Core Viewpoint - The rapid development of technologies such as wireless communication, autonomous driving, and system packaging has led to a sharp increase in the demand for high-frequency data transmission. Traditional low-frequency electromagnetic interference (EMI) shielding materials perform poorly at high frequencies and are often bulky and heavy, making them unsuitable for modern electronic devices. MXene materials are gaining attention due to their excellent conductivity and shielding effectiveness [1][6]. Group 1: MXene Materials and Their Mechanisms - MXene materials, a type of transition metal carbide, exhibit superior electromagnetic shielding capabilities through mechanisms of reflection and absorption. Their layered structure allows for multiple reflections and can be modified with external inclusions to enhance shielding effectiveness [1]. - The surface chemistry of MXene contributes to electromagnetic wave absorption through various polarization losses, particularly at GHz frequencies, where dipole polarization dominates [1]. Group 2: Challenges and Research Directions - The main challenges in applying MXene materials in high-frequency integrated circuits include structural design, enhanced material synthesis and composites, and optimization of forming processes to improve EMI shielding effectiveness [2][6]. - The upcoming 2025 Polymer Electromagnetic Composite Materials and Applications Forum will feature a presentation by Liu Feihua from Harbin Institute of Technology (Shenzhen) on optimizing MXene composite shielding materials for high-frequency integrated circuits [2]. Group 3: Industry Trends and Future Developments - As 5.5G/6G communication evolves towards the terahertz band, the demand for lightweight, flexible, and high-performance electromagnetic shielding materials is increasing. MXene materials are considered ideal candidates, but issues such as low mechanical strength and poor oxidation resistance limit their applications [6]. - The forum will address the current state and future development paths of high-frequency PCB materials, electromagnetic composite materials, and the integration of new materials in various applications, including AI servers and electric vehicles [9][12].