Core Insights - The "2025 Super Node Data Center Industry Summit and High-Density Data Center Developer Forum" will be held from November 26-28 in Hangzhou, Zhejiang, focusing on topics such as super node data center architecture design, interconnection technology, optical module packaging trends, liquid cooling technology, and high thermal conductivity materials [2] - The forum is expected to attract over 500 industry experts and 40+ speakers from major companies including Nvidia, Huawei, Alibaba Cloud, and China Mobile [2] Group 1: Forum Overview - The event will feature one main conference and two specialized sessions for in-depth discussions [2] - Key topics include innovations in AI chip interconnection protocols and the evolution of super node optical interconnection [3][4] Group 2: Technical Presentations - Presentations will cover high-speed optical interconnection systems for AI clusters and the opportunities and challenges of hollow-core optical fibers in data centers [4][5] - Discussions will also focus on thermal management materials for optical modules and the application of graphene in thermal management [4][5] Group 3: Schedule Highlights - The first day will include keynotes on super node data centers and liquid cooling acceleration plans by Intel [9][10] - The second day will address optical module development and thermal management technologies [11][12] Group 4: Participation and Sponsorship - Various participation formats are available, including theme reports and sponsorship opportunities [16][19] - Registration for the event is priced at 2500 per participant [16]