Group 1 - TSMC plans to increase its investment in advanced semiconductor manufacturing in the U.S. by $100 billion, bringing its total investment in the U.S. to $165 billion, which includes a previous $65 billion investment in Phoenix, Arizona [1] - The expanded investment will involve the construction of three new wafer fabs, two advanced packaging facilities, and a major R&D center [1] - TSMC's Arizona facility spans 1,100 acres and currently employs over 3,000 people, with production expected to start by the end of 2024 [4] Group 2 - Former Intel CEO Pat Gelsinger stated that the U.S. cannot regain its leadership in semiconductor process technology without conducting R&D domestically [3] - Gelsinger emphasized that TSMC's R&D work is primarily based in Taiwan and has not been announced to move to the U.S., indicating that merely enhancing manufacturing capabilities is insufficient for the U.S. to regain technological leadership [3] - TSMC's R&D focus in the U.S. is still unclear, with indications that it may only concentrate on optimizing existing processes [3]