Core Viewpoint - Apple is set to hold its product launch event on September 10, 2025, at 1 AM Beijing time, with a focus on significant advancements in thermal performance and ultra-thin design across over 10 new products, marking a shift towards "millimeter-level innovation" [1] Group 1: iPhone 17 Series - The iPhone 17 series will feature four models, including the standard iPhone 17 with ProMotion technology supporting a 120Hz refresh rate [2] - The revolutionary iPhone 17 Air will have a thickness of only 5.5 mm, making it the thinnest iPhone ever, enhancing both grip and aesthetics [2] - The iPhone 17 Pro will include a 48-megapixel camera system, while the iPhone 17 Pro Max will offer 12GB of RAM and a heat dissipation system [2] - All models will be powered by the 3nm+ A19 chip, with a 300% increase in AI computing power and the global rollout of eSIM technology [2] Group 2: AirPods Pro 3 - AirPods Pro 3 is expected to debut with the new H3 chip, offering a 40% performance boost over the previous H2 chip [4] - The design will be more compact, improving fit and comfort for prolonged use, with a lighter charging case featuring a hidden LED indicator [4] - Active noise cancellation will improve by approximately 30%, and the headphones will support high-resolution audio transmission [6] - Health monitoring features will include in-ear heart rate tracking and innovative ear canal temperature monitoring, laying the groundwork for future health sensor technologies [6] Group 3: Apple Watch Ultra 3 - The new Apple Watch Ultra 3 will integrate satellite communication and 5G dual-mode connectivity, along with the S11 chip for localized AI processing [7] - It will introduce medical-grade blood pressure fluctuation alerts, transitioning from a smartphone accessory to an independent health device [7] - The upcoming "Project Mulberry" health service platform will provide personalized health insights by integrating data from the Apple Watch and iPhone [9] Group 4: Other New Accessories - The second-generation HomePod mini is anticipated, retaining its iconic spherical design while upgrading to a T8310 architecture chip, enhancing performance by 30% [10] - It will feature Wi-Fi 6E and Bluetooth 5.3 for improved multi-device connectivity [10]