证券代码：688049 证券简称：炬芯科技 公告编号：2024-046 炬芯科技股份有限公司 关于注销部分募集资金专项账户的公告 三、本次注销部分募集资金专项账户的情况 鉴于公司募投项目"研发中心建设项目"已按照计划建设完毕并达到可使用 状态，且该项目对应的募集资金专户中信银行股份有限公司珠海体育中心支行 （银行账号：8110901013201323380）的募集资金已全部使用完毕，为便于公司 资金账户管理，公司将该募集资金专户进行注销。 一、募集资金基本情况 根据中国证券监督管理委员会《关于同意炬芯科技股份有限公司首次公开发 行股票注册的批复》（证监许可〔2021〕3301 号），公司由主承销商申万宏源证 券承销保荐有限责任公司（以下简称"申万宏源承销保荐"、"保荐机构"）采 用余额包销方式，向社会公众公开发行人民币普通股（A 股）股票 3,050.00 万 股，发行价为每股人民币 42.98 元，共计募集资金 131,089.00 万元，坐扣承销 和保荐费用 9,042.09 万元（不含增值税）后的募集资金为 122,046.91 万元，已 由主承销商申万宏源承销保荐于 2021 年 11 月 24 日汇 ...

证券代码：688049 证券简称：炬芯科技 公告编号：2024-045 炬芯科技股份有限公司 (一) 实际募集资金金额和资金到账时间 根据中国证券监督管理委员会《关于同意炬芯科技股份有限公司首次公开发 行股票注册的批复》（证监许可〔2021〕3301 号），本公司由主承销商申万宏源 证券承销保荐有限责任公司（以下简称"申万宏源承销保荐"、"保荐机构"） 采用余额包销方式，向社会公众公开发行人民币普通股（A 股）股票 3,050.00 万 股，发行价为每股人民币 42.98 元，共计募集资金 131,089.00 万元，坐扣承销 和保荐费用 9,042.09 万元（不含增值税）后的募集资金为 122,046.91 万元，已 由主承销商申万宏源承销保荐于 2021 年 11 月 24 日汇入本公司募集资金监管账 户。另减除上网发行费、招股说明书印刷费、申报会计师费、律师费、评估费等 与发行权益性证券直接相关的新增外部费用 2,560.30 万元（不含增值税）后， 公司本次募集资金净额为 119,486.61 万元。上述募集资金到位情况业经天健会 计师事务所（特殊普通合伙）验证，并由其出具《验资报告》（天健验〔20 ...

证券代码：688049 证券简称：炬芯科技 公告编号：2024-044 炬芯科技股份有限公司 第二届监事会第十一次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 炬芯科技股份有限公司（以下简称"公司"）第二届监事会第十一次会议（以 下简称"本次会议"）于 2024 年 8 月 12 日以邮件方式发出通知，并于 2024 年 8 月 22 日以现场结合通讯的方式在公司会议室召开。本次会议履行定期监事会通知程 序，会议由监事会主席徐琛主持，本次会议应到监事 3 名，实到监事 3 名，符合 《中华人民共和国公司法》和《公司章程》的规定。 经出席本次会议的监事充分审议，一致同意形成以下决议： 1、审议通过《关于 2024 年半年度报告及其摘要的议案》。 监事会认为： 2024 年 8 月 26 日 （1）公司 2024 年半年度报告的编制符合法律、行政法规、公司章程、公司 内部管理制度的各项规定，公司严格按照上市公司财务制度规范运作，2024 年 半年度报告真实、全面地反映了本报告期的财务状况和经营成果。 （2）20 ...

