Group 1 - Company approved the use of raised funds to replace self-raised funds for investment projects and issuance costs totaling RMB 93.31 million (excluding tax) [1][4][5] - The total amount raised from the issuance of convertible bonds is RMB 850 million, with a net amount of RMB 838.79 million after deducting issuance costs [1][9] - The company has established a special account for the management of raised funds, in compliance with regulations [2][9] Group 2 - The company plans to provide a loan of up to RMB 428 million to its wholly-owned subsidiary, Suzhou Qizhong, for the implementation of investment projects [8][11] - The loan will be interest-free and is intended solely for the specified investment project [11][12] - The board of directors has authorized management to handle the loan disbursement and related matters [11][12] Group 3 - The company intends to invest RMB 50 million in Zhejiang Hexin Integrated Circuit Co., Ltd., acquiring 2.27% of its equity [17][19] - This investment is aimed at optimizing the company's strategic layout in the advanced packaging and testing field of integrated circuits [20][27] - The investment has been approved by the board and does not require shareholder approval [19][21] Group 4 - The company will use its own foreign exchange to pay for part of the investment project costs and will replace it with raised funds [51][55] - This approach is expected to improve fund utilization efficiency and reduce financial costs [55][57] - The board has approved this process, which does not require shareholder approval [56][58]

Core Insights - The company reported a revenue of 996 million yuan for the first half of 2025, representing a year-on-year growth of 6.63%, while the net profit attributable to shareholders decreased by 38.78% to 99.19 million yuan [1] - Despite the global semiconductor market recovery, the company's net profit decline was primarily due to a significant drop in revenue from non-display chip packaging and testing services, which fell by 20.84% to 64.08 million yuan [1] Financial Performance - Revenue for the first half of 2025: 996 million yuan, up 6.63% year-on-year [1] - Net profit for the first half of 2025: 99.19 million yuan, down 38.78% year-on-year [1] - Revenue from non-display chip packaging and testing: 64.08 million yuan, down 20.84% year-on-year [1] Research and Development - R&D investment reached 92.31 million yuan in the first half of 2025, an increase of 35.32% year-on-year [2] - The number of R&D personnel increased to 295, a growth of 19.43%, accounting for 12.87% of the total workforce [1] - The company established a joint training base with Hefei University of Technology to enhance academic research and industry practice [1] Technological Innovation - The company obtained 10 authorized invention patents and 18 utility model patents in the first half of 2025, covering various fields such as chip packaging structure and automated production [2] - The company aims to accelerate the localization of advanced packaging and testing in China's integrated circuit industry, focusing on technology innovation as a core driver [2] Market Strategy - The company is actively expanding its non-display packaging and testing capabilities to meet the growing demand for power chips in high-power sectors such as renewable energy [2] - The company is enhancing its process capabilities in wafer front-side metallization, back thinning and metallization, and copper clip bonding [2]