Core Viewpoint - Silicon Carbide (SiC) is identified as a key support for technological upgrades and efficiency revolutions, with significant applications in high-growth industries such as renewable energy, AI, communications, and AR [1] Renewable Energy Sector - SiC is crucial for achieving high energy efficiency, with a projected demand of approximately 5.77 million pieces of SiC substrates by 2030 for "new energy vehicles + charging piles + solar storage," reflecting a CAGR of about 36.7% [2] - In the electric vehicle sector, the penetration rate of 800V high-voltage platforms is expected to reach 11.17% by 2025, with SiC MOSFETs reducing overall vehicle energy consumption by 8%-10% [2] - For high-voltage DC charging piles, 100,000 high-power charging piles are expected to be built by 2027, with a demand for 510,000 SiC substrates globally by 2030 [2] - In the solar storage sector, SiC will enhance the efficiency of photovoltaic inverters and energy storage converters, with a projected demand of 940,000 SiC substrates globally by 2030 [2] AI Industry - SiC is poised for dual growth opportunities in "power + heat dissipation," with a projected demand of 730,000 SiC substrates in the power supply sector by 2030 [3] - In data centers, SiC will address the high heat generation of GPUs, with a demand of approximately 6.2 million substrates for AI chips by 2030 [3] - If SiC is utilized in both the substrate and heat sink materials in CoWoS processes, the substrate demand in the AI chip cooling sector could double [3] Communication and RF Sector - The upgrade of RF devices driven by 5G-A and 6G technologies will see GaN-on-SiC solutions becoming mainstream, with a projected demand of 170,000 semi-insulating SiC substrates globally by 2030 [4] - The AR glasses sector is expected to require 3.89 million substrates by 2030, with SiC's high refractive index making it an ideal base material for optical waveguides [4] - The overall demand for SiC substrates is expected to reach 16.76 million pieces by 2030, with a potential supply gap of approximately 12 million pieces compared to 2025 supply levels [4] - The three core growth points identified are AI intermediary layers, new energy vehicles, and AR glasses, with projected demand shares of 37%, 26%, and 23% respectively by 2030 [4]

Investment Rating - The report suggests a positive investment outlook for the SiC industry, indicating significant growth potential due to the anticipated adoption of SiC in advanced packaging technologies by major companies like NVIDIA and TSMC [6]. Core Insights - The report emphasizes the critical need for improved thermal management solutions in AI computing chips, particularly in the context of CoWoS packaging, which is currently facing challenges due to rising power demands [3][40]. - SiC is identified as a promising alternative material for CoWoS interposers, offering superior thermal conductivity and structural integrity compared to traditional silicon and glass materials [4][86]. - The potential for the Chinese mainland SiC industry to benefit significantly from the shift towards SiC interposers is highlighted, given its advantages in investment scale, production costs, and downstream support [5][6]. Summary by Sections 1. NVIDIA and TSMC's Consideration of SiC - NVIDIA plans to adopt 12-inch SiC substrates in its next-generation GPU packaging by 2027, indicating a strategic shift towards advanced materials for better performance [2][9]. 2. Need for CoWoS Thermal Management - The report discusses the increasing power requirements of AI chips, with NVIDIA's H100 GPU exceeding 700W, necessitating enhanced cooling solutions to manage heat effectively [15][22]. 3. SiC as a Preferred Interposer Material - SiC's thermal conductivity is 2-3 times that of silicon, making it an ideal candidate for interposers in CoWoS packaging, which is crucial for high-performance computing applications [4][86]. 4. Benefits for China's SiC Industry - If CoWoS adopts SiC interposers, the demand could exceed 230,000 12-inch SiC substrates by 2030, presenting a substantial opportunity for the Chinese SiC supply chain [5][6]. 5. Overview of SiC Substrate and Equipment Companies - Key beneficiaries of the SiC market growth include companies like Jingcheng Machinery, Jing Sheng Co., Tianyue Advanced, and others, which are positioned to capitalize on the anticipated demand for SiC substrates and related equipment [6]. 6. Investment Recommendations - The report recommends investing in companies involved in SiC substrate production and equipment manufacturing, as they are expected to benefit from the industry's transition towards SiC technology [6].