[Glossary](index=4&type=section&id=%E7%AC%AC%E4%B8%80%E8%8A%82%20%E9%87%8A%E4%B9%89) [Company Profile and Key Financial Indicators](index=6&type=section&id=%E7%AC%AC%E4%BA%8C%E8%8A%82%20%E5%85%AC%E5%8F%B8%E7%AE%80%E4%BB%8B%E5%92%8C%E4%B8%BB%E8%A6%81%E8%B4%A2%E5%8A%A1%E6%8C%87%E6%A0%87) [Company Basic Information](index=6&type=section&id=%E4%B8%80%E3%80%81%20%E5%85%AC%E5%8F%B8%E5%9F%BA%E6%9C%AC%E6%83%85%E5%86%B5) This section provides Actions Technology Co., Ltd.'s basic business information, including names, legal representative, addresses, website, and contact details Company Basic Information | Item | Information | | :--- | :--- | | **Company Chinese Name** | 炬芯科技股份有限公司 | | **Company Chinese Abbreviation** | 炬芯科技 | | **Legal Representative** | ZHOU Zhengyu | | **Company Website** | www.actionstech.com | | **Email** | investor.relations@actionstech.com | [Key Accounting Data and Financial Indicators](index=7&type=section&id=%E5%85%AD%E3%80%81%20%E5%85%AC%E5%8F%B8%E4%B8%BB%E8%A6%81%E4%BC%9A%E8%AE%A1%E6%95%B0%E6%8D%AE%E5%92%8C%E8%B4%A2%E5%8A%A1%E6%8C%87%E6%A0%87) In H1 2024, the company achieved strong performance growth, with operating revenue up 27.90% and net profit attributable to parent up 65.73%, driven by market recovery and product mix optimization, leading to a 5.17 percentage point increase in gross margin to 46.46% and R&D investment reaching 35.73% of revenue Key Accounting Data | Key Accounting Data | Current Period (Jan-Jun) (Yuan) | Prior Year Period (Yuan) | YoY Change (%) | | :--- | :--- | :--- | :--- | | **Operating Revenue** | 280,495,954.97 | 219,302,109.21 | 27.90 | | **Net Profit Attributable to Shareholders** | 40,940,046.50 | 24,702,968.39 | 65.73 | | **Net Profit Attributable to Shareholders (Excl. Non-recurring)** | 23,275,473.85 | 16,007,269.25 | 45.41 | | **Net Cash Flow from Operating Activities** | 57,040,072.65 | 66,378,935.66 | -14.07 | Key Financial Indicators | Key Financial Indicators | Current Period (Jan-Jun) | Prior Year Period | Change | | :--- | :--- | :--- | :--- | | **Basic Earnings Per Share (Yuan/share)** | 0.28 | 0.17 | 64.71% | | **Weighted Average Return on Net Assets (%)** | 2.27 | 1.39 | Increased by 0.88 percentage points | | **R&D Investment as % of Operating Revenue (%)** | 35.73 | 33.76 | Increased by 1.97 percentage points | - Performance growth was primarily driven by the recovery in consumer electronics market demand, the company's proactive sales strategies, and significant growth in Bluetooth speaker SoC chips, low-latency high-fidelity wireless audio products, and edge AI processor chips. The increased sales proportion of high-margin products led to a **5.17 percentage point increase in comprehensive gross margin to 46.46%**[17](index=17&type=chunk) [Non-Recurring Gains and Losses Items and Amounts](index=8&type=section&id=%E5%85%AB%E3%80%81%20%E9%9D%9E%E7%BB%8F%E5%B8%B8%E6%80%A7%E6%8D%9F%E7%9B%8A%E9%A1%B9%E7%9B%AE%E5%92%8C%E9%87%91%E9%A2%9D) During the reporting period, the company's total non-recurring gains and losses amounted to **17.66 million Yuan**, primarily from fair value changes of financial assets (**11.16 million Yuan**) and government grants recognized in current profit or loss (**4.43 million Yuan**) Non-Recurring Gains and Losses Items | Non-Recurring Gains and Losses Item | Amount (Yuan) | | :--- | :--- | | Fair value changes from financial assets and liabilities held by non-financial enterprises | 11,164,707.17 | | Government grants recognized in current profit or loss | 4,434,352.84 | | Gains or losses on disposal of non-current assets | 15,766.02 | | **Total** | **17,664,572.65** | [Management Discussion and Analysis](index=9&type=section&id=%E7%AC%AC%E4%B8%89%E8%8A%82%20%E7%AE%A1%E7%90%86%E5%B1%82%E8%AE%A8%E8%AE%BA%E4%B8%8E%E5%88%86%E6%9E%90) [Industry and Main Business](index=9&type=section&id=%E4%B8%80%E3%80%81%20%E6%8A%A5%E5%91%8A%E6%9C%9F%E5%86%85%E5%85%AC%E5%8F%B8%E6%89%80%E5%B1%9E%E8%A1%8C%E4%B8%9A%E5%8F%8A%E4%B8%BB%E8%90%A5%E4%B8%9A%E5%8A%A1%E6%83%85%E5%86%B5%E8%AF%B4%E6%98%8E) The company is a Fabless designer specializing in low-power AIoT chips, focusing on mid-to-high-end smart audio SoC chips for Bluetooth speakers and smart wearables, leveraging technological accumulation to secure a stable industry position with major brands like Harman and Sony - The company's main business involves the R&D, design, and sales of mid-to-high-end smart audio SoC chips, focusing on wireless audio, smart wearables, and smart interaction in the AIoT sector[20](index=20&type=chunk) - Key product series include: Bluetooth audio SoC chips, edge AI processor chips, and portable audio/video SoC chips[21](index=21&type=chunk) - The company operates on a Fabless model, concentrating on chip R&D and design while outsourcing wafer manufacturing, packaging, and testing[25](index=25&type=chunk) - Industry trends indicate that Bluetooth technology innovation and edge AI development present growth opportunities, with SIG projecting **7.5 billion Bluetooth device shipments annually by 2028**, representing an **8% CAGR**[28](index=28&type=chunk) [Key Products and Market Position](index=10&type=section&id=1.