Core Viewpoint - SK Hynix is focusing on the development of next-generation DRAM and NAND to meet the explosive growth in AI demand, aiming to become a full-stack AI memory innovator rather than just a memory supplier [2][4]. Group 1: AI Storage Solutions - SK Hynix is advancing customized HBM development to optimize AI storage solutions based on customer needs [2]. - The company is developing three innovative storage solutions: Custom HBM, AI-D (AI DRAM), and AI-N (AI NAND) [2][3]. - AI-D includes three variants: AI-D O (optimized for low power and high performance), AI-D B (large capacity and flexible memory allocation), and AI-D E (expanding applications to robotics and industrial automation) [3]. - AI-N is being developed in three directions: AI-N P (performance), AI-N B (bandwidth), and AI-N D (density) [3]. Group 2: Strategic Partnerships - SK Hynix is enhancing collaboration with key partners, including deep cooperation with NVIDIA in the HBM field and long-term collaboration with OpenAI for high-performance storage support [4]. - The company is working with TSMC to develop next-generation HBM base die chips and with SanDisk to promote international standardization of HBF [4]. - Collaboration with Naver Cloud aims to validate and optimize new AI storage products in real data center environments [4]. Group 3: Future Vision - The president of SK Hynix emphasized that competition in the AI era relies on collaboration with customers and partners to create synergies and superior products [4].