Group 1 - SK Group has slowed down the sale of its semiconductor wafer expert SK Siltron, commissioning a consulting firm to assess its enterprise value [2] - The chairman of SK Group, Choi Tae-won, has a deep emotional connection to SK Siltron, leading analysts to believe that the group may reconsider the sale [2][3] - SK Group initially planned to sell 70.6% of its management stake in SK Siltron as part of a business restructuring plan, while the chairman's 29.4% stake was not included in the sale [2] Group 2 - The enterprise value (EV) of SK Siltron is estimated to be over 4 trillion KRW, with equity valued between 1 trillion to 2 trillion KRW after deducting 3 trillion KRW in debt [3] - The chairman believes that selling SK Siltron just before a potential semiconductor supercycle would be a missed opportunity [3] - SK Siltron's U.S. subsidiary, SK Siltron CSS, has been expanding its silicon carbide (SiC) factory in Bay City, Michigan, which received a conditional loan of 544 million USD (approximately 770 billion KRW) from the U.S. government in 2022 [3]

Core Insights - The adoption of Solid State Transformers (SST) is expected to drive demand for wide bandgap semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN), with SiC primarily used in input applications and GaN in output applications [1] - The global solid-state transformer market is projected to grow at a compound annual growth rate (CAGR) of 25% to 35% over the next 5-10 years, benefiting both magnetic materials and power semiconductors [1] Group 1: Industry Transformation - The power supply systems for data centers are undergoing significant changes due to the explosion of AI computing power, with power density per rack increasing from under 60 kW to 150 kW or higher [1] - Solid State Transformers (SST) offer over 98% system efficiency and require less than 50% of the space compared to traditional solutions, making them a promising core solution for next-generation data center power systems [1][2] - NVIDIA's recent release of an 800V DC white paper highlights the critical role of SST in its next-generation power architecture, indicating strong industry recognition of SST technology [1] Group 2: Technical Advantages of SST - SST improves efficiency by replacing traditional transformers with high-frequency power electronics, achieving over 98% efficiency compared to 95.1% for traditional HVDC systems [2] - The compact design of SST, utilizing high-frequency magnetic materials and modular architecture, significantly reduces the size of transformers while integrating multiple functions, thus saving space in data centers [2] Group 3: Future Potential of SST - SST acts as a "software-defined" energy router, enhancing the intelligence and resilience of power supply systems through real-time control and fault self-recovery capabilities [3] - SST's compatibility with renewable energy sources allows for direct integration of solar and wind power, improving the acceptance of renewable energy by over 50% compared to traditional systems [3] - The dual active bridge topology of SST supports bidirectional energy flow, enabling energy storage during low demand and feedback to the grid during peak times, which can reduce operational costs for data centers [3] Group 4: Companies to Watch - Companies involved in SST systems include Sifang Co., Ltd. (with SST efficiency reaching 98.5% and applications in national demonstration projects), China West Electric (with a subsidiary's 2.4MW SST operational), and Jinpan Technology (developing a 10kV/2.4MW prototype) [4] - Companies focused on SST materials include Hengdian East Magnetic (largest ferrite material company globally), Placo New Materials (new soft magnetic materials with frequencies over 10 MHz), and Yunlu Co., Ltd. (global leader in amorphous alloys) [4]

