集成电路装备国产化

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突破关键核心技术,河海大学仿生机器人团队助力半导体产业升级
Yang Zi Wan Bao Wang· 2025-08-23 23:30
Core Insights - A breakthrough in semiconductor equipment manufacturing has been achieved with the development of a "vacuum environment ultra-clean wafer transfer robotic arm" by the Suzhou Research Institute of Hohai University, addressing a key technological challenge in China's semiconductor equipment manufacturing [1][3]. Group 1: Technology Development - The robotic arm serves as the "nerve center" of semiconductor wafer production lines, crucial for the performance of key equipment like lithography and etching machines, which directly impacts chip manufacturing precision and efficiency [3]. - The technology was previously monopolized by companies such as Rorze from Japan and Brooks from the USA, and was included in the export ban product list, affecting the security of the supply chain [3]. - The development process involved collaboration between academia and industry, with the research team working alongside enterprises and institutions like Beihang University to tackle key technological challenges [3]. Group 2: Technical Achievements - The robotic arm features integrated drive and magnetic fluid sealing technology, addressing cleanliness control issues in vacuum environments [3]. - A real-time control system based on domestic operating systems achieves nanosecond-level response precision, while an innovative error compensation algorithm maintains a repeat positioning accuracy of ±0.05mm and reduces horizontal vibration to 0.2g, meeting international advanced standards [3]. Group 3: Market Impact and Future Plans - The technology's commercialization has enhanced the R&D and management capabilities of enterprises and promotes the deep integration of integrated circuit equipment with robotics and intelligent manufacturing technologies [4]. - The robotic arm has been successfully implemented in several industry-leading companies, generating approximately 13 million yuan in sales revenue [4]. - The team is focused on high-end application areas such as 5G communication and AI chips, offering customized transmission solutions and innovating equipment refurbishment and upgrade services to create a dual-driven model of "equipment sales + value-added services" [4].