Core Viewpoint - China's independent research and development of EUV lithography machines has made significant breakthroughs, adopting a different technical path from ASML, which could revolutionize semiconductor manufacturing in the country [2][3]. Group 1: Technology Comparison - The Chinese approach utilizes Laser-Induced Plasma (LDP) technology, which vaporizes tin material between electrodes and converts it into plasma through high-voltage discharge, leading to the generation of critical 13.5 nm extreme ultraviolet light [2]. - In contrast, ASML's method relies on complex high-energy lasers to bombard tin droplets, requiring sophisticated control systems akin to a finely-tuned orchestra [2]. Group 2: Advantages of Chinese Technology - The LDP technology prototype exhibits several advantages: simpler design, more compact structure, significantly reduced energy consumption, and lower manufacturing costs, representing a disruptive innovation against traditional high-cost, high-energy consumption models [2]. - The anticipated launch of China's EUV lithography machine in Q3 2025 marks a pivotal moment, indicating the country's potential to achieve true independence in the most advanced semiconductor manufacturing sector [2]. Group 3: Impact on Semiconductor Industry - Historically, the absence of EUV equipment forced Chinese companies to rely on complex and expensive "multiple exposure" techniques for producing chips at 7 nm and below, leading to increased costs and reduced efficiency [3]. - The introduction of domestic EUV lithography machines is expected to break this cycle, enabling the production of next-generation mobile processors, AI chips, and high-performance computing cores directly on domestic production lines [3].