%20%E4%B8%BB%E8%A6%81%E4%BA%A7%E5%93%81%E6%83%85%E5%86%B5) The company's core product lines demonstrate strong market performance, with Bluetooth speaker SoC chips becoming mainstream for top international brands, low-latency high-fidelity wireless audio SoC chips rapidly penetrating niche markets, smart wearable SoC chips adopted by multiple brands, and edge AI processor chips shipping in volume to leading audio brands - **Bluetooth speaker SoC chips** have become a mainstream industry supplier, achieving breakthroughs in the mid-to-high-end market, serving brands such as Harman, SONY, Anker Innovations, Xiaomi, and Logitech[31](index=31&type=chunk) - **Low-latency high-fidelity wireless audio SoC chips** cover wireless home theater, wireless microphone, and gaming headset markets, entering the supply chains of brands like SONY, Samsung, DJI, and RODE[32](index=32&type=chunk) - **Smart Bluetooth wearable SoC chips** are applied in multiple smartwatches, smart bands, and AR glasses products from Xiaomi, Honor, realme, and Nothing[32](index=32&type=chunk) - **Edge AI processor chips** have shipped in large volumes to international first-tier audio brand customers and continue to scale. The new generation dedicated audio DSP processing chip ATS361X has been adopted by international first-tier customers and is expected to enter mass production in the second half of the year[33](index=33&type=chunk) [Core Technologies and R&D Progress](index=17&type=section&id=%E4%BA%8C%E3%80%81%20%E6%A0%B8%E5%BF%83%E6%8A%80%E6%9C%AF%E4%B8%8E%E7%A0%94%E5%8F%91%E8%BF%9B%E5%B1%95) During the reporting period, R&D investment reached **100 million Yuan**, a **35.37% YoY increase**, representing **35.73% of revenue**, with successful development of a CPU, DSP, and NPU tri-core heterogeneous architecture for low-power edge computing, and multiple new products with in-memory computing NPU are taped out or in customer promotion, contributing to the company's **335 global patents** R&D Investment | R&D Investment | Current Period (10,000 Yuan) | Prior Year Period (10,000 Yuan) | Change (%) | | :--- | :--- | :--- | :--- | | **Expensed R&D Investment** | 10,022.55 | 7,403.55 | 35.37 | | **Total R&D Investment** | 10,022.55 | 7,403.55 | 35.37 | | **Total R&D Investment as % of Operating Revenue (%)** | 35.73 | 33.76 | Increased by 1.97 percentage points | - Successfully developed a tri-core heterogeneous architecture based on CPU, DSP, and NPU, utilizing SRAM-based Compute-in-Memory (CIM) technology to achieve high computing power at low power consumption[38](index=38&type=chunk)[39](index=39&type=chunk) - High-end Bluetooth speaker SoC chip ATS286X and low-latency high-fidelity wireless audio SoC chip ATS323X, both integrating in-memory computing NPU, have been taped out, passed internal verification, and are currently being promoted to customers[39](index=39&type=chunk) - As of June 30, 2024, the company holds a total of **335 patents globally**, including **299 invention patents**, **96 software copyrights**, and **90 integrated circuit layout designs**[42](index=42&type=chunk) [Core Competitiveness Analysis](index=23&type=section&id=%E4%B8%89%E3%80%81%20%E6%8A%A5%E5%91%8A%E6%9C%9F%E5%86%85%E6%A0%B8%E5%BF%83%E7%AB%9E%E4%BA%89%E5%8A%9B%E5%88%86%E6%9E%90) The company's core competitiveness stems from deep technological accumulation, comprehensive R&D capabilities, extensive audio quality optimization experience, a broad base of renowned brand customers, and sustained high R&D investment, positioning it as a leader in low-power, low-latency, high-fidelity audio technology with a robust intellectual property barrier - The company inherited the core assets of Actions Semiconductor, possessing a long history of technology, talent, and supply chain resource accumulation[49](index=49&type=chunk) - Extensive experience in achieving high-quality audio, independently mastering low-latency wireless communication protocols with end-to-end latency potentially below **10ms**, and ADC/DAC