Core Insights - The semiconductor materials industry in China is at a crucial development stage, with significant growth potential and strategic importance in the global market [4][5] - The historical contributions of Henan province, particularly the establishment of the Luoyang Monocrystalline Silicon Plant in 1966, have been pivotal in the evolution of China's semiconductor materials sector [3] Industry Development History - The Luoyang Monocrystalline Silicon Plant was the first in China to introduce a complete set of technology and equipment from abroad in 1966, marking the beginning of the country's exploration into semiconductor silicon materials [3] - The plant's initial design capacity was 2.4 tons of polysilicon and 1.4 tons of monocrystalline silicon, which has evolved significantly over the decades [3] - By 2005, the Luoyang Zhongzhil High-tech Company achieved an annual production of 300 tons of polysilicon, breaking foreign technology monopolies [3] Current Industry Landscape - The global semiconductor industry is undergoing profound changes, with materials becoming increasingly strategic [4] - The semiconductor materials market is projected to reach $70 billion by 2025, with China's key electronic materials market expected to exceed 170 billion yuan, reflecting a growth of over 20% [4] - The domestic production rate of semiconductor-grade silicon materials has surpassed 50%, while the rate for polishing liquids has exceeded 30% [4] Future Development Directions - Emphasis on strengthening basic research and advanced layout in semiconductor materials, including enhancing the quality and cost competitiveness of silicon-based materials [5] - Encouragement of collaborative innovation across the industry chain, promoting synergy between materials, equipment, and processes [5] - Adoption of green and intelligent trends in material production, focusing on low-carbon transformation and utilizing AI and big data for accelerated R&D [5] - Development of a resilient talent chain to foster innovation and improve the talent cultivation system across the industry [5]

Core Insights - The electronic circuit and semiconductor industry is at a critical juncture driven by explosive growth in AI large models and global supply chain restructuring, with a 30-fold increase in computing core numbers over the past decade, while memory bandwidth growth is less than 1/5, leading to storage bottlenecks and material iteration challenges [1] Group 1: Storage Technology Breakthrough - Storage is viewed as the "reservoir" of AI computing power, with breakthroughs in technology directly impacting the efficiency of power release [3] - The forum will focus on three major technological directions: traditional storage upgrades, emerging storage implementations, and RV technology integration [3] Group 2: Material Innovation - Material innovation is the underlying logic for upgrading the semiconductor industry, with the forum addressing core material breakthroughs [4] - Key topics include advancements in AMB copper-clad ceramic substrates, third-generation semiconductors like SiC and GaN, and PCB material breakthroughs to meet high-density demands [5] Group 3: Digital Transformation and Intelligent Manufacturing - The forum will explore the application of AI technology across the entire PCB design, production, and testing process, enhancing defect recognition and production efficiency [5] - Discussions will include AI-based dynamic adjustments of key process parameters and the design logic of AI scheduling systems for flexible manufacturing [5] Group 4: Advanced Packaging and EDA Tools - Advanced packaging and EDA tools are becoming critical for breakthroughs in computing power, with a focus on system-level packaging (SiP) and Chiplet technology integration [7] - The forum will analyze the collaborative mechanisms between academia, research institutions, and enterprises to accelerate the industrialization of innovative results [11] Group 5: Forum Details - The "AI-Driven, Smart Chain Future: 2025 Electronic Circuit and Semiconductor Industry Innovation Forum" will take place on October 28, 2025, at the Shenzhen International Convention and Exhibition Center [10] - The forum will cover topics such as AI + PCB intelligent manufacturing, EDA technology breakthroughs, and the localization of AI computing chips [10]

