Core Viewpoint - The development of a new "shrink preparation strategy" utilizing liquid metal circuits and thermoplastic films enables the creation of high-performance electronic devices that can conform to complex three-dimensional surfaces, marking a significant advancement in flexible electronics and smart sensing applications [2][3]. Group 1: Technology Innovation - The research team has introduced a method that allows electronic circuits to adhere tightly to irregular surfaces, overcoming challenges faced in flexible electronics [2]. - Traditional 3D printing methods are costly and slow, while conventional attachment techniques struggle with complex surfaces, prompting the innovation of using thermoplastic films as a base [2]. - The team developed a semi-liquid metal material with high conductivity and good flow properties to prevent breakage during the shrinkage process, enabling circuit printing on flat films [2]. Group 2: Performance and Adaptability - The circuit can adaptively conform to three-dimensional surfaces after being treated with warm water or hot air at approximately 70 degrees Celsius, completing the process in about 5 seconds [2]. - Experimental results indicate that the circuit maintains stable conductivity even after 5000 cycles of bending or twisting, demonstrating excellent durability [2]. Group 3: Application Potential - The technology opens new application spaces in various fields, including embodied intelligence, where customized tactile sensor arrays have been developed for robotic arms and heads, providing robots with sensitive "electronic skin" [3]. - A smart glove integrating pressure and temperature sensors has been created, achieving a 97% accuracy rate in object recognition through touch, facilitated by deep learning algorithms [3]. - Potential applications extend to smart agriculture, aerospace, and smart healthcare, enabling functions such as fruit preservation, wing de-icing, and health monitoring, even on surfaces where traditional adhesives fail [3].