感谢IT之家网友 西窗旧事 的线索投递！ IT之家 4 月 19 日消息，SK 海力士宣布和台积电签署谅解备忘录（MOU），推进 HBM4 研发和下一代封装技术，目标在 2026 年投产 HBM4。 根据双方签署的谅解备忘录，两家公司初期目标是改善 HBM 封装内最底层基础裸片（Base Die）的性能。 IT之家注：HBM 是将多个 DRAM 裸片（Core Die）堆叠在基础裸片上，并通过 TSV 技术进行垂直连接而成，基础裸片也连接至 GPU，在 HBM 中扮演非常重要的角色。 包括 HBM3E（第五代 HBM 产品）在内，SK 海力士旗下 HBM 产品的基础裸片此前均采用自家工艺制造，而从 HMB4（第六代 HBM 产品）开始，该公司将采用台积电的先进逻辑（Logic）工艺。 消息称双方将会展开紧密合作，尝试使用台积电的 CoWoS 技术封装 SK 海力士的 HBM 产品，从而在性能和功效等方面，进一步满足客户的定制化（Customized）HBM 产品需求。 SK 海力士今年 2 月还制定了 One Team 战略，通过台积电建立 AI 半导体同盟，进一步巩固在 HBM 领域的优势。 ▲ HB ...

IT之家 4 月 19 日消息，AMD 日前发布基于全新 Zen 4 架构 + RDNA 3 架构 + XDNA 架构的锐龙 PRO 系列商用处理器产品，而最新消息称面向笔记本电脑的锐龙 PRO 8040 系列、主打台式机的锐龙 PRO 8000 系列芯片均由台积电代工生产，预估将于今年下半年上市。 消息称锐龙 PRO 8040 系列和锐龙 PRO 8000 系列采用台积电 4nm 工艺，台积电将于今年下半年开始量产两个系列芯片，而惠普、联想等厂商会在今年年底前推出搭载这两大系列芯片的 AI PC。 IT之家此前报道，这些处理器均搭载 Ryzen AI 技术，包括 AMD Zen 4 CPU 架构、RDNA 3 架构的 GPU，以及 XDNA 架构的 NPU。制程方面也是采用 4nm 工艺，搭载 AMD PRO 技术，支持 WiFi 7 和蓝牙 5.4，在性能表现、功耗及 AI 方面，均有大幅提升。 相关阅读： 《AMD 发布锐龙 PRO 系列商用处理器：搭载 NPU 单元，支持 WiFi 7 和蓝牙 5.4》 广告声明：文内含有的对外跳转链接（包括不限于超链接、二维码、口令等形式），用于传递更多信息，节省 ...

IT之家 4 月 19 日消息，台积电昨日宣布截至 2024 年 3 月 31 日的第一季度合并收入为 5926.4 亿新台币，同比增长 16.5%，环比下降 5.3%；净利润为 2254.9 亿新台币，同比增长 8.9%，环比下降 5.5%。 台积电在财报电话会议上强调了两项重大修正：下调了全球晶圆代工行业的年度增长预期、汽车行业的增长前景从积极转为消极。 台积电首席执行官魏哲家在财报电话会议中表示终端应用的前景和 3 月前预期基本相同，不过此前预测全年汽车行业会增长，但现在预测会下降。 IT之家援引业内专家观点，出现上述预测的主要原因是成熟工艺应用和汽车需求的复苏速度放缓。 魏哲家在今年 1 月召开的上季度财报电话会议中提到，台积电有望在 2024 年实现健康增长，营收增长率将超过全球代工行业 20% 的平均水平，预计达到 21% 至 26%。 魏哲家在最新财报电话会议中认为 2024 年半导体市场（不包括存储器）同比增长 10% 左右，其中代工行业的增长预计也在 10% 左右。 广告声明：文内含有的对外跳转链接（包括不限于超链接、二维码、口令等形式），用于传递更多信息，节省甄选时间，结果仅供参考，IT ...

TSMC sees growth in the microchip industry slowing to 10%, it said in a post-earnings call. The dimmed outlook comes on slowdown expectations for automotive chips. But the firm still projects strong AI-led revenue growth in the second-quarter. NEW LOOK Sign up to get the inside scoop on today’s biggest stories in markets, tech, and business — delivered daily. Read preview Thanks for signing up! Access your favorite topics in a personalized feed while you're on the go. Email address By c ...

