Core Viewpoint - The decision by Apple to switch from titanium alloy to aluminum alloy for the iPhone 17 Pro highlights a significant shift in the consumer electronics industry, emphasizing the importance of heat dissipation performance in high-end device design [3][4]. Group 1: Analysis of iPhone 17 Pro's Material Change - The core contradiction of "abandoning titanium for aluminum" lies in the trade-off between heat dissipation performance and high-end feel [5]. - Titanium alloy, while known for its strength-to-weight ratio and premium feel, has a thermal conductivity that is only 1/30th that of aluminum alloy, which has become a bottleneck for device performance as chip power increases [7]. - The new iPhone 17 Pro, utilizing 6061 aerospace aluminum and a 0.3mm ultra-thin laser-welded VC heat spreader, maintains a body temperature of 41.3°C after 30 minutes of 4K video recording, a reduction of 7.4°C compared to the previous titanium model [8][9]. - In high-performance gaming scenarios, frame rate fluctuations decreased from 15 frames to just 2 frames, significantly enhancing user experience [9]. - The aluminum and VC heat spreader combination improves heat conduction efficiency by 20 times compared to the titanium model, indicating that heat dissipation performance is now a critical metric for flagship devices [9]. Group 2: Heat Dissipation Performance Comparison - A comparative analysis of heat dissipation performance between iPhone 17 Pro and iPhone 16 Pro shows significant improvements across various metrics: - 4K recording temperature: 41.3°C (iPhone 17 Pro) vs. 48.7°C (iPhone 16 Pro), a difference of -15.2% [10]. - Frame rate fluctuation during gaming: 2 frames (iPhone 17 Pro) vs. 15 frames (iPhone 16 Pro), a difference of -86.7% [10]. - Continuous performance under full load: 40 minutes without throttling (iPhone 17 Pro) vs. 22 minutes with a 30% throttle (iPhone 16 Pro), an improvement of +81.8% [10]. - Maximum charging temperature: 38.5°C (iPhone 17 Pro) vs. 44.2°C (iPhone 16 Pro), a difference of -12.9% [10]. Group 3: Overview of the Heat Dissipation Materials Market - The global thermal interface materials (TIM) market is expected to grow at a compound annual growth rate (CAGR) of over 10%, potentially reaching approximately $7.5 billion by 2036 [15]. - The VC heat spreader is rapidly penetrating the high-end consumer electronics market, with its penetration rate in high-end smartphones projected to increase from 35% in 2023 to 62% by 2025 [17]. - The cost of thermal modules in smartphones has risen from 3.5% of the bill of materials (BOM) in 2020 to an expected 5.8% by 2025, indicating that heat dissipation systems are becoming a significant component of smartphone production costs [17]. Group 4: Evolution of Heat Dissipation Materials - The development of heat dissipation materials can be categorized into three main stages: passive heat dissipation, active heat dissipation, and smart heat dissipation [25]. - Traditional heat dissipation materials include metals like aluminum and copper, which are widely used due to their excellent thermal conductivity [26]. - Emerging materials such as graphite and phase change materials (PCM) are gaining traction due to their high thermal conductivity and efficiency in heat management applications [29][30]. - Advanced technologies like microchannel cooling and immersion cooling are being explored for high-power applications, showcasing the ongoing evolution in heat management solutions [31][32].