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Accelsius Demonstrates Strong Momentum in First Half of 2025 with 5x Growth in Data Center Deployments
Globenewswire· 2025-07-29 11:00
Core Insights - Accelsius has experienced significant growth in the first half of 2025, marked by a five-fold increase in data center deployments and expansion into international markets [1][5][9] - The company has achieved industry-leading thermal performance with its NeuCool technology, capable of cooling up to 4,500W per GPU socket, addressing the demands of next-generation AI workloads [2][4][10] - Accelsius has doubled its product portfolio, introducing the MR250 multi-rack Coolant Distribution Unit (CDU) to meet the growing needs of hyperscale and AI infrastructure [13][14] Industry Trends - The data center industry is undergoing a transformation due to the increasing demands of AI infrastructure, necessitating advanced cooling solutions [2][4] - Traditional cooling methods are becoming inadequate as rack densities approach 600kW configurations, highlighting the need for innovative technologies like those offered by Accelsius [2][4] Product and Technology Developments - Accelsius successfully demonstrated its cooling technology by maintaining GPU temperatures below NVIDIA's thermal throttle limits in a 250kW rack of AI servers [3][4] - The NeuGuard program was launched to enhance cooling reliability for AI and advanced computing deployments, offering coverage for internal damage caused by leaks [11][12] Strategic Partnerships and Market Expansion - The company has established key partnerships in Europe and entered the Canadian market, enhancing its international presence [5][8][9] - Collaborations with major players like Equinix and Nordik Data Centers are set to bolster Accelsius's market position and facilitate the development of next-generation AI data centers [7][8] Sustainability and Energy Efficiency - Accelsius's technology can operate with facility water temperatures 6-8°C higher than competitors, leading to over 25% cooling energy savings and supporting sustainability goals [4][10]
Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future
Globenewswire· 2025-05-22 11:00
Group 1: Project Overview - Accelsius has been selected as a key contributor to the U.S. Department of Energy's ARPA-E COOLERCHIPS project, focusing on developing a next-generation hybrid cooling architecture for data centers [1][3] - The project aims to reduce total cooling energy consumption to less than 5% of a data center's IT load while maintaining reliability and enabling high-density computing [3] Group 2: Technology and Contributions - Accelsius will provide its proprietary MR250, a multi-rack, in-row, 250kW two-phase Coolant Distribution Unit (2P CDU), for system-level testing at the UT Arlington campus [2] - The MR250 is expected to be generally available by late 2025, enhancing the project's test infrastructure [2] Group 3: Collaboration and Impact - The collaboration between Accelsius and The University of Texas at Arlington is expected to advance the understanding and benchmarking of two-phase, direct-to-chip cooling technologies [3][4] - Industry leaders express excitement about the potential impact of this collaboration on U.S. leadership in next-generation data center efficiency [4] Group 4: Company Background - Accelsius, founded by Innventure, Inc. (NASDAQ:INV), specializes in advanced cooling solutions that help data center and edge operators achieve business, financial, and sustainability goals [5] - The company's NeuCool platform offers best-in-class thermal efficiencies through a safe, two-phase liquid cooling system scalable from single racks to entire data centers [5]