碳化硅(SiC)

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碳化硅进入先进封装主舞台:观察台积电的碳化硅战略 --- SiC Enters the Advanced Packaging Mainstage_ Observing TSMC’s SiC Strategy
2025-10-09 02:00
Observing TSMC's SiC Strategy :SiC Enters the Advanced Packaging Mainstage 观察台积电的碳化硅战略:碳化硅进入先进封装的 主舞台 Original Articles By SemiVision Research (Nvidia ,TSMC, Globalwafers, Wolfspeed) SemiVision Research 原创文章(英伟达、台积电、环球晶圆、Wolfspeed) SEP 21, 2025 2025 年 9 月 21 日 ∙ PAID ∙ 付费 SEMIVISION 7 Share 分享 20 shorten the power path and reduce PDN impedance, enabling faster voltage response. ASE, through its VIPack and FOCoS-Bridge (with TSV) platforms, is optimizing PDN, signal interconnects, and thermal performance sim ...
AI,点燃第三代半导体黄金时代
半导体行业观察· 2025-10-07 02:21
作为宽禁带半导体的两大代表材料,氮化镓(GaN)目前在消费电子快充领域蓬勃发展,而 碳化硅(SiC)则在新能源汽车的应用场景中逐渐普及。这两种第三代半导体材料各有千 秋:GaN以其高开关频率和低开关损耗优势在高频应用中大放异彩,SiC则凭借高电压、高 温度工作能力在功率转换领域独树一帜。 如今,随着人工智能的强势崛起,这两种材料的应用边界正在不断拓展,为碳化硅和氮化镓 创造了前所未有的增量市场——AI数据中心服务器电源(PSU)。 AI数据中心的电力挑战: 从传统到变革 生成式人工智能的火热应用以及AI芯片算力的爆发式增长,正在重新定义数据中心的电力需求。 根 据 英 飞 凌 的 预 测 , 单 个 GPU 的 功 耗 将 呈 指 数 级 增 长 , 从 目 前 的 1000W 激 增 至 2030 年 的 约 2000W。与此同时,AI服务器机架的峰值功耗将达到惊人的300kW以上——这相当于几年前传统 服务器总功耗的数十倍。 更为严峻的是,英飞凌估计到2030年,数据中心的电力消耗可能高达全球的7%,大致相当于印度 目前的全国能源消耗量。这一数据清晰地描绘了AI带来的高能耗危机。 在这种背景下,数据中心电 ...
中国SiC,卷赢了?
半导体行业观察· 2025-09-30 03:31
Core Viewpoint - Silicon Carbide (SiC) is gaining attention as the next-generation power semiconductor material due to its superior properties compared to silicon (Si), particularly in high-temperature and high-pressure applications [1][3]. Group 1: Historical Progress and Development - Significant advancements in SiC power devices have been made since the 2000s, overcoming early challenges related to defects in the crystal structure [3][4]. - The defect density in SiC wafers has been reduced by an order of magnitude, thanks to improved simulation technologies and experimental efforts [3][4]. - The price of SiC wafers has dramatically decreased over the past 20 years, with 8-inch wafers now costing around 4,800 RMB, a reduction of nearly an order of magnitude [4]. Group 2: Market Expansion and Key Players - The year 2001 marked a turning point for SiC with Infineon Technologies leading the small-scale production of SiC diodes, although the market was limited at that time [6]. - The introduction of SiC transistors by Cree (now Wolfspeed) and ROHM in 2010 was a significant milestone, but the market size remained minimal [6]. - Tesla's adoption of SiC power devices in its electric vehicles in 2018 catalyzed market expansion, leading to increased awareness and adoption of SiC technology in the automotive sector [6][7]. Group 3: Current Market Trends and Future Outlook - The SiC market is expected to reach approximately 30 billion RMB by 2024, driven by the growing demand for electric vehicles and advancements in railway vehicle applications [7]. - China has emerged as a leader in SiC wafer production, surpassing Japan, the US, and Germany in wafer size, quality, and cost reduction [9]. - Despite China's rapid development in SiC, Japanese companies still lead in advanced device development, maintaining a competitive edge in the power device ecosystem [9][10]. Group 4: Challenges and Technical Issues - A persistent issue for SiC is the high defect density at the SiC and SiO2 interface, which hinders its full potential [15][16]. - The resistance of SiC is currently two to three times higher than ideal values, indicating a need for breakthroughs in research to improve performance and reduce costs [15][16]. - Reliability concerns are becoming increasingly important as SiC power devices gain popularity, necessitating the design of protective circuits to prevent damage during overload conditions [15][16].
