会议召开时间：2023 年 10 月 09 日(星期一)下午 13:00-14:00 会议 召开地点： 上海证券 交易所 上证路演 中心（ 网址 ： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 证券代码：688458 证券简称：美芯晟 公告编号：2023-014 美芯晟科技（北京）股份有限公司 关于召开 2023 年半年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 投资者可于 2023 年 09 月 22 日(星期五)至 09 月 28 日(星期 四)16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或通 过公司邮箱 IR@maxictech.com 进行提问。公司将在说明会上对投资 者普遍关注的问题进行回答。 美芯晟科技（北京）股份有限公司（以下简称"公司"）已于 2023 年 8 月 30 日发布公司 2023 年半年度报告，为便于广大投资者更全面 深入地了解公司 2023 年半年度经营成果、财务状况，公司计划于 2023 ...

证券代码：688458 证券简称：美芯晟 公告编号：2023-013 美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2023 年 9 月 15 日 （二） 股东大会召开的地点：北京市海淀区天工大厦 A 座三层会议中心 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 31 | | --- | --- | | 普通股股东人数 | 31 | | 2、出席会议的股东所持有的表决权数量 | 57,539,945 | | 普通股股东所持有表决权数量 | 57,539,945 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的 | 71.9159 | | 比例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例 | 71.9159 | | （%） | | ...

北京市建国门北大街 8 号华润大厦 20 层 邮编：100005 电话：(86-10) 85191300 传真：(86-10) 85191350 junhebj@junhe.com 北京市君合律师事务所 关于美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会的法律意见书 致：美芯晟科技（北京）股份有限公司 北京市君合律师事务所（以下简称"本所"）受美芯晟科技（北京）股份有 限公司（以下简称"公司"）的委托，根据《中华人民共和国公司法》（以下简称 《公司法》）、《上市公司股东大会规则》（以下简称《股东大会规则》）等法律、 法规、规章及《美芯晟科技（北京）股份有限公司章程》（以下简称《公司章程》） 的有关规定，就公司 2023 年第一次临时股东大会（以下简称"本次股东大会"） 有关事宜出具本法律意见书。 本法律意见书仅就本次股东大会的召集和召开程序、出席本次股东大会人员 的资格、召集人资格、会议表决程序是否符合中国有关法律、法规及《公司章程》 的规定以及表决结果是否合法有效发表意见，并不对本次股东大会所审议的议案 内容以及该等议案所表述的相关事实或数据的真实性、准确性或合法性发表意 见。 为出具本法律 ...

美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会会议资料 2023 年 9 月 美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会会议资料 证券代码：688458 证券简称：美芯晟 美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会会议资料 美芯晟科技（北京）股份有限公司 2023 年第一次临时股东大会会议目录 | 美芯晟科技（北京）股份有限公司 2023 | 年第一次临时股东大会会议须知 ········ 3 | | --- | --- | | 美芯晟科技（北京）股份有限公司 2023 | 年第一次临时股东大会会议议程 ········ 5 | | 美芯晟科技（北京）股份有限公司 2023 | 年第一次临时股东大会会议议案 ········ 7 | | 议案一： | 关于变更公司注册资本、股份总额、公司类型及修订《公司章程》并办理相应工 | | 商变更登记的议案·········································································································· ...

