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GlobalFoundries Appoints Ganesh Moorthy to Board of Directors
Globenewswire· 2026-01-15 13:30
Core Insights - GlobalFoundries has appointed Ganesh Moorthy to its board of directors, effective immediately, bringing extensive experience in the semiconductor industry [1][2] Group 1: Leadership Experience - Mr. Moorthy has over four decades of experience in the semiconductor sector, including transformative leadership roles at Microchip Technology, where he served as CEO and president until November 2024 [2] - He held senior leadership positions at Microchip, including COO and executive vice president, and spent 19 years at Intel in engineering and executive roles [2] Group 2: Strategic Importance - Dr. Thomas Caulfield, Executive Chairman of GlobalFoundries, emphasized that Mr. Moorthy's expertise in semiconductor technology and corporate growth will be a significant asset as the company executes its strategy and expands its leadership [3] - Mr. Moorthy expressed enthusiasm about advancing GlobalFoundries' strategy and deepening customer partnerships to deliver essential technologies [3] Group 3: Commitment to Growth - Mr. Moorthy's appointment reinforces GlobalFoundries' commitment to its long-term growth strategy, focusing on resilient manufacturing and delivering power-efficient, differentiated technologies to customers globally [4]
半导体-SIA 数据显示 10 月半导体出货量低于季节性水平-Americas Technology_ Semiconductors_ SIA data shows semi shipments below seasonal in October
2025-12-05 06:35
Summary of Conference Call Notes Industry Overview - **Industry**: Semiconductors - **Data Source**: Semiconductor Industry Association (SIA) Key Points 1. **October Shipment Trends**: - Integrated circuit shipments (excluding memory) decreased by 15% month-over-month in October, which is below typical seasonal levels [1][2] - All segments shipped below seasonal levels except for Microprocessor Units (MPU) and Microcontroller Units (MCU) [1] 2. **Long-term Demand Tracking**: - Shipments are currently tracking 3% below long-term demand on a three-month moving average basis, an improvement from 4% below trend in September [1][2] 3. **Sub-segment Performance**: - Integrated Circuits (IC) excluding memory: Units were 3.4% below trend, improving from 3.7% in September [5] - Analog: Units were 1.1% below trend, up from 1.5% in September [5] - MCU: Units were 26.5% below trend, down from 24.8% in September [5] 4. **Future Expectations**: - Shipments are expected to approach trend over the next few quarters, with more constructive company commentary anticipated regarding the normalization of demand and eventual restocking [2] 5. **Investment Recommendations**: - The most bullish outlook is on analog companies that are shipping significantly below trend and have managed their supply chains effectively, specifically mentioning Microchip, Analog Devices, and NXP [2] 6. **Memory Market Performance**: - DRAM revenues were down 23% month-over-month, and NAND revenues were down 25% month-over-month, both below typical seasonality [20] - DRAM units were down 30% month-over-month, and NAND units were down 36% month-over-month, indicating a significant decline in the memory segment [21][23] Additional Insights - **Market Dynamics**: The semiconductor industry is experiencing a shift towards aligning shipments more closely with end demand, albeit at a slow pace [1] - **Potential Risks**: The continued decline in memory revenues and units may pose risks to overall market recovery and could impact companies heavily reliant on memory products [20][23] This summary encapsulates the critical insights from the conference call regarding the semiconductor industry, focusing on shipment trends, performance by sub-segments, future expectations, and investment recommendations.
Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
Globenewswire· 2025-09-10 12:09
Core Insights - The collaboration between Deca Technologies and Silicon Storage Technology (SST) aims to innovate a comprehensive non-volatile memory (NVM) chiplet package to enhance customer adoption of modular, multi-die systems [1][4] - This partnership combines Deca's M-Series™ fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology, providing a bundled offering that enhances architectural flexibility and offers technical and commercial advantages over traditional monolithic integration [2][3] Company and Industry Overview - Chiplet technology is gaining traction in the semiconductor industry as it allows for more efficient and cost-effective product designs by enabling the combination of different chips, process nodes, and sizes [5] - The collaboration supports customers from early design through qualification and prototype manufacturing, aiming to streamline integration and accelerate design cycles for broader adoption of heterogeneous integration [4][6] - The partnership is positioned to deliver a comprehensive package of intellectual property (IP), simulation tools, and advanced assembly and engineering services necessary for successful chiplet development and productization [6]