Core Viewpoint - The global semiconductor industry is entering a critical phase of advanced process iteration by 2026, where traditional detection methods face limitations due to the evolution of device architecture from 2D to 3D integration, making measurement technology a core determinant of yield success [1][6]. Group 1: Event Overview - The "SEMICON China 2026 Offline Special Release Conference" hosted by the company will take place on March 26 at the Jumeirah Himalayas Hotel in Shanghai, focusing on the breakthrough paths for domestic equipment in advanced processes [1]. - The conference will address three main topics: extreme detection for advanced processes, 3D measurement for advanced packaging, and substrate measurement solutions [5]. Group 2: Technological Innovations - The company aims to break through technical monopolies through independent algorithm innovation and has achieved a best sensitivity of 10.5nm in defect detection technology for advanced nodes [6]. - A high-precision predictive model for complex bonding processes will be shared, demonstrating superior correlation compared to traditional industry solutions [6]. - The latest equipment will monitor wafer flatness and thickness uniformity at the sub-nanometer level, showcasing advancements in cutting, double-sided grinding, polishing, and epitaxial growth processes [6]. Group 3: Company Profile - The company specializes in high-precision measurement and detection solutions for silicon wafer manufacturers, IC fabs, and equipment manufacturers, leading in domestic installation volume for morphology measurement equipment [8]. - The particle detection product system has achieved a minimum detection sensitivity breakthrough from 26nm to 10.5nm, meeting core demands for yield improvement and process optimization in both traditional and advanced processes [8]. - Future plans include launching measurement solutions for even more advanced process nodes, continuously expanding technological boundaries to provide higher precision and efficiency in detection and measurement support for the integrated circuit industry [8].