Financial Data and Key Metrics Changes - Consolidated revenue for fiscal year 2025 grew 24% year on year to a record $64 billion, driven by AI semiconductors and VMware [5] - Q4 total revenue was a record $18 billion, up 28% year on year, exceeding guidance due to better-than-expected growth in AI semiconductors and infrastructure software [6] - Q4 consolidated adjusted EBITDA reached a record $12.12 billion, up 34% year on year [6][12] - Gross margin for Q4 was 77.9% of revenue, better than guidance due to higher software revenues and product mix [12] - Free cash flow in Q4 was $7.5 billion, representing 41% of revenue [15] Business Line Data and Key Metrics Changes - Semiconductor revenue for Q4 was $11.1 billion, with year-on-year growth accelerating to 35%, driven by AI semiconductor revenue of $6.5 billion, which was up 74% year on year [6][14] - Infrastructure software revenue for Q4 was $6.9 billion, up 19% year on year, with total contract value booked exceeding $10.4 billion [10][14] - Non-AI semiconductor revenue for Q4 was $4.6 billion, up 2% year on year, with a forecast of approximately $4.1 billion for Q1, flat from a year ago [9][10] Market Data and Key Metrics Changes - AI networking demand is strong, with a current order backlog for AI switches exceeding $10 billion [8] - Total order backlog for AI components is over $73 billion, expected to be delivered over the next 18 months [9] - Infrastructure software backlog increased to $73 billion, up from $49 billion a year ago [10] Company Strategy and Development Direction - The company expects AI revenue to continue to accelerate and drive most of its growth, while non-AI semiconductor revenue is anticipated to remain stable [11] - Infrastructure software revenue is expected to grow at a low double-digit percentage, driven by VMware growth [11] - The company is focusing on advanced packaging capabilities in Singapore to address supply chain challenges [34][35] Management's Comments on Operating Environment and Future Outlook - Management noted that spending momentum for AI is expected to continue accelerating into 2026 [5] - There is a recognition of the challenges in the non-AI semiconductor market, with limited signs of recovery in enterprise spending [10][80] - Management expressed confidence in the ability to meet demand despite potential supply chain bottlenecks [74] Other Important Information - The company announced a 10% increase in its quarterly common stock cash dividend to $0.65 per share, marking the 15th consecutive increase since initiating dividends in fiscal 2011 [17] - The company has extended its share repurchase program, with $7.5 billion remaining through the end of calendar year 2026 [17] Q&A Session Summary Question: Clarification on AI backlog and customer-owned tooling - Management confirmed the $73 billion backlog for AI components and emphasized that bookings are expected to continue growing [22][23] - Management downplayed the notion of customers moving towards complete self-sufficiency in tooling, suggesting that custom AI accelerators will still be necessary [25] Question: Impact of TPU sales on market dynamics - Management indicated that TPU sales are primarily a substitution for GPUs and that moving to custom accelerators is a long-term strategic decision [28] Question: Supply chain resiliency and bottlenecks - Management acknowledged challenges in the supply chain but expressed confidence in their ability to manage and mitigate these issues through advanced packaging initiatives [74] Question: Expectations for AI revenue growth in fiscal 2026 - Management noted that while they expect AI revenue to continue accelerating, they refrained from providing specific guidance for the full year [50] Question: Clarification on OpenAI contract - Management confirmed that the OpenAI agreement is a multi-year journey and will not contribute significantly in 2026 [54][57] Question: Diversity of growth among existing customers - Management indicated that growth is well spread out among existing customers, with significant contributions from XPUs and related components [66]