Core Insights - The research team from Fudan University has developed a new "fiber chip" by integrating large-scale integrated circuits within elastic polymer fibers, addressing the long-standing challenge of flexible electronics [1] Group 1: Technological Advancements - The design maximizes the internal space of the fiber, achieving high-density integration within a one-dimensional constrained size [1] - The team has created a preparation route compatible with current photolithography processes, utilizing plasma etching to achieve a surface roughness below 1 nanometer, meeting commercial photolithography standards [1] - A dense poly-p-xylene film layer is deposited on the elastic polymer surface, providing a "flexible armor" for the circuit, which protects against solvent erosion and buffers strain during bending and stretching [1] Group 2: Potential Applications - This breakthrough is expected to provide new pathways for the integration of fiber electronic systems, facilitating a shift from "embedding" to "weaving" [1] - The advancements could significantly impact emerging fields such as brain-machine interfaces, electronic textiles, and virtual reality [1]