Core Insights - The SCHMID Group has successfully delivered and installed its first InfinityLine C+ system for a leading Japanese customer in the Advanced Packaging and high-end substrate market, marking a significant milestone in the company's innovation leadership [1][2] Technology Overview - The InfinityLine C+ is a next-generation vertical spin process technology that offers best-in-class uniformities, touch-free operation, single-panel processing, and fully automated panel handling [2][3] - This modular, vertical, touch-free cluster tool supports a wide range of critical wet processes for high-density interconnect (HDI) and advanced substrate applications, minimizing handling and maximizing yield [3][12] Customer Benefits - The features of the InfinityLine C+ enable higher uptime, stable output, and lower total cost of ownership for customers involved in manufacturing advanced substrates and Panel Level Packaging (PLP) architectures [4][5] - The system integrates high-precision developing, selective flash etching, and efficient wet-film stripping into a fully automated platform, enhancing the development of next-generation PLP technologies [5][6] Competitive Advantages - The InfinityLine C+ achieves a consistent 2 µm line-space performance, providing manufacturers with uncompromising uniformity, flexibility, and yield [6][12] - The system's seamless logistics integration and vertical single-panel handling further enhance its competitiveness in the market [6] Market Positioning - With the successful implementation of the InfinityLine C+, SCHMID is entering the commercialization phase, offering further customer demonstrations and volume-production configurations [7] - The InfinityLine C+ complements SCHMID's existing platforms (InfinityLine P+, H+, and V+) and strengthens its portfolio of advanced wet-process equipment [7] Company Background - The SCHMID Group is a global leader in providing solutions for the high-tech industry, focusing on electronics, photovoltaics, glass, and energy systems, with over 800 employees worldwide [9] - Founded in 1864, the company develops customized equipment and process solutions for various industries, ensuring high yields at low production costs and sustainability through environmentally friendly manufacturing processes [9]

Core Insights - SCHMID Group has expanded its product portfolio to address the increasing demand for advanced packaging substrates and high-performance server boards driven by the AI era [1][14][15] - The semiconductor and advanced packaging sector is projected to grow at a CAGR of around 10% over the next five years, with significant contributions from market leaders like TSMC and NVIDIA [2][15] - The traditional PCB industry is expected to grow at an 8% CAGR, while AI server boards are anticipated to experience a robust growth rate of about 20% [3][15] Company Developments - SCHMID has broadened its InfinityLine product family to enhance its position in next-generation package substrates and AI-server PCBs [4][12] - The company is uniquely positioned to deliver Chip-on-Wafer-on-PCB (CoWoP) solutions, focusing on best-in-class yield and low cost of ownership [5] - SCHMID anticipates that 2025 will be a transition year, with above-market growth expected from 2026 onwards, particularly in AI-driven product lines [6] Product Innovations - The existing InfinityLine H+ remains the top-selling equipment, while the new InfinityLine C+ is on track to become a significant revenue contributor [12] - Upcoming products include InfinityLine L+ for panel-level substrates and InfinityLine P+ for next-generation single panel plating, both set to launch in late 2025 [12] - SCHMID's QuantumLine and SCHMID-AVACO Plasma Equipment are designed to enable high-yield glass core substrate production [12]