Group 1 - ACM Research, Inc. (NASDAQ:ACMR) has launched its first Ultra ECDP Electrochemical Deplating tool aimed at the wide bandgap compound semiconductor manufacturing market [1][4] - The Ultra ECDP tool is designed for electrochemical wafer-level gold etching, providing benefits such as smaller undercut, enhanced uniformity, and improved gold line appearance [2][3] - The tool features specialized processes for removing Au bumps, etching thin Au films, and deep-hole Au deplating, along with integrated pre-wet and cleaning chambers [3][5] Group 2 - The compound semiconductor market is experiencing growth driven by demand from sectors such as electric vehicles, 5G/6G communication, RF, and AI applications [4] - ACM Research, Inc. develops and sells a range of semiconductor process equipment, including cleaning, electroplating, and wafer-level packaging tools, supporting advanced semiconductor device manufacturing [6]

FREMONT, Calif., Sept. 17, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced the launch of its first Ultra ECDP Electrochemical Deplating (“Ultra ECDP”) tool specifically designed for wide bandgap compound semiconductor manufacturing. The Ultra ECDP tool is engineered for electrochemical wafer-level gold (Au) etching performed outside of the wafer pattern area a ...