一场盛大的"半导体嘉年华"顺利举办！ 9月4日至6日，第十三届中国电子专用设备工业协会半导体设备年会、第十三届半导体设备与核心部件及材料展（CSEAC 2025）在无锡太湖国际博览中心 举办。本届大会以"做强中国芯，拥抱芯世界"为主题，集中呈现了半导体关键设备、支撑配套设备、核心部件、关键材料以及新兴材料等领域的最新研发 成果和创新进展。 先导集团展台聚焦半导体产业链布局，重点展示了旗下产业园企业的核心产品，工作人员向记者介绍了该公司在半导体领域的一系列布局与参展亮点。 上海证券报邱思雨摄 "CSEAC举办十多年来，搭建起我国半导体装备、零部件企业与制造企业合作推广的桥梁，为国产产品进入国内外产业链和全球采购体系创造了直观全面 的商机，成为客户与供应商对接、行业交流的友好平台。"中国电子专用设备工业协会相关负责人接受记者采访时表示。 多家企业携核心产品亮相 展会现场人头攒动，热度高涨。展会期间，中微公司正式发布六款半导体设备新品，覆盖等离子体刻蚀（Etch）、原子层沉积（ALD）及外延（EPI）等 多个关键工艺领域。 刻蚀设备方面，新一代极高深宽比等离子体刻蚀设备Primo UD-RIE®和专注于金属刻蚀的P ...

Core Viewpoint - The company has launched six new semiconductor equipment products, enhancing its capabilities in plasma etching, atomic layer deposition, and epitaxy, which supports its transformation into a high-end equipment platform company [2][6]. Group 1: Plasma Etching Technology - The company introduced two new products in the plasma etching sector, providing advanced and efficient solutions for high aspect ratio etching and metal etching [3]. - The new CCP capacitive high-energy plasma etching machine, PrimoUD-RIE®, features six single reaction chamber designs and offers higher ion bombardment energy, meeting stringent requirements for high aspect ratio etching while improving etching precision and production efficiency [3]. - Innovations in PrimoUD-RIE® include a dynamic edge impedance adjustment system that enhances the verticality of edge deep hole etching, significantly increasing the yield at the wafer edges [3]. Group 2: Metal Etching Equipment - The Primo Menova™ 12-inch ICP single-chamber etching equipment specializes in metal etching, particularly for Al lines and blocks, and is essential for the metallization process in wafer fabrication [4]. - This equipment excels in etching uniformity control, achieving high rates, high selectivity, and low substrate damage, while its efficient chamber cleaning process reduces contamination and extends operational time [4]. Group 3: Thin Film Deposition Technology - The company launched four new products in thin film deposition, including three atomic layer deposition products and one epitaxy product [5]. - The PreformaUniflash® metal gate series, which includes TiN, TiAl, and TaN products, meets the application needs for advanced logic and storage devices [5]. - This series features a unique dual reaction chamber design that allows for flexible configuration and achieves industry-leading production efficiency, along with advanced capabilities in film uniformity and contaminant control [5]. Group 4: Epitaxy Equipment - The PRIMIOEpita®RP, a dual-chamber reduced pressure epitaxy device, is noted for its compact design and flexibility, allowing for up to six reaction chambers [6]. - This equipment significantly reduces production costs and chemical consumption while maintaining high production efficiency, with advanced gas control and temperature regulation capabilities [6]. - The device is adaptable for various epitaxy processes across different semiconductor technologies, supporting the industry's shift towards more advanced nodes [6].