Group 1 - The company, Xinhenghui Electronics Co., Ltd., is set to hold its online roadshow for its initial public offering on June 10, 2023, on the P5W platform [1] - Key executives from the company, including Chairman Ren Zhijun and CFO Wu Zhongtang, will participate in the roadshow alongside representatives from the lead underwriter, Founder Securities [2] - Xinhenghui specializes in integrated circuit solutions, focusing on chip packaging materials, and has established itself as a national high-tech enterprise and a "little giant" in the industry [2][3] Group 2 - The company has a significant market share of approximately 30% in the smart card business, ranking second globally, with applications in communications, finance, transportation, and identity verification [2] - In the etching lead frame business, the company has developed core technologies such as laser direct imaging and continuous etching, leading to improved product yield and increased capacity [3] - The IoT eSIM chip packaging sector is emerging as a new revenue growth point for the company, leveraging its advantages in traditional SIM card packaging [3] Group 3 - The company is committed to independent research and product innovation, with established laboratories and a high-level R&D team, holding over 120 patents and software copyrights [3] - Future strategies include increasing investment in core technology research, enhancing the R&D system, and expanding product varieties and applications [4] - The company aims to become a leading enterprise in the global integrated circuit packaging materials sector through collaboration with top global partners [4]

Core Viewpoint - New Henghui plans to publicly issue approximately 5,988,890 shares on the Shenzhen Stock Exchange's Growth Enterprise Market, aiming to raise 519 million yuan for industrialization projects and R&D center upgrades [1][2] Company Overview - New Henghui is located in Zibo High-tech Zone and operates as an integrated circuit enterprise focusing on chip packaging materials, including smart card business, etched lead frame business, and IoT eSIM chip testing services [1] - The company has shown steady growth in recent years, with revenues projected to increase from 684 million yuan in 2022 to 842 million yuan in 2024, reflecting a compound annual growth rate (CAGR) of 10.97% [1] - Net profit is expected to grow significantly from 110 million yuan to 186 million yuan during the same period, with a CAGR of 29.4% [1] Growth Strategy - The company is actively expanding its second growth curve, with the IoT eSIM chip testing business accounting for 3.93% of its operations, indicating strong development potential [2] - The IPO funds will primarily support two projects: 456 million yuan for high-density QFN/DFN packaging material industrialization to enhance capacity in the etched lead frame sector, and 62.66 million yuan for upgrading the R&D center to strengthen technological advantages and promote new product development [2] Shareholder Structure - The major shareholder, Yu Renrong, holds 31.41% directly and 0.53% indirectly, totaling 31.94%. He is the actual controller of A-share listed company Weier Shares [2] - The second-largest shareholder, Ren Zhijun, owns 16.21% directly and 3.1% indirectly, totaling 19.31%, and serves as the chairman of the company [2]