Core Viewpoint - The company, Weilan Lithium, announced an investment of $83.88 million (approximately 603 million RMB) in an LED project in Malaysia to better serve overseas customers and expand its international market presence while addressing potential risks from international trade policy changes [1][2] Group 1: Project Details - The project will be implemented by Huai'an Optoelectronics, a subsidiary of Weilan Lithium, through a wholly-owned subsidiary established in Hong Kong and a new wholly-owned subsidiary in Malaysia [1] - Upon completion, the project is expected to achieve a monthly production capacity of 700KK chip testing and sorting as well as CSP chip packaging [1] Group 2: Business Operations - Weilan Lithium's LED business is primarily operated by Huai'an Optoelectronics, which engages in the research and manufacturing of LED products, covering a complete industrial chain from sapphire substrate processing to CSP special packaging [1] - The company has achieved industry-leading product performance in various applications, including Mini backlighting and high-power flip-chip backlighting, through continuous R&D investment [1] Group 3: Market Position and Strategy - Weilan Lithium has successfully entered the supply chain of major global customers in the MiniLED backlighting sector, gaining a leading market share [1] - Malaysia is identified as an attractive manufacturing investment destination due to its strategic location and mature electronic and electrical industry, making it the preferred choice for the company's overseas investments [2] - The company has prior investments in lithium battery projects in Malaysia, providing it with a better understanding of the local conditions for further project investments [2]

Core Viewpoint - The company announced an investment in an LED project in Malaysia, with a total investment of $83.88 million, aimed at establishing a new LED CSP project [1] Investment Details - The project will have a monthly production capacity of 700KK chip testing and sorting, as well as CSP chip packaging once fully operational [1] - Funding for the project will be sourced through self-raised funds [1]