Core Viewpoint - The semiconductor materials market is experiencing a recovery driven by AI industry growth, replenishment of memory chips, and expansion of wafer fabs, with the market size in mainland China expected to grow from 97.9 billion yuan in 2023 to an estimated 101.1 billion yuan in 2024 [3]. Group 1: Wafer Industry - The transition to 12-inch wafers is becoming mainstream, while 8-inch wafers still hold significant application advantages. The industry is nearing the end of inventory destocking, and demand from end markets is expected to drive a gradual recovery in the wafer industry [4]. Group 2: Electronic Specialty Gases - Electronic specialty gases are widely used in the integrated circuit field, with a significant oligopoly market dominated by companies from Europe, the United States, and Japan. China's domestic production rate for electronic specialty gases was only 14% in 2020, with expectations to rise to 25% by 2025 [5]. Group 3: Photomasks - Photomasks are critical materials in microelectronics manufacturing, with substantial room for domestic substitution as Chinese manufacturers gradually overcome technological challenges [6]. Group 4: Photoresists - Photoresists, essential for lithography processes, are seeing gradual progress in domestic production, although China still relies heavily on imports for KrF/ArF/EUV photoresists [7]. Group 5: Wet Electronic Chemicals - The wet electronic chemicals sector faces high technical barriers and rapid product updates, with increased demand driven by the expansion of wafer fab capacities [8]. Group 6: CMP Materials - Chemical Mechanical Polishing (CMP) is a core technology in integrated circuit manufacturing, with significant room for domestic production in CMP materials, particularly in polishing liquids and pads, which account for over 80% of the CMP consumables market [9]. Group 7: Target Materials - The semiconductor manufacturing process has high purity requirements for sputtering target metals, with aluminum and titanium targets being predominant for mature processes, while copper and tantalum targets are preferred for advanced processes [10].