Summary of TSMC's SiC Strategy and Industry Insights Industry and Company Overview - The document focuses on TSMC (Taiwan Semiconductor Manufacturing Company) and its strategy regarding Silicon Carbide (SiC) in the context of advanced packaging and AI chip demands [1][2][3] - Other companies mentioned include NVIDIA, AMD, Google, and AWS, highlighting the competitive landscape in AI and HPC (High-Performance Computing) [22][60] Core Insights and Arguments 1. Challenges in AI Chip Design - The increasing complexity and power demands of AI chips have made traditional power delivery methods inadequate, leading to issues like IR drops and transient voltage droops [5][6] - Single GPUs now require over 1000A of current, pushing legacy power delivery systems to their limits [6][22] 2. Innovative Solutions - Foundries and OSAT providers are proposing solutions like Marvell's PIVR and ASE's VIPack to optimize power delivery and thermal performance [8][9] - TSMC's CoWoS-L platform integrates IVRs and eDTCs to enhance power stability and reduce voltage drop [12][13] 3. SiC's Role in Advanced Packaging - SiC is emerging as a critical material for high-voltage ICs and on-chip power delivery, supporting developments in BSPDN and IVR architectures [19][20] - Its unique properties, such as high thermal conductivity and mechanical strength, position SiC as a key enabler for thermal management and optical interconnects [21][51] 4. Market Dynamics - The demand for ultra-large-scale GPUs and ASICs is driving the need for advanced materials and packaging solutions [22][23] - TSMC is exploring SiC as an interposer material to meet the increasing bandwidth and power demands of AI/HPC packaging [61] 5. Competitive Landscape - TSMC's advancements in SiC could provide a competitive edge over Intel and Samsung, who are also investing in power delivery and packaging technologies [60][61] - The introduction of SiC substrates into TSMC's platforms could reshape the AI semiconductor supply chain [59] Additional Important Insights 1. Bottlenecks in Process and Packaging Technologies - The document identifies three critical bottlenecks: thermal challenges, power delivery bottlenecks, and electro-optical integration demands [26][33][35] - TSMC is addressing these through diversified packaging solutions and exploring next-gen silicon photonics [38][39] 2. Future Directions - The integration of SiC into TSMC's advanced packaging platforms like COUPE could redefine the industry's approach to thermal, electrical, and optical challenges [59] - The document emphasizes the importance of overcoming challenges related to defect density, process compatibility, and cost structure for SiC adoption [66][67] 3. SiC in Optical Applications - SiC is also highlighted for its potential in optical waveguides, particularly for AR glasses, due to its high refractive index and thermal conductivity [68][75] - The combination of SiC with Micro LED technology is seen as a promising pathway for future AR displays [77] 4. Research and Development - Ongoing research is focused on the feasibility of integrating SiC with TSV structures to enhance power integrity and thermal management [64][65] - TSMC's patent portfolio indicates a strong commitment to SiC integration in advanced packaging technologies [65] This comprehensive analysis underscores TSMC's strategic focus on SiC as a transformative material in the semiconductor industry, particularly in the context of AI and HPC advancements.

Core Insights - The article discusses the growing importance of Gallium Nitride (GaN) and Silicon Carbide (SiC) as third-generation semiconductor materials, particularly in the context of AI data centers, where they are creating new market opportunities [1][30]. - The rise of AI is significantly increasing power demands in data centers, necessitating upgrades in power supply systems to accommodate higher efficiency and power density [3][30]. Group 1: AI Data Center Power Challenges - The power consumption of AI data centers is projected to reach 7% of global energy consumption by 2030, equivalent to India's current energy usage [3]. - Traditional silicon-based devices have reached their performance limits, making wide bandgap semiconductors like SiC and GaN essential for meeting the demands of higher voltage, faster switching frequencies, and greater power density [3][30]. Group 2: Technical Advantages of SiC and GaN - SiC offers lower conduction resistance and stable temperature characteristics, making it suitable for high-voltage and high-temperature applications, particularly in AC-DC conversion [5]. - GaN achieves low switching losses and high switching frequencies, making it ideal for high-density applications in DC-DC conversion [5][30]. Group 3: Industry Leaders and Competitive Landscape - Infineon is positioned as a leader in power semiconductors, launching products like the CoolSiC™ MOSFET 400V series, which enhances power density and efficiency for AI server power supplies [7][8]. - Navitas Semiconductor combines SiC and GaN technologies to create high-power density solutions, recently introducing a 4.5kW AI data center server power solution with a power density of 137W/in³ and efficiency exceeding 97% [9]. - ON Semiconductor focuses on high output power, conversion efficiency, and power density, offering innovative solutions that balance small packaging with high performance [10]. Group 4: NVIDIA's Role in Driving Change - NVIDIA is seen as a key player in pushing the adoption of third-generation semiconductors, advocating for an 800V high-voltage direct current (HVDC) infrastructure in data centers [14][15]. - The shift to an 800V architecture is expected to create significant demand for new power devices and semiconductors, with NVIDIA's plans for future GPU and CPU deployments driving this transformation [15][16]. Group 5: Market Outlook - The market for GaN is expected to grow faster than SiC in AI data centers, driven by the demand for high-voltage applications and the advantages of GaN in high-frequency, low-loss scenarios [20][30]. - The article anticipates a golden era for third-generation semiconductors in AI data centers, contributing to technological advancements and more efficient infrastructure [30].

