Core Viewpoint - The article discusses the advancements in optical interconnect technology, specifically the Optical Streaming Links (OSL) proposed by New Silicon Corp. (NSC), which aims to overcome the limitations of traditional electrical interconnects in chiplet architectures, enhancing performance and efficiency in advanced packaging solutions [9][22]. Group 1: Introduction to Optical Streaming Links (OSL) - The trend of chiplet architecture is driven by the slowdown of Moore's Law, necessitating the integration of multiple small chips within a single package to enhance system performance [9]. - Traditional electrical interconnects face challenges such as high power consumption, limited transmission distances (up to 10mm), and susceptibility to crosstalk, which hinder the efficiency of chiplet communication [9]. - NSC proposes OSL as a solution, utilizing in-package LED-based optical interconnects to significantly extend transmission distances and reduce power consumption [9][10]. Group 2: OSL Technology Architecture - OSL replaces traditional silicon interconnects with a direct connection to small chips (e.g., GPUs and HBM) using Through-Silicon Vias (TSVs) [12]. - The data transmission process involves an "electrical-optical-electrical" conversion chain, where electrical signals modulate microLEDs, and the resulting optical signals are transmitted via SiNₓ waveguides [13]. - OSL achieves a single-channel data rate exceeding 12 Gbps, with a lane pitch of less than 5 micrometers, an aggregate bandwidth density over 2 Tbps/mm, and a power consumption below 0.5 pJ/bit, with transmission distances exceeding 25mm [14][16]. Group 3: OSL Manufacturing Process - NSC has developed a wafer-level integration strategy that allows for the simultaneous fabrication of CMOS and GaN LED devices on a 200mm silicon wafer, compatible with existing CMOS manufacturing infrastructure [17]. - The process involves a proprietary two-layer transfer technique, achieving over 95% bonding yield [17]. - The integration minimizes parasitic capacitance and resistance, ensuring stable device performance [19]. Group 4: Conclusion and Future Implications - OSL technology represents a breakthrough in optical interconnects, offering significant improvements in power consumption, transmission distance, and bandwidth density compared to traditional methods [22]. - The ability to remove high-power SERDES modules and expand memory capacity in advanced packaging designs positions OSL as a key enabler for the future of semiconductor technology [22]. - The upcoming 2025 forum organized by TrendBank aims to focus on heterogeneous integration technologies, further promoting advancements in the semiconductor industry [23].