公众号记得加星标⭐️，第一时间看推送不会错过。 科技新闻网站《wccftech》报导，台积电2纳米投片（tape-out）量已达3纳米制程的1.5倍，苹果、 高通与联发科是主要客户。分析师指出，台积电2纳米制程的空前需求，使台积电在人工智能（AI） 加速器市场上维持95%市占率。 报导说，今年下半年，台积电2纳米制程的量产芯片将上市。联发科宣布，已于去年完成其首款2纳米 制程系统单芯片（SoC）的投片。如同这家台湾IC设计公司，一些其他客户也排队下单台积电新一代 制程，最新消息指出，台积电2纳米制程的投片量已是3纳米制程的1.5倍，显示其需求十分强劲。 知名半导体爆料人士@jukan05分享摩根大通的报告指出，台积电2纳米制程需求动能强劲，投片量是 3纳米制程的1.5倍。拜2纳米时代来临之赐，台积电预料在AI加速器市场，仍维持逾95%的市占率。 即使是英特尔，也在其自家产品中增加采用台积电2纳米制程。英特尔近期才在拉斯维加斯举行的消 费性电子展（CES）上，首度展示采用其18A技术的Panther Lake Core Ultra系列3芯片。 报导说，由于AI狂潮，预定今年底，台积电2纳米制程晶圆的月产量将达1 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 台积电中科1.4纳米制程新厂11月初启动基桩工程，近期包括设备栋（CUP）完成招标，预料厂房 （FAB）工程近期就会启动招标作业。 中科管理局先前表示，台积电进行租地简报时，确定由原规划的2纳米制程，更改为1.4纳米制程 或更先进制程。 中科新厂规划兴建四座厂房及办公大楼，全案总投资规模预估达1.5兆元，初期营业额超过5,000 亿元。 台积电供应链稍早传出，美国基于分散地缘风险考量，对2纳米制程需求有急迫性，加上南科沙仑 生态科学园区开发缓不济急，1纳米制程有可能提前落地中科厂。 中科园区去年营业额1.04兆元、年增10.2%，再度站稳兆元大关，创历年第三高。 今年前十月营业额累计已达9,118.85亿元、年增7.3%，其中，积体电路产业营业额7,539.54亿 元、占比提升至82.6%，较去年同期成长8.8%。 随着台积电中科扩厂，带动供应链持续进驻，已核准半导体相关厂商达17家进驻，预期随着中科 二期扩建案加速推动，仅积体电路产业的营业额很快就会突破兆元大关。 相关供应链指出，台积电在美国亚利桑那新厂未来导入最先进制程约为2纳米至1.6纳米，1.4纳米 制程优先 ...

台积电位于亚利桑那州的首座工厂已正式投产 4 纳米制 程芯片，而第二座工厂将负责 3 纳米制程的大规模量 产，目标投产时间锁定 2027 年。此次加速扩产的核心原 因之一，是台积电正面临市场对 4 纳米、3 纳米乃至 2 纳米等尖端制程的海量需求，目前高性能计算客户已占 据该公司芯片产能的很大一部分。与此同时，人工智能 热潮尚无降温迹象，台积电因此计划扩大整体产能规 模，亚利桑那州工厂的升级工作正是这一战略的落地举 措。 报道还提及另一个重要原因：台积电当下正面临来自区 域竞争对手的激烈冲击。除了英特尔在 18A 制程技术上 持续突破，三星晶圆代工业务也迅速崛起，成为不容小 觑的强劲对手。此前报道称，三星拟加码其泰勒晶圆厂 的建设规划，摒弃原计划的 4 纳米制程，直接上马 SF2（2 纳米）制程工艺。这家韩国芯片巨头还成功 拿下特斯拉这一核心大客户，这一动态也表明，众多客户正在积极寻找台积电之外的可靠替代供应方。 IT之家 12 月 30 日消息，据韩媒 Digital Daily 报道，芯片巨头台积电正大幅提前其亚利桑那州晶圆厂的 制程节点量产时间表，3 纳米制程的大规模量产或将在 2027 年启动，较原计 ...

Core Insights - TSMC has officially submitted applications to begin construction of its A14 (1.4nm) advanced manufacturing facility in the Central Taiwan Science Park, with an estimated initial investment of $49 billion, expected to create between 8,000 to 10,000 jobs [2] - The new facility is projected to start mass production in the second half of 2028, with an anticipated revenue exceeding NT$500 billion [2] - TSMC is accelerating its 1.4nm process technology deployment to maintain market dominance amid competition from companies like Intel and Samsung [3] Group 1 - TSMC's new factory in Central Taiwan will focus on 1.4nm process technology, with plans for four buildings, the first of which is expected to complete risk production by the end of 2027 [2] - The company aims to establish itself as the largest AI/HPC chip production base globally, with the 1.4nm process being prioritized in Taiwan [2][3] - TSMC's Arizona facility is also set to adopt advanced processes, including 2nm and A16 (1.6nm), with plans to accelerate production timelines [4][5] Group 2 - The 2nm process is expected to enter mass production in Taiwan later this season, with a monthly capacity projected to reach 100,000 wafers by the end of next year [5] - TSMC is actively expanding its capacity in Arizona, with plans for multiple new fabs to support strong demand from major clients like NVIDIA and Apple [5][6] - The timeline for introducing the 2nm process in Arizona may be advanced to 2027, two years later than Taiwan's schedule, which would further enhance TSMC's overall production capacity [6]

