Core Insights - The 22nd China International Semiconductor Expo (IC China 2025) will take place from November 23 to 25, 2025, in Beijing, focusing on the theme "Gathering Chips, Driving the Future" [1][3] - The event aligns with the start of the "14th Five-Year Plan," emphasizing technological innovation, modern industrial system construction, and the stability of supply chains [3] Event Structure - IC China 2025 will feature a diversified activity system comprising 4 major events, 2 specialized meetings, 3 thematic forums, and numerous supporting activities, aimed at fostering collaboration across the semiconductor industry [3][4] - The four major events include an opening ceremony, the 7th Global IC Entrepreneurs Conference, exhibition tours, and an IC Night for networking among key industry figures [3][4] Specialized Meetings - Two specialized meetings will focus on talent and technology, addressing core industry needs. The 8th Microelectronics Talent China Conference will facilitate talent mobility and matching within the semiconductor sector [4] - The 23rd China Semiconductor Packaging and Testing Technology and Market Annual Conference will focus on advanced packaging technologies, materials, and equipment [4] Thematic Forums - Three thematic forums will address policy and industry trends, including an AI and large model chip forum, a forum on integrated circuit silicon material innovation, and a forum on semiconductor equipment technology innovation [5] - These forums aim to enhance cooperation between design and application enterprises, discuss breakthroughs in storage technology, and accelerate the localization of core technologies [5] Supporting Activities - The expo will host various supporting activities to enrich the industry service ecosystem, providing comprehensive display and networking services for enterprises, media, and audiences [5] - Activities will include product launches, supply-demand matching, and media interviews to meet diverse needs such as technology promotion, market expansion, and financing cooperation [5]