31 December 2025 | 8:10PM HKT Equity Research China PCB: Shengyi (600183.SS) CCL factory visit: AI capacity in expansion; Price hikes to continue in 1H26E We visited Shengyi Technology's (600183.SS, Not Covered) copper clad laminate (CCL) factory in Dongguan and talked to management on Dec 30. Shengyi is a local CCL supplier, expanding from consumer electronics, automotive to data center markets. Management expects the CCL price hike to continue in 2026E, given the rising demand from PCB clients and short s ...

Summary of Shengyi Technology Conference Call Company Overview - **Company**: Shengyi Technology (600183.SS) - **Industry**: Copper Clad Laminate (CCL) manufacturing - **Headquarters**: Dongguan, China - **Key Markets**: Consumer electronics, communication, automotive, and data center markets - **Revenue Breakdown**: CCL business accounted for 68% of total revenues in 1H25, followed by PCB business at 29% [3][4] Key Points Discussed 1. 2026 Outlook - **CCL Pricing**: The company raised CCL pricing in October due to higher raw material costs and supply constraints - **Demand Forecast**: Management is optimistic about rising CCL demand from data center clients in 2026, despite pressures from ongoing raw material price increases - **Market Stability**: Demand from consumer electronics and automotive markets has remained stable, with expected growth from AI/data center sectors supported by high-end CCL capacity expansion [4][4] 2. CCL Capacity Expansion - **Expansion Plans**: Shengyi Technology is actively expanding its CCL capacity, with new production expected to start in Thailand from 1Q26 - **Construction Progress**: The company's 'construction in progress' reached Rmb1.9 billion by the end of 3Q25, up from Rmb470 million at the end of 3Q24 - **Timeline**: Capacity expansion typically takes 14 to 16 months, with Phase I requiring more time due to infrastructure development [8][8] 3. Raw Material Supply - **Price Increases**: Management highlighted recent price hikes in raw materials, particularly fiberglass cloth, which has seen tight supply affecting both thin and thick cloth - **Cost Pressures**: The rising costs and uncertainties in raw material supply could impact profitability, as Shengyi focuses on CCL products and relies on third-party suppliers [9][9] 4. Expanding Data Center Business - **Market Diversification**: Shengyi has diversified its end markets, expecting increased contributions from AI/computing products that offer higher margins - **Client Engagement**: The company is working with both local and global-tier clients on server and switch products, focusing on the verification of new generation products [10][10] 5. AI PCB Market Insights - **Positive Market Sentiment**: Comments from Shengyi management regarding strong CCL demand from the AI/data center market align with a positive outlook for the AI PCB market growth - **Competitor Insights**: Shennan Circuits (002916.SZ) is also targeting computer/networking applications, indicating a broader industry trend towards AI-related products [2][2] Additional Insights - **Investment in HDI**: Shengyi Electronics, a subsidiary, announced a private placement plan to invest Rmb2.6 billion in HDI for AI computing applications, indicating a strategic focus on high-demand technology sectors [8][8] This summary encapsulates the key discussions and insights from the conference call regarding Shengyi Technology's current position and future outlook in the CCL and data center markets.

Core Insights - Aspocomp Group Plc has received approximately EUR 1.75 million in business development support from the EU's Just Transition Fund to enhance PCB manufacturing capacity at its Oulu plant [1][2]. Investment and Development - The support is part of a larger investment project valued at over EUR 10 million, aimed at increasing the throughput capacity of the Oulu plant by up to 50% [4]. - The investment will not only boost production capacity but also improve production quality and equipment usability, creating over 30 new jobs, primarily at the Oulu facility [4][5]. - The total project cost is EUR 5,840,569, with the EU grant covering EUR 1,752,170 for equipment investments and construction costs, with a portion paid in advance and the remainder based on incurred expenses [5]. Strategic Importance - The support reflects confidence from the ELY Centre and EU stakeholders in Aspocomp's potential to generate new jobs and establish itself as a significant PCB supplier in Europe [3]. - The investment aligns with Aspocomp's updated strategy announced in November, focusing on expanding the Oulu plant and increasing capacity to meet rising demand, particularly in the defense and semiconductor sectors [2][3]. Company Overview - Aspocomp specializes in PCB technology design, testing, and logistics services, serving various industries including telecommunications, automotive, and semiconductor testing [6][7]. - The company is headquartered in Espoo, with its manufacturing facility located in Oulu, a key technology hub in Finland [8].