signal-to-noise ratios exceeding **112dB** and **120dB** respectively, placing it at an advanced industry level[51](index=51&type=chunk)[52](index=52&type=chunk) - Entered the supply chains of numerous well-known terminal brands (e.g., Harman, SONY, Xiaomi, Honor) and ODM/OEM manufacturers (e.g., Sannuo, Fenda, Tonly), establishing a strong customer barrier[31](index=31&type=chunk)[53](index=53&type=chunk) - Sustained high R&D investment, with R&D expenses accounting for **35.73% of revenue** during the reporting period, building a comprehensive intellectual property barrier[53](index=53&type=chunk) [Discussion and Analysis of Operations](index=24&type=section&id=%E5%9B%9B%E3%80%81%20%E7%BB%8F%E8%90%A5%E6%83%85%E5%86%B5%E7%9A%84%E8%AE%A8%E8%AE%BA%E4%B8%8E%E5%88%86%E6%9E%90) In H1 2024, the company achieved robust operational growth with main business revenue up **27.93%** and gross margin rising to **46.43%**, driven by Bluetooth speaker chip penetration, strong demand for low-latency high-fidelity audio, and increasing shipments of edge AI processor chips, while maintaining high R&D investment in low-power high-performance computing and wireless communication technologies - The company achieved robust operational growth, with main business revenue of **280 million Yuan**, a **27.93% YoY increase**; comprehensive gross margin reached **46.43%**, a **5.17 percentage point YoY increase**; and net profit attributable to parent was **40.94 million Yuan**, a **65.73% YoY increase**[55](index=55&type=chunk) - Sustained high R&D investment, with R&D expenses of **100 million Yuan** in the first half, a **35.37% YoY increase**, accounting for **35.73% of revenue**, focusing on low-power high-performance computing, wireless communication, and low-latency high-fidelity audio technologies[56](index=56&type=chunk) - Business expansion proceeded smoothly, with brand penetration steadily increasing. Bluetooth speaker chips are applied in Harman and SONY brands; low-latency high-fidelity products entered Samsung, DJI, and RODE supply chains; and smart watch chips rapidly gained traction in Honor and realme brands[57](index=57&type=chunk) [Risk Factors](index=26&type=section&id=%E4%BA%94%E3%80%81%20%E9%A3%8E%E9%99%A9%E5%9B%A0%E7%B4%A0) The company faces multi-faceted risks including core competitiveness (rapid technology iteration, R&D failure, IP leakage, talent loss), operational risks (performance volatility, high customer concentration, supply chain dependence), and other significant risks such as inventory impairment, industry cyclicality, international trade friction, and reliance on third-party technology licenses - **Core Competitiveness Risks**: Rapid technological upgrades and iterations, significant R&D investment with potential for failure, risks of core technology leakage, and risks of losing key technical talent[58](index=58&type=chunk)[59](index=59&type=chunk)[60](index=60&type=chunk)[61](index=61&type=chunk) - **Operational Risks**: Performance volatility influenced by industry cycles and macroeconomic conditions; relatively high customer concentration; and risks in raw material supply and outsourced processing due to the Fabless model[62](index=62&type=chunk)[63](index=63&type=chunk)[64](index=64&type=chunk) - **Other Significant Risks**: International trade frictions may impact supply chains and customer demand; R&D processes rely on third-party EDA tools and technical authorizations for a limited number of IPs[67](index=67&type=chunk)[69](index=69&type=chunk) [Corporate Governance](index=31&type=section&id=%E7%AC%AC%E5%9B%9B%E8%8A%82%20%E5%85%AC%E5%8F%B8%E6%B2%BB%E7%90%86) [Changes in Directors, Supervisors, Senior Management, and Core Technical Personnel](index=31&type=section&id=%E4%BA%8C%E3%80%81%20%E5%85%AC%E5%8F%B8%E8%91%A3%E4%BA%8B%E3%80%81%E7%9B%91%E4%BA%8B%E3%80%81%E9%AB%98%E7%BA%A7%E7%AE%A1%E7%90%86%E4%BA%BA%E5%91%98%E5%92%8C%E6%A0%B8%E5%BF%83%E6%8A%80%E6%9C%AF%E4%BA%BA%E5%91%98%E5%8F%98%E5%8A%A8%E6%83%85%E5%86%B5) During the reporting period, the company's senior management team experienced changes, with former Deputy General Manager Mr. LIU SHUWEI resigning for personal reasons - Former Deputy General Manager Mr. LIU SHUWEI resigned during the reporting period due to personal reasons[83](index=83&type=chunk)[84](index=84&type=chunk) [Equity Incentive Plan](index=32&type=section&id=%E5%9B%9B%E3%80%81%20%E5%85%AC%E5%8F%B8%E8%82%A1%E6%9D%83%E6%BF%80%E5%8A%B1%E8%AE%A1%E5%88%92%E3%80%81%E5%91%98%E5%B7%A5%E6%8C%81%E8%82%A1%E8%AE%A1%E5%88%92%E6%88%96%E5%85%B6%E4%BB%96%E5%91%98%E5%B7%A5%E6%BF%80%E5%8A%B1%E6%8E%AA%E6%96%BD%E7%9A%84%E6%83%85%E5%86%B5%E5%8F%8A%E5%85%B6%E5%BD%B1%E5%93%8D) To