Core Viewpoint - TSMC expects a nearly 30% revenue growth in 2025, with an increase in capital expenditure to $40 billion to $42 billion, up from a previous estimate of $38 billion to $42 billion [1][4][10]. Group 1: Performance Guidance - TSMC has raised its revenue growth forecast for 2025 to the mid-point of 30% [2]. - The company anticipates a gross margin of 59% to 61% for Q4, exceeding market expectations of 57% [2][4]. - Q4 sales are projected to be between $32.2 billion and $33.4 billion, surpassing market estimates of $31.23 billion [2][4]. Group 2: Artificial Intelligence - TSMC remains optimistic about AI growth prospects, noting that demand is stronger than anticipated three months ago [2][5]. - The company believes AI demand will remain robust throughout 2025, with a significant focus on expanding production capacity for AI-related products [5][11]. - TSMC is working to increase CoWoS capacity by 2026 due to tight AI-related production capacity [5][12]. Group 3: Capital Expenditure - TSMC's capital expenditure for the first nine months of 2025 totaled $29.39 billion, with an annual forecast of $40 billion to $42 billion [2][10]. - The company emphasizes that capital expenditure is unlikely to drop suddenly in any given year [4][10]. Group 4: Technology and Capacity - The A16 process is expected to achieve mass production in the second half of the year, while the 2nm process is set to begin mass production later this quarter [2][5]. - TSMC is accelerating capacity expansion in Arizona and has begun construction on its second wafer fab in Japan [3][13]. - The company is committed to maintaining a strong competitive edge through advanced manufacturing processes and technology [10][19].

Core Viewpoint - TSMC reported strong Q3 2025 earnings driven by robust demand for AI chips, with net profit increasing by 39.1% year-over-year, exceeding market expectations and reaching a record high [1][4]. Financial Performance - Q3 2025 revenue was NT$989.92 billion, a year-over-year increase of 30.3% and a quarter-over-quarter increase of 6% [4]. - Net profit for Q3 2025 was NT$452.30 billion, surpassing the expected NT$405.47 billion, marking a record high with a year-over-year increase of 39.1% and a quarter-over-quarter increase of 13.6% [4][8]. - In USD terms, Q3 2025 revenue was $33.10 billion, reflecting a 40.8% increase year-over-year and a 10.1% increase quarter-over-quarter [5][14]. - Gross margin for Q3 2025 was 59.5%, operating margin was 50.6%, and net profit margin was 45.7% [6][8]. Earnings Per Share - Earnings per share for Q3 2025 was NT$17.44, equivalent to $2.92 per American Depositary Share [7][8]. Product and Market Insights - Advanced process nodes contributed significantly to revenue, with 3nm process accounting for 23%, 5nm for 37%, and 7nm for 14% of wafer sales [8]. - High-Performance Computing (HPC) represented 57% of revenue, surpassing the smartphone segment at 30%, indicating strong demand for AI chips [9]. Future Outlook - TSMC raised its revenue growth forecast for 2025 to approximately 30%, up from earlier estimates [12]. - Q4 2025 revenue is projected to be between $32.2 billion and $33.4 billion, with a gross margin forecast of 59% to 61% [12][14]. - Capital expenditures for 2025 are expected to be between $40 billion and $42 billion, an increase from previous forecasts [12].

Core Viewpoint - TSMC is accelerating the construction of its new factory in Arizona, aiming for mass production of 2nm and A16 processes by 2027, one year ahead of the original 2028 schedule, driven by strong demand from US clients and geopolitical considerations [2][3]. Group 1: TSMC's Production Plans - TSMC's Arizona factory is expected to start mass production of the A16 process in 2027, with the 2nm process also being expedited [2]. - The first wafer fab in Arizona is set to begin mass production using 4nm technology in Q4 2024, achieving yield rates comparable to those in Taiwan [2]. - The second fab, utilizing 3nm technology, has been completed, and TSMC is seeing strong interest from advanced US clients, prompting an acceleration of production timelines [2]. Group 2: Geopolitical Context - The acceleration of TSMC's US manufacturing reflects the strong demand for local production from American clients and aims to mitigate geopolitical risks [2]. - The US government has proposed a "50-50" chip production model, emphasizing the need for TSMC to increase its manufacturing presence in the US [5][6]. - TSMC's strategy aligns with the US's broader goals of protecting strategic industries and responding to potential tariffs on chips [3][5]. Group 3: Future Considerations - TSMC plans to produce 2nm chips in Taiwan by the second half of 2025 and A16 chips by the second half of 2026 [3]. - The company is considering further accelerating production in response to strong AI-related demand from clients [2]. - TSMC's future strategies must focus on maintaining its competitive edge amid evolving US policies and market dynamics [7].

