Group 1 - The company, Xinhenghui Electronics Co., Ltd., is set to hold its online roadshow for its initial public offering on June 10, 2023, on the P5W platform [1] - Key executives from the company, including Chairman Ren Zhijun and CFO Wu Zhongtang, will participate in the roadshow alongside representatives from the lead underwriter, Founder Securities [2] - Xinhenghui specializes in integrated circuit solutions, focusing on chip packaging materials, and has established itself as a national high-tech enterprise and a "little giant" in the industry [2][3] Group 2 - The company has a significant market share of approximately 30% in the smart card business, ranking second globally, with applications in communications, finance, transportation, and identity verification [2] - In the etching lead frame business, the company has developed core technologies such as laser direct imaging and continuous etching, leading to improved product yield and increased capacity [3] - The IoT eSIM chip packaging sector is emerging as a new revenue growth point for the company, leveraging its advantages in traditional SIM card packaging [3] Group 3 - The company is committed to independent research and product innovation, with established laboratories and a high-level R&D team, holding over 120 patents and software copyrights [3] - Future strategies include increasing investment in core technology research, enhancing the R&D system, and expanding product varieties and applications [4] - The company aims to become a leading enterprise in the global integrated circuit packaging materials sector through collaboration with top global partners [4]

Group 1 - The core viewpoint of the article is that Xinhenghui (301678) successfully held an online roadshow for its initial public offering (IPO) and listing on the ChiNext board on June 10 [1] - The company introduced new products and services in the field of IoT eSIM chip packaging, including IoT QFN/DFN packaging and MP2 packaging, to meet the needs of downstream IoT customers [1]