further improve its long-term incentive mechanism, the company's Board of Directors and Supervisory Committee approved the '2024 Restricted Stock Incentive Plan (Draft)' and its summary on June 21, 2024 - On June 21, 2024, the company's Board of Directors approved the '2024 Restricted Stock Incentive Plan (Draft)'[85](index=85&type=chunk) [Environmental and Social Responsibility](index=33&type=section&id=%E7%AC%AC%E4%BA%94%E8%8A%82%20%E7%8E%AF%E5%A2%83%E4%B8%8E%E7%A4%BE%E4%BC%9A%E8%B4%A3%E4%BB%BB) [Environmental Information](index=33&type=section&id=%E4%B8%80%E3%80%81%20%E7%8E%AF%E5%A2%83%E4%BF%A1%E6%81%AF%E6%83%85%E5%86%B5) As an integrated circuit design company, the company is not a major polluter, emphasizes environmental protection, promotes energy-saving office practices, and leverages its technology to offer a light energy harvesting battery-free Bluetooth voice remote control solution based on the ATB111X chip, embodying a low-carbon environmental philosophy - The company's main business is chip design, not direct manufacturing, and it is not listed as a key polluting entity[87](index=87&type=chunk) - To implement its low-carbon philosophy, the company launched a light energy harvesting battery-free Bluetooth voice remote control solution based on the ATB111X chip[89](index=89&type=chunk) [Significant Matters](index=34&type=section&id=%E7%AC%AC%E5%85%AD%E8%8A%82%20%E9%87%8D%E8%A6%81%E4%BA%8B%E9%A1%B9) [Fulfillment of Commitments](index=34&type=section&id=%E4%B8%80%E3%80%81%20%E6%89%BF%E8%AF%BA%E4%BA%8B%E9%A1%B9%E5%B1%A5%E8%A1%8C%E6%83%85%E5%86%B5) During the reporting period, the company, its actual controller, shareholders, and directors, supervisors, and senior management strictly adhered to all commitments made during the initial public offering, including share lock-up, holding intentions, share price stabilization, related-party transactions, and non-compete clauses, with no breaches observed - Controlling shareholder Zhuhai Ruisheng Investment Partnership (Limited Partnership) committed not to transfer pre-IPO shares within **42 months** from the company's listing date[90](index=90&type=chunk) - The actual controller committed not to transfer pre-IPO shares within **36 months** from the company's listing date, with additional conditions regarding reduction price and extended lock-up period[91](index=91&type=chunk) - The company, controlling shareholder, actual controller, and directors, supervisors, and senior management all made commitments regarding share price stabilization, repurchase of shares due to fraudulent issuance, and compensation for diluted immediate returns, all of which are being strictly fulfilled[96](index=96&type=chunk)[98](index=98&type=chunk)[100](index=100&type=chunk) [Significant Contracts and Their Performance](index=49&type=section&id=%E5%8D%81%E4%B8%80%E3%80%81%20%E9%87%8D%E5%A4%A7%E5%90%88%E5%90%8C%E5%8F%8A%E5%85%B6%E5%B1%A5%E8%A1%8C%E6%83%85%E5%86%B5) During the reporting period, to support the business development of its wholly-owned subsidiary Hefei Actions, the company provided a joint and several liability guarantee of up to **50 million Yuan** for its wafer foundry payment obligations Guarantees Provided | Guarantor | Guaranteed Party | Guarantee Amount (10,000 Yuan) | Guarantee Period | | :--- | :--- | :--- | :--- | | Actions Technology | Hefei Actions | 5,000 | 2024-05-01 to 2027-04-30 | [Explanation of Proceeds Utilization Progress](index=51&type=section&id=%E5%8D%81%E4%BA%8C%E3%80%81%20%E5%8B%9F%E9%9B%86%E8%B5%84%E9%87%91%E4%BD%BF%E7%94%A8%E8%BF%9B%E5%B1%95%E8%AF%B4%E6%98%8E) The company's net proceeds from its IPO amounted to **1.195 billion Yuan**, with **596 million Yuan** cumulatively invested by the end of the reporting period, representing a **49.84%** progress, primarily for smart Bluetooth audio chip upgrades, ultra-low-power MCU R&D, R&D center construction, and working capital, including **32.26 million Yuan** used for share repurchases from over-raised funds Proceeds Utilization Summary | Proceeds Utilization | Amount (10,000 Yuan) | | :--- | :--- | | **Net Proceeds** | 119,486.61 | | **Total Over-raised Funds** | 84,332.79 | | **Cumulative Investment as of Reporting Period End** | 59,553.42 | | **Cumulative Investment Progress (%)** | 49.84 | - As of June 30, 2024, the company cumulatively repurchased **1,317,978 shares** using over-raised funds, with a total payment of **32.26 million Yuan**[126](index=126&type=chunk) - The company used part of the over-raised