Core Insights - The domestic integrated circuit industry is entering a new development opportunity period, driven by steady growth in technology and production capacity, alongside strong policy support for domestic key materials [1][3] Industry Overview - The domestic integrated circuit key materials market is projected to reach CNY 258.96 billion by 2028, indicating significant market potential [3] - The market for front-end manufacturing materials is expected to reach CNY 185.38 billion by 2028, accounting for over 70% of the total key materials market, highlighting its role as the core driver of industry growth [3] Company Positioning - Hengkun New Materials occupies a key position in the industry with its core product, SOC materials, which are essential for the photolithography process in wafer manufacturing, aligning with high growth demand [3][4] - The demand for SOC materials is expected to rise due to the accelerated development of advanced storage chip industries, such as multi-layer stacked 3D NAND and DRAM processes at 18nm and below, leading to steady increases in production capacity and output [3] Strategic Direction - Hengkun New Materials plans to deepen its focus on the integrated circuit key materials sector, increasing investment in technology development and industrial layout, while enhancing product quality and core competitiveness [4] - The company aims to engage in customized development for clients, providing precise and comprehensive solutions for integrated circuit key materials [4] - Hengkun New Materials will also focus on collaborative development within the industry chain, working with upstream and downstream partners to build a secure and controllable supply chain system, contributing to the self-sufficiency and high-quality development of China's integrated circuit industry [4]