Vi e w p o i n t | 09 Jan 2026 08:02:58 ET │ 49 pages Taiwan Semiconductors AI Chip Testing - The Hidden Infrastructure Behind the Age of Advanced Packaging; Initiate on MPI at Buy/High Risk CITI'S TAKE Leading-edge advanced packaging has become essential for AI chips as system performance is now determined by interconnect, memory bandwidth, and power efficiency rather than transistor scaling alone. Advanced packaging enables large AI dies to overcome reticle limits, integrate multiple compute, I/O dies and ...