汽车边缘连接

Search documents
GMSL开源,SerDes生变
半导体行业观察· 2025-06-04 01:09
Core Viewpoint - The rise of smart vehicles has significantly increased the attention on the SerDes chip market, which is expected to reach several billion dollars by 2023 and grow towards a hundred billion dollar scale in the next decade, with China potentially accounting for 40% of this market [1][2]. Group 1: Market Overview - The SerDes chip market is currently dominated by two major suppliers, ADI and TI, who have established a stronghold through proprietary protocols GMSL and FPD-Link [1][3]. - The GMSL technology, introduced by Maxim (acquired by ADI) in 2008, allows for high-speed data transmission over a single coaxial or shielded twisted pair cable, supporting various data types including video and audio [5][12]. - The FPD-Link standard, created by National Semiconductor (now part of TI), has been widely adopted for automotive applications, particularly in navigation and entertainment systems [3][8]. Group 2: Technological Developments - GMSL has evolved through multiple generations, with GMSL2 supporting data rates up to 6 Gbit/s and GMSL3 reaching 12 Gbit/s, enabling the transmission of multiple 4K video streams [9][11]. - The introduction of new standardized protocols such as MIPI A-PHY, ASA, and HSMT presents significant competition to the existing proprietary protocols [14][20]. Group 3: OpenGMSL Initiative - ADI announced the formation of the OpenGMSL association, transitioning GMSL from a proprietary protocol to a globally accessible standard, aimed at fostering innovation in automotive applications [24][28]. - The OpenGMSL standard will focus on edge connectivity, addressing the needs of modern software-defined vehicles (SDVs) by providing low-power, low-latency solutions [29][30]. - The association aims to ensure interoperability among different manufacturers' components, enhancing collaboration across the automotive ecosystem [30][32].