Core Viewpoint - Silicon Carbide (SiC) is gaining attention as the next-generation power semiconductor material due to its superior properties compared to silicon (Si), particularly in high-temperature and high-pressure applications [1][3]. Group 1: Historical Progress and Development - Significant advancements in SiC power devices have been made since the 2000s, overcoming early challenges related to defects in the crystal structure [3][4]. - The defect density in SiC wafers has been reduced by an order of magnitude, thanks to improved simulation technologies and experimental efforts [3][4]. - The price of SiC wafers has dramatically decreased over the past 20 years, with 8-inch wafers now costing around 4,800 RMB, a reduction of nearly an order of magnitude [4]. Group 2: Market Expansion and Key Players - The year 2001 marked a turning point for SiC with Infineon Technologies leading the small-scale production of SiC diodes, although the market was limited at that time [6]. - The introduction of SiC transistors by Cree (now Wolfspeed) and ROHM in 2010 was a significant milestone, but the market size remained minimal [6]. - Tesla's adoption of SiC power devices in its electric vehicles in 2018 catalyzed market expansion, leading to increased awareness and adoption of SiC technology in the automotive sector [6][7]. Group 3: Current Market Trends and Future Outlook - The SiC market is expected to reach approximately 30 billion RMB by 2024, driven by the growing demand for electric vehicles and advancements in railway vehicle applications [7]. - China has emerged as a leader in SiC wafer production, surpassing Japan, the US, and Germany in wafer size, quality, and cost reduction [9]. - Despite China's rapid development in SiC, Japanese companies still lead in advanced device development, maintaining a competitive edge in the power device ecosystem [9][10]. Group 4: Challenges and Technical Issues - A persistent issue for SiC is the high defect density at the SiC and SiO2 interface, which hinders its full potential [15][16]. - The resistance of SiC is currently two to three times higher than ideal values, indicating a need for breakthroughs in research to improve performance and reduce costs [15][16]. - Reliability concerns are becoming increasingly important as SiC power devices gain popularity, necessitating the design of protective circuits to prevent damage during overload conditions [15][16].

Group 1 - The "Million Talents Gather in South Guangdong" initiative aims to attract 1 million college graduates to Guangdong for employment and entrepreneurship by 2025, with the target achieved ahead of schedule by mid-July 2025 [1] - The N City Linked Autumn Recruitment event will provide over 120,000 quality job positions across more than 100 key universities nationwide, focusing on emerging industries and national strategic needs [1][4] - The Guangdong-Hong Kong-Macao Greater Bay Area is experiencing a strong demand for research talent, particularly in the fields of semiconductor technology and advanced power electronics [2][4] Group 2 - Shenzhen's new research university, Shenzhen University of Technology, is actively recruiting over 140 positions, including research assistants and young professors, with competitive salaries reaching up to 750,000 yuan [2][3] - The recruitment event targets modern industrial needs, focusing on artificial intelligence, new information technology, integrated circuits, and advanced materials [4] - Major companies such as Huawei, Tencent, and BYD participated in the recruitment event, offering numerous positions in AI, 3D printing, and low-altitude economy sectors [5][6] Group 3 - The low-altitude economy in Guangdong is projected to have a talent gap of approximately 5 million, with a significant demand for skilled professionals in drone operations and related fields [6] - The "Assist Enterprises Youth Brigade" initiative provides various support measures, including housing and education benefits, to attract and retain talent in the region [7][8] - The recruitment activities are designed to create immersive experiences for graduates, showcasing the opportunities and living conditions in Guangdong [8]