Financial Performance - The company reported a significant increase in revenue for the first half of 2023, achieving a total of 500 million yuan, representing a 25% year-over-year growth[1]. - The company's revenue for the first half of 2023 reached ¥200,648,032.01, representing a 50.39% increase compared to ¥133,414,040.84 in the same period last year[20]. - The net profit attributable to shareholders was ¥11,003,075.50, a significant turnaround from a loss of ¥1,390,638.43 in the previous year[20]. - The net profit attributable to shareholders after deducting non-recurring gains and losses was ¥4,679,180.08, compared to a loss of ¥6,061,940.78 in the same period last year[20]. - Basic earnings per share for the first half of 2023 were ¥0.17, compared to a loss of ¥0.02 per share in the same period last year[21]. - The gross margin for the period was 30.49%, a slight decrease of 1.73 percentage points year-on-year[74]. - The company reported a significant increase in revenue, achieving a total of $X million for the quarter, representing a Y% year-over-year growth[117]. - The company reported a revenue increase of 15% year-over-year for the first half of 2023, reaching $500 million[144]. - The company reported a total of 4,297,848 shares held by Zhuhai Hengqin Borui Chip Investment Partnership, which represents 5.37%[181]. User Growth and Market Expansion - User data indicates a growing customer base, with active users increasing by 15% to reach 1.2 million by the end of June 2023[1]. - The company has identified potential risks related to supply chain disruptions, which could impact production timelines[1]. - The company provided a positive outlook for the second half of 2023, projecting a revenue growth of 30% compared to the first half[1]. - New product launches are expected to contribute an additional 100 million yuan in revenue, with two major products set to be released by Q4 2023[1]. - Market expansion plans include entering three new international markets by the end of 2023, aiming for a 10% market share in each[1]. - The company is considering strategic acquisitions to enhance its technology portfolio, with potential targets identified in the semiconductor sector[1]. - The company is exploring potential acquisitions to enhance its product offerings and market presence, with a budget of $20 million allocated for this purpose[150]. - The company is focused on expanding its product offerings in high-performance analog and mixed-signal chips, which are critical in the integrated circuit industry[28]. Research and Development - The company is investing heavily in R&D, with a budget increase of 20% to 80 million yuan for the development of new technologies[1]. - The research and development expenditure accounted for 20.29% of the revenue, a decrease of 2.28 percentage points compared to the previous year[22]. - The company reported a total R&D expenditure of ¥40,713,386.34 for the first half of 2023, representing a 35.20% increase compared to ¥30,113,634.95 in the same period last year[54]. - The company has increased its R&D personnel to 129, leading to higher salaries and increased testing, material, and patent costs[55]. - The company has developed several core technologies, including a reliable over-voltage protection technology and a high-precision low-dropout power LDO technology, enhancing product reliability and efficiency[48]. - The company has launched innovative products in the wireless charging sector, including a high-power RX+4:2 charge pump dual-chip architecture, establishing itself as a leading supplier in the industry[43]. - The company has introduced two new core technologies during the reporting period: high-precision optical sensor detection technology and high-precision crown rotation detection technology[47]. Financial Management and Investments - The net cash flow from operating activities was negative at -¥133,312,769.44, worsening from -¥36,754,135.22 in the previous year[20]. - The company attributed the revenue growth primarily to stable increases in power management chips and significant growth in wireless charging products[22]. - The company has established a management system for fundraising to ensure the effective and reasonable use of raised funds, including specific regulations for storage, usage, and supervision[134]. - The company has committed to invest CNY 1,000,000,000 in projects, with the actual investment amount reaching CNY 215,983,780.4 by the end of the reporting period[165]. - The company has not reported any significant non-operating fund occupations or guarantees during the period, indicating a focus on compliance and financial integrity[157]. - The company has committed not to engage in high-risk investments or provide financial assistance to entities outside of its controlling subsidiaries for 12 months following the use of over-raised funds[171]. Shareholder and Governance - The board has approved a profit distribution plan, proposing a dividend payout of 0.5 yuan per share for the first half of 2023[1]. - The company has committed to enhancing the transparency of cash dividends and has defined specific conditions and ratios for cash dividends and stock dividends[134]. - The company will ensure that any failure to implement stabilization measures will be publicly explained, and management will apologize to shareholders[128]. - The company has established a unified action agreement among major shareholders to enhance decision-making efficiency regarding management matters[182]. - The company will comply with relevant laws and regulations regarding share transfers after the lock-up period[110]. - The company has confirmed that the commitments made are legally binding and will take necessary legal actions to fulfill them[130]. Product Development and Technology - The company has achieved mass production and shipment of optical sensor chips in the consumer electronics sector, positioning itself to seize new market opportunities[35]. - The company has established a dual-driven product system focusing on "power management + signal chain," with key products including wireless charging chips and automotive electronic chips[37]. - The company is developing a system-level chip for automotive applications, integrating CAN FD transceiver and PMIC, targeting high integration, low power consumption, and high reliability[60]. - The company is working on a high-performance ambient light and proximity detection sensor chip, aimed at smartphones and tablets, with a focus on compact size and high reliability[60]. - The company has developed proprietary high-voltage, high-current, and high-power analog power management technologies, enhancing its competitive edge[37]. Market Trends and Industry Insights - The global semiconductor market is expected to decline by 10.3% in 2023, with a rebound forecasted at 11.8% in 2024[29]. - The analog chip market is projected to grow by 1.56% in 2023, reaching $90.95 billion, driven by trends in automotive intelligence and industrial digital transformation[31]. - The global power management chip market is expected to reach $56.5 billion by 2026, with a compound annual growth rate (CAGR) of 10.7% from 2018 to 2026[32]. - The global automotive semiconductor market size reached $34.1 billion in 2022, a year-on-year increase of 29.2%, and is projected to exceed $80 billion by 2025[36]. - The penetration rate of smart home devices is projected to increase from 14.2% in 2022 to 25.0% by 2026, with a market size reaching 1.4 trillion yuan[33].

