Accessibility StatementSkip Navigation Press/Media Relations Contact:Maureen HartSenior Director, Corporate & Marketing CommunicationsTelephone: (978) 787-4266Email: [email protected] SOURCE Axcelis Technologies, Inc. WANT YOUR COMPANY'S NEWS FEATURED ON PRNEWSWIRE.COM? 440k+Newsrooms &Influencers 9k+Digital MediaOutlets 270k+JournalistsOpted In GET STARTED Also from this source BEVERLY, Mass., Oct. 22, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion imp ...

Summary of Axcelis and Vico Merger Conference Call Industry and Companies Involved - **Industry**: Semiconductor Equipment - **Companies**: Axcelis Technologies and Vico Core Points and Arguments 1. **Transformational Combination**: The merger aims to create a leading semiconductor equipment company, enhancing capabilities and resources for sustainable value creation for shareholders and stakeholders [4][5][6] 2. **Broader Product Portfolio**: The combined companies will offer a diverse product portfolio, optimizing synergies between ion implantation and annealing solutions, which are adjacent steps in semiconductor manufacturing [5][8] 3. **Market Expansion**: The merger is expected to expand the total addressable market opportunity to over $5 billion, leveraging growth in artificial intelligence and power solutions [10][11] 4. **R&D Investment**: The combined company will have over $230 million in pro forma R&D investment to accelerate innovation and meet evolving customer needs [8][18] 5. **Financial Profile**: The merger is projected to be accretive to non-GAAP EPS within the first year post-closing, with a strong financial profile and cash position [5][24] 6. **Cost Synergies**: Estimated run-rate cost synergies of $35 million within 24 months post-closing, primarily from operational efficiencies [23][24] 7. **Governance Structure**: The combined company will have a governance structure with a board comprising members from both companies, ensuring shared leadership [21][22] 8. **Geographic Diversification**: The merger will enhance geographic presence, leveraging strengths in key markets such as China, Korea, and Taiwan [11][12] Important but Overlooked Content 1. **Cultural Integration**: The companies emphasize shared cultures of respect and collaboration, which will be crucial for successful integration [20] 2. **Regulatory Approval**: The transaction is expected to close in the second half of 2026, subject to shareholder and regulatory approvals, with no anticipated regulatory hurdles due to the lack of overlap between the companies [22][65][66] 3. **Technological Overlap**: The merger will allow for leveraging complementary technologies, particularly in ion beam physics and advanced packaging, which are critical for meeting customer demands [29][30][31] 4. **Focus on Customer Needs**: The combined company aims to provide end-to-end support across the manufacturing process, enhancing customer relationships and service capabilities [20][41] This summary encapsulates the key points discussed during the conference call regarding the merger between Axcelis Technologies and Vico, highlighting the strategic rationale, expected benefits, and operational considerations.

Core Viewpoint - Axcelis Technologies and Veeco Instruments have announced a definitive agreement to merge in an all-stock transaction, creating a leading semiconductor equipment company with an enterprise value of approximately $4.4 billion based on recent share prices and outstanding debt [1][2]. Company Overview - The combined entity will serve diversified and expanding end markets, enhancing its operating profile and R&D capabilities, which are expected to drive innovation and customer solutions [2][4]. - The merger is projected to generate pro-forma revenue of $1.7 billion for Fiscal Year 2024, with a non-GAAP gross margin of 44% and adjusted EBITDA of $387 million [2][12]. Financial Structure - Veeco shareholders will receive 0.3575 Axcelis shares for each share they own, resulting in Axcelis shareholders owning approximately 58% and Veeco shareholders owning about 42% of the combined company [3]. - The combined company is expected to have over $900 million in pro-forma cash upon closing and anticipates annual run-rate cost synergies of $35 million within 24 months, with most achieved in the first year [12][24]. Strategic Rationale - The merger will increase the total addressable market to over $5 billion, particularly benefiting from trends in artificial intelligence and power solutions [5][12]. - The combined company will become the fourth largest U.S. wafer fabrication equipment supplier by revenue, diversifying its technology portfolio and market segments [5][6]. Governance and Leadership - The new Board will consist of 11 directors, with a majority from Axcelis, and Dr. Russell Low will serve as President and CEO [7][8]. - The headquarters will be located in Beverly, Massachusetts, and the company will adopt a new name and ticker symbol post-merger [8][9]. Timeline and Approvals - The transaction is expected to close in the second half of 2026, pending shareholder and regulatory approvals [9].