Financial Information Release - Aspocomp Group Plc will publish its financial statements for 2025 on February 25, 2026, at around 9:00 a.m. Finnish time [1] - The interim reports for 2026 will be published on April 29, July 29, and October 28, 2026, at around 8:00 a.m. and 9:00 a.m. Finnish time [1] Silent Period - Aspocomp's silent period will commence 30 days prior to the publication of its financial information [2] Annual Report - The Annual Report for 2025 will be published in week 11 at the latest, containing the Financial Statements, the report of the Board of Directors, and the Auditor's Report [3] Annual General Meeting - The Annual General Meeting for 2026 is scheduled for April 29, 2026, at 10:00 a.m. Finnish time, with a notification deadline for agenda items set for January 30, 2026 [4] Company Overview - Aspocomp specializes in PCB technology design, testing, and logistics services throughout the product lifecycle, ensuring cost-effectiveness and reliable deliveries through its own production and international partner network [5] - The company serves customers in telecommunications, automotive, industrial electronics, and semiconductor testing, with most net sales generated from exports [6] - Aspocomp is headquartered in Espoo, Finland, with a production facility located in Oulu, a major technology hub [6]

Core Viewpoint - The report highlights the financial performance and operational strategies of Changzhou Aohong Electronics Co., Ltd. for the first half of 2025, showcasing steady revenue growth and strategic initiatives aimed at enhancing market competitiveness and expanding international presence [1][2]. Financial Performance - The company's revenue for the first half of 2025 reached approximately 673.74 million yuan, representing a 9.35% increase compared to the same period last year [2][6]. - The total profit amounted to approximately 88.78 million yuan, reflecting a 2.43% increase year-on-year [2][6]. - The net profit attributable to shareholders was approximately 80.75 million yuan, up by 3.16% from the previous year [2][6]. - The net cash flow from operating activities increased significantly by 48.87%, reaching approximately 173.93 million yuan [2][6]. Industry Overview - The company operates in the printed circuit board (PCB) manufacturing industry, which is characterized by high technical barriers and complex manufacturing processes [3][4]. - The global PCB market is projected to grow, with an estimated total output value of 73.57 billion USD in 2024, marking a 5.8% year-on-year increase [3][4]. - China remains the largest PCB production base globally, with a projected output value of approximately 41.21 billion USD in 2024, also reflecting a 9.0% increase [4]. Business Operations - The company focuses on the research, production, and sales of various types of PCBs, including single/double-sided boards, multilayer boards, and HDI boards, catering to diverse applications such as smart home devices, automotive electronics, and renewable energy [5][6]. - The production strategy combines in-house manufacturing with limited outsourcing, ensuring quality control and timely delivery [6][7]. Strategic Initiatives - The company has initiated a technology upgrade project for HDI production lines, aimed at enhancing production capacity and capabilities in high-end markets such as automotive electronics and aerospace [7][8]. - A new manufacturing facility in Thailand is under construction, expected to be completed by December 2025, which will support local procurement for core customers and facilitate market expansion [7][8]. - The company is integrating lean production and smart manufacturing technologies to optimize operations and improve efficiency [8][10]. Competitive Advantages - The company has established strong relationships with major clients across various sectors, enhancing customer loyalty and market penetration [10][12]. - A diversified product matrix allows the company to meet the "one-stop procurement" needs of customers, strengthening its competitive position in the PCB market [10][12].

Core Viewpoint - The semiconductor giant Huadian Co., Ltd. (stock code: 002463) with a market value of 80 billion yuan announced a potential investment of no more than 3.6 billion yuan for the future development needs of its wholly-owned subsidiary, Huangshi Hushi Electronics Co., Ltd. [1] Group 1: Company Overview - Huadian Co., Ltd. primarily engages in the manufacturing of printed circuit boards (PCBs), which are essential components for connecting and transmitting signals between electronic devices [2] - Huangshi Hushi, a wholly-owned subsidiary of Huadian, also specializes in PCB manufacturing and has seen significant growth, achieving a revenue of 2.929 billion yuan and a net profit of nearly 500 million yuan in 2024, representing year-on-year growth of 47.33% and 47.65%, respectively [2] Group 2: Investment and Market Context - The potential investment in Huangshi Hushi is currently in the stage of intention-based negotiations and has not yet resulted in a legally binding agreement, indicating significant uncertainty regarding its implementation [4] - Huangshi Economic and Technological Development Zone is the largest optical electronic information industry cluster in Hubei, excluding Wuhan, and has attracted numerous leading companies in the PCB sector [4][5] - The demand for AI-driven servers, data storage, and high-speed network infrastructure is expected to create growth opportunities for the industry, with Huadian planning to enhance its investment in key processes to improve capacity by the second half of 2025 [5]

Group 1: Market Overview - The global PCB market experienced fluctuating growth from 2016 to 2023, with a significant decline in 2023 due to the retreat of the home economy and global high inflation, resulting in a 15% year-on-year decrease in market value to $69.5 billion [1] - A recovery is expected in 2024, with the market projected to reach $72.97 billion, reflecting a year-on-year growth of 4.97% as terminal demand recovers and inventory levels normalize [1] Group 2: Production Landscape - China has become the largest PCB production base globally, surpassing Japan in 2006, with its production value maintaining around 50% of the global total from 2016 to 2023, increasing to nearly 55% by 2023 [4] - The shift of global electronic manufacturing capacity towards Asia, particularly mainland China, has established a new manufacturing center in the region [2] Group 3: Product Structure - Rigid boards remain the dominant product type in the global PCB market, with multi-layer boards accounting for approximately 38% and single/double-sided boards for about 11% in 2023, together making up nearly half of the market [6] Group 4: Application Areas - The primary application areas for PCBs include communication, computing, and automotive electronics, with communication and computing accounting for 31.8% and 30.7% of the market share, respectively, followed by automotive electronics at 13.1% in 2023 [10]