Core Insights - Apple has secured over half of TSMC's (Taiwan Semiconductor Manufacturing Company) 2-nanometer capacity for 2026, which is expected to enhance its competitive edge by utilizing the most advanced manufacturing processes ahead of its rivals [1][2] - TSMC is set to begin mass production of 2-nanometer chips in the second half of 2025, with Apple being its largest customer, contributing NT$624.3 billion in revenue for 2024, marking a 14.2% year-on-year increase [1][2] - Apple is likely to adopt TSMC's latest packaging technology, Wafer-Level Multi-Chip Module (WMCM), for several upcoming products, including the M6 chip for MacBook Pro and new models of Vision Pro and iPhone [1] Group 1 - Apple has been TSMC's largest customer for advanced processes over the past decade, benefiting significantly from the inability of competitors to access the latest technologies [2] - TSMC's 2-nanometer production facilities are planned for Baoshan in Hsinchu and Kaohsiung, with the Baoshan facility's initial capacity fully booked by Apple, while Kaohsiung will support non-Apple clients [2] - TSMC's future capacity expansion plans include multiple phases at Baoshan and Kaohsiung, with potential upgrades at the Nanke facility to meet strong customer demand [2] Group 2 - TSMC has indicated that the design approval for 2-nanometer products will exceed that of 3-nanometer and 5-nanometer in the same timeframe, with a production curve similar to that of 3-nanometer technology [2] - The introduction of N2P process technology as an extension of the 2-nanometer family is anticipated, targeting applications in smartphones and high-performance computing (HPC), with mass production expected in the second half of 2026 [2]

Group 1 - TSMC (Taiwan Semiconductor Manufacturing Company) is set to begin construction of its 1.4nm advanced process plant in Central Taiwan Science Park, with an estimated total investment of NT$1.2 trillion to NT$1.5 trillion [1] - The construction is expected to start in October, with various contractors already notified and bidding processes underway [1] - Environmental assessments for TSMC's 2nm plant in Hsinchu Science Park have been approved, with commitments to enhance the use of recycled water and ensure no impact on local water supply [1] Group 2 - TSMC's primary production site for the 1.4nm process will be the Taichung F25 plant, with plans for four buildings, the first of which is expected to complete risk trial production by the end of 2027 and commence mass production in the second half of 2028, potentially generating over NT$500 billion in revenue [2] - The first phase of the Central Taiwan plant will include two 1.4nm process buildings, with the second phase potentially advancing to 1nm process technology [2] - TSMC is also planning to invest in a 1nm advanced process facility in Tainan's Shalun Park, with an estimated capacity for 10 wafer fabs on a land area of 500 hectares [2]

Core Viewpoint - TSMC is accelerating the construction and production timelines of its Arizona factories in response to strong demand from major clients like Apple, AMD, and NVIDIA, despite the higher costs associated with U.S. manufacturing [2][3][4]. Group 1: TSMC's Expansion Plans - TSMC's first Arizona factory is set to begin mass production of 4nm technology in Q4 2024, with plans for the second factory to adopt 3nm technology and potentially start production as early as 2026 [2][5]. - The third factory is under construction and will utilize 2nm and A16 process technologies, with production timelines being expedited due to strong AI-related demand [3][10]. - TSMC's overall investment in U.S. facilities is projected to reach $165 billion, including six wafer fabs and two advanced packaging plants [5]. Group 2: Client Demand and Pricing - Major clients, including NVIDIA and OpenAI, are increasingly relying on TSMC for advanced semiconductor manufacturing, with NVIDIA's CEO confirming orders for various products including CPUs and GPUs [2][3]. - AMD's CEO noted that chips produced in Arizona are 5% to 20% more expensive than those made in Taiwan, reflecting the higher operational costs in the U.S. [4]. - TSMC has acknowledged that the higher costs of U.S. production will dilute its gross margins by approximately 2% to 3% in the initial years, increasing to 3% to 4% later on [3][7]. Group 3: Financial Performance - TSMC's Arizona factory has begun contributing positively to revenue, reporting an investment gain of 6.447 billion TWD, marking a significant turnaround after four years of losses [7]. - The profitability of the Arizona facility is attributed to high capacity utilization, with major clients like Apple and AMD filling orders rapidly [7][8]. - In contrast, TSMC's Kumamoto factory in Japan continues to operate at a loss due to lower capacity utilization and market demand challenges [7][8]. Group 4: Future Production Capacity - TSMC plans to ramp up production capacity for its 2nm technology, with expectations of reaching a monthly capacity of 100,000 wafers by the end of 2026 [11]. - The company is adjusting its production plans based on client demand and market conditions, ensuring that the expansion in the U.S. does not significantly detract from its Taiwanese operations [11].