Core Viewpoint - Liyang Chip (688135.SH) plans to raise up to 970 million yuan through a private placement of A-shares, with the funds allocated for various projects and working capital [1][3]. Fundraising Details - The total amount to be raised is capped at 970 million yuan, which will be used for the following projects: - East City Liyang Chip Integrated Circuit Testing Project: 70 million yuan out of a total investment of 131.52 million yuan - Wafer Laser Hidden Cutting Project (Phase I): 8 million yuan out of a total investment of 10 million yuan - Heterogeneous Stacking Advanced Packaging Technology R&D Project: 10 million yuan fully funded by the raised capital - Supplementing working capital and repaying bank loans: 9 million yuan fully funded by the raised capital [1][3][4]. Issuance Methodology - The shares will be issued as domestic listed ordinary shares (A-shares) with a par value of 1.00 yuan each, and the issuance will be conducted through a private placement to no more than 35 specific investors [3][4]. - The pricing will be set at no less than 80% of the average trading price over the 20 trading days prior to the pricing date [4]. Shareholder and Control Information - The issuance will not change the control of the company, as Huang Jiang remains the controlling shareholder and actual controller post-issuance [6][11]. - The shares subscribed by the specific investors will be subject to a six-month lock-up period after issuance [5][6]. Historical Context - Liyang Chip was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on November 11, 2020, with an initial public offering that raised approximately 536 million yuan [6][7]. - The company has faced financial challenges, with a projected net loss for 2025 between 85 million yuan and 115 million yuan, although this represents a reduction in losses compared to the previous year [8].