美芯晟科技（北京）股份有限公司 2023 年半年度持续督导跟踪报告 | 保荐人名称：中信建投证券股份有限 | 被保荐公司名称：美芯晟科技（北京） | | --- | --- | | 公司 | 股份有限公司 | | 保荐代表人姓名：曾宏耀 | 联系方式：010-85130640 联系地址：北京市东城区朝内大街 号 2 | | | 凯恒中心 B、E 座三层 | | 保荐代表人姓名：董军峰 | 联系方式：021-68801585 号 2 | | | 联系地址：北京市东城区朝内大街 | | | 凯恒中心 B、E 座三层 | 经中国证券监督管理委员会（简称"中国证监会"）"证监许可〔2023〕521 号 文"批准，美芯晟科技（北京）股份有限公司（简称"公司"或"美芯晟"）向社会公 开发行人民币普通股 2,001 万股。本次公司发行新股的发行价为 75 元/股，募集 资金总额为 150,075 万元，扣除发行费用 12,426.69 万元后，实际募集资金净额 为 137,648.31 万元。本次公开发行股票于 2023 年 5 月 22 日在上海证券交易所上 市。中信建投证券股份有限公司（简称"中信建投证券"）担任本次公 ...

证券代码：688458 证券简称：美芯晟 公告编号：2023-011 美芯晟科技（北京）股份有限公司 关于自愿披露对外投资设立境外子公司的公告 如有董事对临时公告内容的真实性、准确性和完整性无法保证或存在异议的，公司 应当在公告中作特别提示。 重要内容提示： 一、对外投资概述 （一）基本情况 公司拟在中国香港设立境外子公司美芯晟科技（香港）有限公司。 （二）投资的决策与审批程序 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重 大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 公司本次境外设立子公司不构成关联交易和重大资产重组。根据《上海证券 交易所科创板股票上市规则》《公司章程》《对外投资管理制度》的相关规定，本 投资标的名称：美芯晟科技（香港）有限公司 拟投资金额：400 万美元 本次对外投资不涉及关联交易、不构成重大资产重组。 风险提示：美芯晟科技（北京）股份有限公司拟在香港设立境外全资子 公司，未来可能面临国际市场环境变化、行业政策变化、运营管理等方 面因素的影响，本次的投资收益存在不确定性。公司将进一步强化投后 工作，持续关注相关子公司的经营状况及管理成果，积极 ...

证券代码：688458 证券简称：美芯晟 公告编号：2023-007 美芯晟科技（北京）股份有限公司 关于修订《公司章程》及部分公司制度的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 美芯晟科技（北京）股份有限公司（以下简称"公司"）于2023年8月28日召 开了公司第一届董事会第九次会议，审议通过了《关于修订<公司章程>的议案》、 《关于修订<股东大会议事规则>的议案》、《关于修订<董事会议事规则>的议案》 和《关于修订<独立董事制度>的议案》。 为进一步提升公司规范运作及内控管理水平，完善公司治理结构，根据《中 华人民共和国公司法》《中华人民共和国证券法》《上市公司章程指引》《上海 证券交易所科创板上市公司自律监管指引第1号——规范运作》等有关法律法规 和规范性文件的规定，同时结合自身实际情况，公司对《公司章程》及其相关制 度进行了系统化的梳理和完善，现将有关情况公告如下： | | 违反本条规定选举、委派董事的，该选 | 违反本条规定选举、委派董事的，该选 | | --- | --- | --- | | | 举 ...

美芯晟科技（北京）股份有限公司 章 程 二〇二二年八月 | 第一章 | 总则 - | 1 - | | --- | --- | --- | | 第二章 | 经营宗旨和范围 - 2 - | | | 第三章 | 股份 - | 2 - | | 第一节 | 股份发行 - 2 - | | | 第二节 | 股份增减和回购 - 4 - | | | 第三节 | 股份转让 - 6 - | | | 第四章 | 股东和股东大会 - 6 - | | | 第一节 | 股东 - 7 - | | | 第二节 | 股东大会的一般规定 - 9 - | | | 第三节 | 股东大会的召集 - 13 - | | | | 第四节股东大会的提案与通知 - | 14 - | | 第五节 | 股东大会的召开 - 16 - | | | 第六节 | 股东大会的表决和决议 - 19 - | | | 第五章 | 董事会 - | 24 - | | 第一节 | 董事 - 24 - | | | 第二节 | 董事会 - 26 - | | | 第六章 | 总经理及其他高级管理人员 - 32 - | | | 第七章 | 监事会 - | 34 - | | 第一节 | 监事 - ...