copper foil used in IC packaging [2] Group 2 - The company is focusing on the technological development and industrialization of its new product offerings [2]