funds to increase investment in the 'Smart Bluetooth Audio Chip Upgrade and Industrialization Project' and the 'Ultra-Low-Power MCU R&D and Industrialization Project for Wearables and IoT,' extending the estimated ready-for-use date for these projects to December 2025[126](index=126&type=chunk) [Share Changes and Shareholder Information](index=56&type=section&id=%E7%AC%AC%E4%B8%83%E8%8A%82%20%E8%82%A1%E4%BB%BD%E5%8F%98%E5%8A%A8%E5%8F%8A%E8%82%A1%E4%B8%9C%E6%83%85%E5%86%B5) [Changes in Share Capital](index=56&type=section&id=%E4%B8%80%E3%80%81%20%E8%82%A1%E6%9C%AC%E5%8F%98%E5%8A%A8%E6%83%85%E5%86%B5) During the reporting period, the company implemented its 2023 profit distribution and capital reserve capitalization plan, converting capital reserves into shares at a rate of **2 shares for every 10 shares** held by all shareholders, increasing the total share capital from **122 million shares to 146 million shares** - The company implemented a capital reserve capitalization plan, converting **2 shares for every 10 shares**, totaling **24,136,404 new shares**[130](index=130&type=chunk) - Following the capitalization, the company's total share capital increased from **122,000,000 shares to 146,136,404 shares**[129](index=129&type=chunk)[130](index=130&type=chunk) [Shareholder Information](index=57&type=section&id=%E4%BA%8C%E3%80%81%20%E8%82%A1%E4%B8%9C%E6%83%85%E5%86%B5) As of the end of the reporting period, the company had **11,719 common shareholders**, with the top two being Zhuhai Ruisheng Investment Partnership (Limited Partnership) and Xiamen Jujiawei Investment Partnership (Limited Partnership), holding **23.18%** and **2.43%** respectively - As of the end of the reporting period, the company had a total of **11,719 common shareholders**[132](index=132&type=chunk) Top Five Shareholders | Top Five Shareholders | Shares Held at Period End | Proportion (%) | | :--- | :--- | :--- | | Zhuhai Ruisheng Investment Partnership (Limited Partnership) | 33,868,320 | 23.18 | | Xiamen Jujiawei Investment Partnership (Limited Partnership) | 3,554,861 | 2.43 | | Zhuhai Chenyou Investment Partnership (Limited Partnership) | 3,469,200 | 2.37 | | Xiamen Jushangyi Investment Partnership (Limited Partnership) | 3,341,404 | 2.29 | | Xiamen Jushangji Investment Partnership (Limited Partnership) | 3,225,400 | 2.21 | [Preferred Shares Information](index=60&type=section&id=%E7%AC%AC%E5%85%AB%E8%8A%82%20%E4%BC%98%E5%85%88%E8%82%A1%E7%9B%B8%E5%85%B3%E6%83%85%E5%86%B5) During the reporting period, the company had no preferred shares - During the reporting period, the company had no preferred shares[138](index=138&type=chunk) [Bonds Information](index=60&type=section&id=%E7%AC%AC%E4%B9%9D%E8%8A%82%20%E5%80%BA%E5%88%B8%E7%9B%B8%E5%85%B3%E6%83%85%E5%86%B5) During the reporting period, the company had no corporate bonds, enterprise bonds, non-financial enterprise debt financing instruments, or convertible bonds - During the reporting period, the company had no corporate bonds, enterprise bonds, non-financial enterprise debt financing instruments, or convertible bonds[138](index=138&type=chunk)[139](index=139&type=chunk) [Financial Report](index=61&type=section&id=%E7%AC%AC%E5%8D%81%E8%8A%82%20%E8%B4%A2%E5%8A%A1%E6%8A%A5%E5%91%8A) [Financial Statements](index=61&type=section&id=%E4%BA%8C%E3%80%81%20%E8%B4%A2%E5%8A%A1%E6%8A%A5%E8%A1%A8) This section presents the company's unaudited consolidated and parent company financial statements for H1 2024, including the balance sheet, income statement, cash flow statement, and statement of changes in equity, showing total assets grew to **1.946 billion Yuan**, net profit attributable to parent was **40.94 million Yuan**, and net cash flow from operating activities was **57.04 million Yuan** Consolidated Balance Sheet Summary (2024-06-30) | Item | Amount (Yuan) | | :--- | :--- | | **Total Assets** | 1,946,304,750.48 | | **Total Liabilities** | 149,979,687.28 | | **Equity Attributable to Owners of the Parent** | 1,796,325,063.20 | Consolidated Income Statement Summary (Jan-Jun 2024) | Item | Amount (Yuan) | | :--- | :--- | | **Total Operating Revenue** | 280,495,954.97 | | **Total Operating Costs** | 260,863,420.06 | | **Total Profit** | 41,059,295.07 | | **Net Profit** | 40,940,046.50 | Consolidated Cash Flow Statement Summary (Jan-Jun 2024) | Item | Amount (Yuan) | | :--- | :--- | | **Net Cash Flow from Operating Activities** | 57,040,072.65 | | **Net Cash Flow from Investing Activities** | 29,999,856.45 | | **Net Cash Flow from Financing Activities** | -56,193,840.00 | | **Net Increase in Cash