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联瑞新材(688300.SH):应用于M9级高性能电子电路基板的球硅产品,已与行业主流厂商形成深度合作
Ge Long Hui· 2026-02-05 08:07
Core Viewpoint - The company has established deep collaborations with mainstream manufacturers in the industry for its ball silicon products used in M9-level high-performance electronic circuit substrates, and has initiated small batch sales [1] Group 1 - The company's Low α ball aluminum, a key filler for advanced packaging, is experiencing rapid sales growth and has become one of the few manufacturers capable of mass production of this material [1]