Core Viewpoint - Yongxi Electronics is issuing convertible bonds to raise a total of 1.165 billion yuan, primarily for the research and industrialization of advanced packaging technology, which is crucial for enhancing its competitiveness in the semiconductor packaging industry [1][2]. Group 1: Fundraising and Investment - The total amount raised from the convertible bonds is 1.165 billion yuan, with 900 million yuan allocated for the development and industrialization of multi-dimensional heterogeneous advanced packaging technology [1]. - The remaining funds will be used to supplement working capital and repay bank loans [1]. Group 2: Technology and Market Position - Yongxi Electronics focuses on high-end advanced packaging technology, with products used in various fields including RF front-end chips, application processor SoC chips, and AIoT chips [1]. - The company has a total investment of 1.464 billion yuan for the multi-dimensional heterogeneous advanced packaging technology project, which will enhance its production capacity to 90,000 units per year once fully operational [1]. - The company has consistently increased its R&D expenditures, with amounts of 122 million yuan, 145 million yuan, and 217 million yuan planned for the years 2022 to 2024, respectively [2]. Group 3: Competitive Advantage - The focus on multi-dimensional heterogeneous packaging technology is seen as a key competitive advantage in the high-performance chip sector, which is critical for future competition among advanced packaging companies [1][2]. - The company aims to narrow the gap with international leaders in the high-end packaging market, which has been dominated by major global players [2].