and Cash Equivalents** | 31,589,435.46 | [Notes to Consolidated Financial Statements](index=94&type=section&id=%E4%B8%83%E3%80%81%20%E5%90%88%E5%B9%B6%E8%B4%A2%E5%8A%A1%E6%8A%A5%E8%A1%A8%E9%A1%B9%E7%9B%AE%E6%B3%A8%E9%87%8A) This section details key items in the consolidated financial statements, showing operating revenue primarily from Bluetooth audio SoC chips (**approximately 74% of main business revenue**), R&D expenses increased by **35.37%** mainly for staff salaries, depreciation, and direct inputs, and the top five accounts receivable customers accounted for **83.45%** of the total, indicating customer concentration, with non-recurring gains and losses mainly from fair value changes of financial assets and government grants Operating Revenue by Product Type Decomposition (Jan-Jun 2024) | Product Type | Operating Revenue (Yuan) | | :--- | :--- | | Bluetooth Audio SoC Chips | 207,364,854.62 | | Portable Audio/Video SoC Chips | 42,211,215.22 | | Edge AI Processor Chips | 30,721,470.80 | | Other | 198,414.33 | | **Total** | **280,495,954.97** | R&D Expense Composition (Jan-Jun 2024) | Item | Current Period Amount (Yuan) | | :--- | :--- | | Staff Remuneration | 55,936,016.03 | | Depreciation and Amortization | 13,902,504.11 | | Direct Input | 16,247,634.57 | | Commissioned Research Fees | 10,696,913.11 | | Other | 3,442,474.13 | | **Total** | **100,225,541.95** | - As of the end of the period, the top five accounts receivable balances, grouped by debtor, collectively accounted for **83.45%** of the total[222](index=222&type=chunk)

Group 1: Company Overview - Juchip Technology is a leading low-power AIoT chip design manufacturer in China, focusing on integrated chips for wireless audio, smart wearables, and intelligent interaction in the AIoT field [3] - The company's products are widely used in Bluetooth speakers, smartwatches, wireless home theaters, wireless gaming headsets, wireless microphones, Bluetooth headsets, and low-power edge AI processors [3] Group 2: Financial Performance - For the first half of 2024, the company expects to achieve a revenue of 280 million CNY, representing a year-on-year growth of 27.68% [3] - The projected net profit attributable to the parent company is 40.7 million CNY, with a year-on-year increase of 64.76% [3] - The net profit after deducting non-recurring gains and losses is expected to be 23 million CNY, reflecting a growth of 43.68% year-on-year [3] Group 3: Product Development and Market Strategy - The company is advancing its AI chip development, focusing on a CPU+DSP+NPU architecture for edge computing, which enhances AI capabilities while maintaining low power consumption [3] - The latest generation of AI audio SoC chips, based on 22nm process technology, has been sampled to downstream partners, promising improved performance and higher pricing compared to existing products [3] - The company aims to deepen its relationships with high-end brand clients, expecting significant sales growth from major clients like Harman and Sony [4] Group 4: Market Trends and Future Outlook - The consumer electronics market is showing signs of recovery, with many attractive terminal products emerging, which is expected to further drive market growth [4] - The main growth drivers for the company in 2024 are anticipated to be Bluetooth speaker SoC chips, smart watch SoC chips, and low-latency high-quality audio SoC chips [4] - The company plans to balance its market development between domestic and international clients, focusing on partnerships with brands like Xiaomi, Honor, and others [4] Group 5: Wireless Audio Products - The low-latency high-quality wireless audio products are primarily used in wireless home theater systems, gaming headsets, and microphones, with a clear market shift from wired to wireless products [5] - The company’s products can achieve latency as low as 10 milliseconds, utilizing advanced RF design and anti-interference technologies, positioning them at the forefront of the industry [5] - Current clients for these products include major brands such as Samsung, Sony, and DJI, showcasing strong market performance [5]

证券代码：688049 证券简称：炬芯科技 公告编号：2024-043 炬芯科技股份有限公司 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2023/8/24 | | --- | --- | | 回购方案实施期限 | 董事会审议通过后 12 个月内 | | 预计回购金额 | 2,650 万元~5,300 万元 | | 回购价格上限 | 35.67 元/股 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 实际回购股数 | 131.7978 万股 | | 实际回购股数占总股本比例 | 0.902% | | 实际回购金额 | 3,224.69 万元 | | 实际回购价格区间 | 19.79 元/股~34.99 元/股 | （二）截止本公告披露日，公司完成回购，已实际回购公司股份 1,317,978 股， 占公司总股本的 0.902%，回购最高价格 34.99 元 ...