Weakness in the smartphone market seemed to weigh on the stock after its first-quarter earnings report.Shares of Taiwan Semiconductor (TSM -3.54%) were heading lower today after the world's largest semiconductor manufacturer posted strong results in the first quarter but offered a cautious outlook due to weakness in the smartphone and PC markets.As a result, the stock was down 3.1% as of 11:19 a.m. ET on Thursday. TSMC returns to profit growth, but it's not enoughThe sell-off in TSMC, as the company is also ...

智通财经APP获悉，周四，台积电(TSM.US)股价走低，截至发稿，该股跌超3%，报134.27美元。台积电公布2024年第一季度业绩，Q1营收5926.44亿新台币，同比增长16.5%;营业利润2490.2亿新台币，同比增长7.7%;净利润2254.85亿新台币，同比增长8.9%;Q1毛利率53.1%，预估53%。第一季度3纳米出货量占晶圆总收入的9%， 5纳米占37%，7纳米占19%;先进技术(定义为7纳米及更先进的技术)占晶圆总收入的65%。 该公司指出4月3日花莲地震的影响，初步估计将于第二季度认列扣除保险理赔后的相关地震损失约新台币30亿元。台积电表示，晶圆厂没有停电，没有结构性损毁，所有的极紫外光(EUV)光刻机等重要设备也没有损坏。这次地震造成一定数量的生产中晶圆受到影响，预计大部分的生产损失将在第二季恢复，对第二季营收影响甚微。 ...

An earthquake in Taiwan led the company to scrape some of its wafersTaiwan Semiconductor Mfg. Co. Ltd. (NYSE:TSM) stock was last seen down 4.8% at $132.30, despite the semiconductor giant surpassing first-quarter earnings and revenue expectations. Today's losses follow an earthquake in Taiwan earlier this month that led the company scrape some of its wafers, though it caused no structural damage.The security earlier hit its lowest level since early March, and could today settle below the 60-day moving avera ...

Financial Data and Key Metrics Changes - First quarter revenue decreased by 5.3% sequentially in NT dollars and 3.8% in U.S. dollars, impacted by smartphone seasonality, partially offset by HPC-related demand [6] - Gross margin increased by 0.1 percentage points sequentially to 53.1%, reflecting product mix changes due to smartphone seasonality [6] - Operating margin increased by 0.4 percentage points sequentially to 42% due to tighter expense controls, with total operating expenses accounting for 11.1% of net revenue [6] - First quarter EPS was TWD 8.7 and ROE was 25.4% [6] Business Line Data and Key Metrics Changes - Revenue contribution by technology: 3-nanometer process technology contributed 9% of wafer revenue, while 5-nanometer and 7-nanometer accounted for 37% and 19%, respectively [7] - Revenue contribution by platform: HPC increased by 3% quarter-over-quarter to account for 46% of revenue, smartphone decreased by 16% to 38%, IoT increased by 5% to 6%, automotive remained flat at 6%, and DCE increased by 33% to 2% [8] Market Data and Key Metrics Changes - Cash and marketable securities at the end of Q1 were TWD 1.9 trillion (USD 60 billion) [8] - Accounts receivable turnover days remained at 31 days, while days of inventory increased by 5 days to 90 days due to the ramp of 3-nanometer technologies [9] Company Strategy and Development Direction - The company plans to convert some 5-nanometer tools to support 3-nanometer capacity due to strong multiyear demand, expecting this conversion to dilute gross margin by about 1 to 2 percentage points in the second half of 2024 [22] - The 2024 capital budget is expected to be between USD 28 billion and USD 32 billion, with 70% to 80% allocated for advanced process technologies [23] - The company aims for a long-term gross margin of 53% and higher, despite the impact of foreign exchange rates and global manufacturing footprint expansion plans [32] Management's Comments on Operating Environment and Future Outlook - The company expects a gradual recovery in the overall semiconductor market in 2024, with a forecasted growth of approximately 10% year-over-year, while foundry industry growth is expected to be mid- to high-teens percent [26] - AI-related demand is anticipated to significantly contribute to revenue, with expectations for AI processors to double their revenue contribution this year [28] - The company acknowledges the impact of a 25% increase in electricity prices starting April 1, which is expected to dilute gross margin by 70 to 80 basis points in Q2 [21] Other Important Information - The company successfully managed the impact of a 7.2 magnitude earthquake on April 3, with no structural damage to fabs and a recovery of over 70% of tools within the first 10 hours [11][19] - The earthquake is expected to reduce Q2 gross margin by about 50 basis points due to wafer scraps and material loss [12] Q&A Session Summary Question: Demand outlook and semiconductor industry growth - The company has reduced expectations for overall semiconductor industry growth, primarily due to slower recovery in smartphone demand and traditional server demand remaining muted [35][39] - AI-related data center demand is very strong, with a shift in budget from traditional servers to AI servers [39] Question: Gross margin trends related to new technology nodes - The N3 process is expected to take longer to reach corporate average gross margin compared to previous nodes like N5 and N7, due to increased complexity and cost inflation [43][46] Question: AI returns and pricing strategy - The company is working to ensure it captures fair value in the AI value chain and is in discussions with customers regarding pricing adjustments [47][49] Question: Capacity allocation for AI customers - The company prioritizes customer success and is working to increase capacity, while also leveraging OSAT partners to meet demand [70][73] Question: 2-nanometer technology ramp-up - The meaningful revenue contribution from 2-nanometer technology is expected to start in early 2026, with a ramp profile similar to that of 3-nanometer [54][56]