Core Insights - Axcelis Technologies, Inc. is a leading supplier of ion implantation solutions for the semiconductor industry, with over 45 years of experience in providing innovative, high-productivity solutions [1]. Company Overview - Axcelis is headquartered in Beverly, Massachusetts, and focuses on the design, manufacture, and life cycle support of ion implantation systems, which are critical in the integrated circuit manufacturing process [1]. Upcoming Investor Conferences - The company plans to participate in several investor conferences in September, including: - The Benchmark 2025 Tech, Media & Telecom Conference on September 4th at the New York Athletic Club [3]. - The Citi 2025 Global TMT Conference on September 5th at the New York Hilton Midtown [3]. - The B. Riley Securities Consumer & TMT Conference on September 10th at the Sofitel, New York [3].

Q2 Highlights: BEVERLY, Mass., Aug. 5, 2025 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS) today announced financial results for the second quarter ended June 30, 2025. Results Summary President and CEO Russell Low commented, "Axcelis delivered strong results in the second quarter despite the cyclical digestion period in many of our markets, demonstrating the value we provide our customers and the strength of our team. We are deepening customer engagement, expanding our footprint in high-value ap ...

Company Overview - Axcelis Technologies, Inc. is a leading supplier of ion implantation solutions for the semiconductor industry, with over 45 years of experience [1] - The company focuses on developing high-productivity solutions and providing complete life cycle support for ion implantation systems, which are critical in the integrated circuit manufacturing process [1] Upcoming Investor Conferences - Axcelis will participate in the KBCM Technology Leadership Forum on August 11th at Montage Deer Valley, Park City, UT [3] - The company will also attend the Jefferies Semiconductor, IT Hardware and Communications Technology Conference on August 26th at the Four Seasons Hotel, Chicago, IL [3] - Additionally, Axcelis is set to join the Evercore ISI 2025 Semiconductor, IT Hardware & Networking Conference on August 27th at the Omni Chicago, IL [3]

Core Viewpoint - Axcelis Technologies, Inc. is set to release its financial results for the second quarter of 2025 on August 5, 2025, before market opening [1] Group 1: Financial Results Announcement - The financial results will be discussed in a call scheduled for 8:30 a.m. ET on the same day [2] - The call will be accessible via webcast on Axcelis' Investors page [2] Group 2: Company Overview - Axcelis has been a key supplier of ion implantation solutions for the semiconductor industry for over 45 years [3] - The company focuses on developing enabling process applications through the design, manufacture, and life cycle support of ion implantation systems [3]

Core Insights - Axcelis Technologies, Inc. will sponsor the Advanced Semiconductor Manufacturing Conference (ASMC) from May 5-8, 2025, in Albany, New York, focusing on innovative strategies to address manufacturing challenges in the semiconductor industry [1] Group 1: Event Participation - Axcelis will present a session on "Contamination Free Manufacturing" on May 6, 2025, highlighting a case study on reducing particle contamination during low-energy boron implantation [2] - The presentation will be led by Dr. Phillip Geissbuhler, Staff Scientist at Axcelis, along with coauthors from both Axcelis and SK Hynix [2] Group 2: Technical Focus - The case study discusses new hardware implementation that reduces boron film buildup on beamline components, which is crucial for maintaining device yield by preventing particle contamination [2] - The new hardware enhances the ion beam angle of incidence, leading to improved self-sputtering of films and a significant reduction in film growth rate on surfaces near the wafer [2] Group 3: Company Background - Axcelis has over 45 years of experience in providing high-productivity solutions for the semiconductor industry, focusing on ion implantation systems, a critical step in integrated circuit manufacturing [3] - The company emphasizes its technical expertise in contamination control, developed through collaboration with leading device manufacturers [3]