Core Insights - Apple has secured over half of TSMC's (Taiwan Semiconductor Manufacturing Company) 2-nanometer capacity for 2026, which is expected to enhance its competitive edge by utilizing the most advanced manufacturing processes ahead of its rivals [1][2] - TSMC is set to begin mass production of 2-nanometer chips in the second half of 2025, with Apple being its largest customer, contributing NT$624.3 billion in revenue for 2024, marking a 14.2% year-on-year increase [1][2] - Apple is likely to adopt TSMC's latest packaging technology, Wafer-Level Multi-Chip Module (WMCM), for several upcoming products, including the M6 chip for MacBook Pro and new models of Vision Pro and iPhone [1] Group 1 - Apple has been TSMC's largest customer for advanced processes over the past decade, benefiting significantly from the inability of competitors to access the latest technologies [2] - TSMC's 2-nanometer production facilities are planned for Baoshan in Hsinchu and Kaohsiung, with the Baoshan facility's initial capacity fully booked by Apple, while Kaohsiung will support non-Apple clients [2] - TSMC's future capacity expansion plans include multiple phases at Baoshan and Kaohsiung, with potential upgrades at the Nanke facility to meet strong customer demand [2] Group 2 - TSMC has indicated that the design approval for 2-nanometer products will exceed that of 3-nanometer and 5-nanometer in the same timeframe, with a production curve similar to that of 3-nanometer technology [2] - The introduction of N2P process technology as an extension of the 2-nanometer family is anticipated, targeting applications in smartphones and high-performance computing (HPC), with mass production expected in the second half of 2026 [2]