盘前市场动向 1. 4月18日(周四)美股盘前，美股三大股指期货齐涨。截至发稿，道指期货涨0.31%，标普500指数期货涨0.32%，纳指期货涨0.41%。 2. 截至发稿，德国DAX指数跌0.08%，英国富时100指数涨0.21%，法国CAC40指数涨0.35%，欧洲斯托克50指数涨0.36%。 3. 截至发稿，WTI原油跌0.47%，报82.30美元/桶。布伦特原油跌0.54%，报86.82美元/桶。 市场消息 通胀升温迫使鲍威尔“急踩刹车”?高盛：都是假象。尽管美国经济在高利率环境下展现出了韧性，但由于通胀顽固不降，经济学家和分析师开始质疑美国经济能否实现软着陆。而高盛首席经济学家Jan Hatzius指出，3月份的通胀率为3.5%，但他认为这一高通胀主要是由于“数量异常庞大的特殊因素”造成的。他提到的特殊因素包括“一月效应”，即股价在一月份往往比其他月份上涨得更多，以及租赁市场短暂波动导致租金看似即将飙升。这两种现象后来都证明是暂时的。他表示：“随着特殊因素消退，我们预计后续通胀将再次放缓。”更重要的是，高盛并未发现美国大规模裁员的迹象，而大规模裁员通常会成为软着陆转变为硬着陆的警示信号。高盛预 ...

台积电（TSMC）于北京时间2024年4月18日下午的美股盘前发布了2024年第一季度财报（截止2024年4月），要点如下： 1、收入端：季节性影响减弱。2024年一季度台积电收入实现189亿美元，在业绩指引区间上限（180-188亿美元）。季度收入环比下滑3.8%，其中出货量的维度带来影响+2.5%，出货均价的维度带来影响-6.1%。受3nm占比下滑的影响，公司产品均价有所下滑，但出货量仍在增长； 2、毛利及毛利率：维持5成毛利率。2024年一季度台积电的毛利率53.1%，符合指引区间预期（52-54%）。本季度出货均价有所回落，但是成本端也有所减少，最终毛利率基本持平。3nm的扩产带来折旧摊销的增加，使得毛利率维持在相对低位； 3、晶圆结构端：AI，才是结构性需求。在3nm量产之后，公司本季度7nm以下的收入占比继续维持在65%。本季度3nm有所回落，主要是苹果新机需求并不强劲，影响拉货。而数据中心及AI芯片仍有结构化需求，填充了5nm的产能。随着下游客户的拉货，本季度美国地区收入占比继续维持在7成左右。 4、台积电业绩指引：2024年第二季度预期收入196-204亿美元（市场预期192.6亿美元）和毛利 ...