Financial Performance - The company expects to achieve a net profit attributable to shareholders of 40.70 million yuan for the first half of 2024, representing a year-on-year increase of 64.76%[2] - The estimated operating income for the first half of 2024 is 280 million yuan, which is a 27.68% increase compared to the same period last year[21] - The net profit attributable to shareholders after deducting non-recurring gains and losses is projected to be 23 million yuan, reflecting a year-on-year growth of 43.68%[15] - The company anticipates achieving a record high quarterly revenue of 161 million yuan in the second quarter of 2024[4] Research and Development - Research and development expenses are expected to reach approximately 100 million yuan, marking a year-on-year increase of 35.07%[10] Gross Margin and Sales Strategy - The overall gross margin is projected to improve to around 46.40%, an increase of 5.2 percentage points year-on-year[23] - The company remains focused on market demand and technological trends, implementing proactive sales strategies to drive steady revenue growth[9] Product Expansion and Market Diversification - The company has successfully expanded its product offerings, particularly in the Bluetooth speaker SoC chip series, which has gained traction among leading audio clients[17] - The company is actively exploring diversified markets, with significant sales growth in low-latency, high-quality wireless audio products[17] Performance Forecast - The performance forecast is based on preliminary calculations by the finance department and has not yet been audited by registered accountants[18]

关于向激励对象首次授予2024年限制性股票的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 限制性股票首次授予日：2024年7月8日 限制性股票授予数量：260.00万股，占目前公司股本总额14,613.6404万股的 1.78%。 股权激励方式：第二类限制性股票 限制性股票首次授予价格：14.00元/股及20.50元/股 《炬芯科技股份有限公司2024年限制性股票激励计划（草案）》（以下简称"本次 激励计划"或"《激励计划》"）规定的炬芯科技股份有限公司（以下简称"公司"） 2024年限制性股票授予条件已经成就，根据公司2024年第二次临时股东大会授权，公 司于2024年7月8日召开的第二届董事会第十二次会议、第二届监事会第十次会议，审 议通过了《关于向激励对象首次授予2024年限制性股票的议案》，确定2024年7月8日为 本次激励计划的首次授予日，以14.00元/股及20.50元/股的授予价格向123名激励对 象授予260.00万股限制性股票。现将有关事项说明如下： 证券代码：688049 证券简 ...

第二届董事会第十二次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 炬芯科技股份有限公司（以下简称"公司"）第二届董事会第十二次会议于 2024 年 7 月 8 日以通讯表决方式召开。经全体董事同意，一致豁免本次董事会 会议通知的期限要求，并已在董事会会议上就豁免通知时限的相关情况做出说明。 会议由半数以上董事共同推举董事长周正宇先生主持，本次会议应到董事 7 名， 实到董事 7 名，公司监事及高级管理人员列席了本次会议，符合《中华人民共和 国公司法》和公司章程的规定。 经与会董事充分审议，一致达成以下决议： 1、审议通过《关于向激励对象首次授予 2024 年限制性股票的议案》。 证券代码：688049 证券简称：炬芯科技 公告编号：2024-039 炬芯科技股份有限公司 具体内容详见公司同日披露于上海证券交易所网站（www.sse.com.cn）的《关 于向激励对象首次授予 2024 年限制性股票的公告》。 董事会认为：根据《上市公司股权激励管理办法》《炬芯科技股份有限公司 2024 年限制性股票激励计划（ ...

上海市徐汇区淮海中路 1010 号嘉华中心 45 层 邮政编码 200031 电话： (86-21) 5404 9930 传真： (86-10) 5404 9931 关于炬芯科技股份有限公司 4、炬芯科技保证已经提供了本所律师认为出具本法律意见书所必需的、真 实的原始书面材料、副本材料或其他口头材料；炬芯科技还保证上述文件真实、 准确、完整，文件上所有签字与印章真实，复印件与原件一致，且无隐瞒、虚假 和重大遗漏之处；本所对本法律意见书所涉及的有关事实的了解和判断，最终依 赖于公司向本所提供的文件、资料及所作之说明的真实性、合法性、完整性、准 确性和有效性； 5、对于出具本法律意见书至关重要而又无法得到独立证据支持的事实，本 所律师依赖有关政府部门、公司或其他有关单位出具的证明文件及主管部门公开 可查的信息作为制作本法律意见书的依据； 2024 年限制性股票激励计划首次授予相关事项的法律意见书 致：炬芯科技股份有限公司 北京市竞天公诚律师事务所上海分所（以下简称"本所"）接受炬芯科技股份 有限公司（以下简称"公司"或"炬芯科技"）的委托，就炬芯科技2024年限制性股 票激励计划（以下简称"本次激励计划"）相关事 ...