Forum Overview - The forum titled "Third Generation Semiconductor Testing Technology Innovation and Coordinated Development of Beijing-Tianjin-Hebei" will be held on April 23, 2026, focusing on standards, technology, and industrial collaboration [3][4]. - The event aims to address the challenges of standardization and innovation in testing technology, which is crucial for the development of the third-generation semiconductor industry [3]. Objectives of the Forum - To create a high-end communication platform that integrates "testing + standards + industry" [4]. - To promote deep interaction between technology, standards, and industry, leveraging CASA's standard system for practical applications in materials, devices, and modules [5]. - To enhance the effectiveness of coordinated development in the Beijing-Tianjin-Hebei region by emphasizing the complementary advantages of R&D in Beijing, manufacturing in Tianjin, and materials in Hebei [6]. - To explore the integration of AI with testing technology, focusing on intelligent data processing and online testing applications [7]. Target Audience - Participants from the third-generation semiconductor industry chain, including technical leaders, quality directors, and R&D engineers from companies involved in material preparation, chip design, manufacturing, packaging, and applications [8]. - Executives and technical experts from domestic and international suppliers of testing instruments and equipment focused on material analysis, chip measurement, and reliability testing [9]. - Experts and scholars from universities and research institutions in the Beijing-Tianjin-Hebei region engaged in research on third-generation semiconductor materials, devices, processes, and testing technologies [10]. - Representatives from industry organizations, CASA member units, and standardization bodies [11]. - Investment and consulting institutions interested in hard technology and the semiconductor sector [12]. - Government and park representatives from relevant economic and technology departments in the Beijing-Tianjin-Hebei region [13]. Proposed Report Themes - The demand for testing technology in the third-generation semiconductor industry [15]. - Progress in the construction of CASA's third-generation semiconductor standard system [15]. - Discussions on AI-enabled online testing and intelligent measurement technologies from a research perspective [15]. - Sharing intelligent testing solutions from laboratory to production line [15]. - Practical implementation of reliability testing technologies and standards for automotive-grade SiC modules from a manufacturing perspective [15]. - Analysis of defects in GaN/SiC substrates and advancements in advanced packaging testing technologies from a materials perspective [15].