精准锚定未来产业:广东秋招“头炮”打响,百万年薪揽才
2 1 Shi Ji Jing Ji Bao Dao· 2025-09-24 05:20
Group 1 - The "Million Talents Gather in South Guangdong" initiative aims to attract 1 million college graduates to Guangdong for employment and entrepreneurship by 2025, with the target achieved ahead of schedule by mid-July 2025 [1] - The N City Linked Autumn Recruitment event will provide over 120,000 quality job positions across more than 100 key universities nationwide, focusing on emerging industries and national strategic needs [1][4] - The Guangdong-Hong Kong-Macao Greater Bay Area is experiencing a strong demand for research talent, particularly in the fields of semiconductor technology and advanced power electronics [2][4] Group 2 - Shenzhen's new research university, Shenzhen University of Technology, is actively recruiting over 140 positions, including research assistants and young professors, with competitive salaries reaching up to 750,000 yuan [2][3] - The recruitment event targets modern industrial needs, focusing on artificial intelligence, new information technology, integrated circuits, and advanced materials [4] - Major companies such as Huawei, Tencent, and BYD participated in the recruitment event, offering numerous positions in AI, 3D printing, and low-altitude economy sectors [5][6] Group 3 - The low-altitude economy in Guangdong is projected to have a talent gap of approximately 5 million, with a significant demand for skilled professionals in drone operations and related fields [6] - The "Assist Enterprises Youth Brigade" initiative provides various support measures, including housing and education benefits, to attract and retain talent in the region [7][8] - The recruitment activities are designed to create immersive experiences for graduates, showcasing the opportunities and living conditions in Guangdong [8]
SiC 进入先进封装主舞台:观察台积电的 SiC 策略 --- SiC Enters the Advanced Packaging Mainstage_ Observing TSMC’s SiC Strategy
2025-09-22 00:59
Summary of Key Points from the Conference Call Industry and Company Overview - The discussion centers around the semiconductor industry, particularly focusing on advanced packaging technologies and the role of Silicon Carbide (SiC) in AI chip design and manufacturing. Key players mentioned include TSMC, NVIDIA, AMD, Google, and AWS, with a specific emphasis on TSMC's strategies and innovations in packaging solutions [1][2][3]. Core Insights and Arguments 1. **Challenges in AI Chip Design**: The increasing complexity and power demands of AI chips have led to significant challenges in power delivery networks (PDNs) and thermal management. Traditional methods are becoming inadequate, with single GPUs now requiring over 1000A of current [5][19]. 2. **Innovative Solutions**: Companies like Marvell and ASE are proposing solutions such as Package-Integrated Voltage Regulators (PIVR) and optimized PDN platforms to address these challenges. TSMC is also innovating with its CoWoS-L platform, which integrates embedded voltage regulators and advanced thermal management techniques [7][10][11]. 3. **Emergence of SiC**: SiC is highlighted as a critical material for AI chip and system design due to its superior properties, including high thermal conductivity and mechanical strength. It is increasingly being viewed as essential for advanced packaging and heterogeneous integration [13][14][16]. 4. **Market Demand**: The demand for ultra-large-scale GPUs and ASICs is driven by generative AI and large-scale model training, with power consumption often exceeding 1 kW. This has exposed bottlenecks in thermal management and power delivery [19][20]. 5. **Bottlenecks Identified**: The exponential growth in AI computing has revealed three critical bottlenecks: thermal challenges, power delivery bottlenecks, and electro-optical integration demands. TSMC is actively addressing these through its 3DFabric strategy and various packaging solutions [22][28][30][32]. Additional Important Content 1. **SiC's Role in Advanced Packaging**: SiC is positioned as a hybrid integration enabler, linking power delivery, thermal dissipation, and optical interconnects. Its unique properties make it suitable for high-voltage integrated circuits (HVICs) and optical interposers [40][44]. 2. **Competitive Landscape**: TSMC's exploration of SiC as an interposer material could provide a competitive edge in thermal management and electro-optical integration, especially compared to Intel and Samsung, who are also advancing their own technologies [45][46]. 3. **Challenges Ahead**: The successful commercialization of SiC in advanced packaging faces challenges such as defect density control in large-size wafers, process compatibility, and cost structure improvements [53][54]. 4. **Future Directions**: The integration of SiC into TSMC's platforms like COUPE and CoWoS-Next could reshape the AI semiconductor supply chain, establishing new industrial advantages in the AI and high-performance computing (HPC) era [44][97]. This summary encapsulates the critical insights and developments discussed in the conference call, emphasizing the strategic importance of SiC in the evolving semiconductor landscape.
SiC,美国最新公布
半导体芯闻· 2025-09-19 10:38
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自半导体芯闻综合。 阿肯色大学 (UAPG) 是 全球知名的半导体和电力电子研究机构,其电力集团 (UAPG) 今天宣布启 动 美 国 首 个 多 用 户 碳 化 硅 半 导 体 研 究 制 造 设 施 (MUSiC) 。 MUSiC 是 美 国 首 个 致 力 于 碳 化 硅 (SiC) 研究、原型设计和大规模商业化的开放式 SiC 晶圆厂。 MUSiC 加速美国 SiC 商业化进程,同时持续推进 SiC 及相关材料的研究。MUSiC 的核心目标是 提供先进的原型设计能力,降低创新门槛,并缩短开发周期。其提供的行业参与模式涵盖标准多项 目晶圆、半定制平台、外部研发模块集成以及全定制构建。这种多功能性确保美国早期创新者和成 熟合作伙伴都能获得量身定制的途径,以满足其商业化需求。 "MUSiC 为美国提供了无与伦比的 SiC 研发资源,"UA Power Group 执行董事、阿肯色大学杰出 教授 Alan Mantooth 博士补充道。"MUSiC 的独特之处在于它能够充当研发与量产之间的桥梁, 帮助我们的合作伙伴(无论大小)提供从创新到市场部署的直接途径 ...
英伟达抢进SiC?什么情况
半导体行业观察· 2025-09-12 01:14
Core Viewpoint - NVIDIA is initiating a "power revolution" by increasing the output voltage of AI server chips from 54V to 800V, utilizing Silicon Carbide (SiC) components to enhance power efficiency and performance in server cabinets [1][2]. Group 1: Silicon Carbide (SiC) Overview - Silicon Carbide (SiC) is a compound semiconductor material made from silicon and carbon, offering a wider bandgap than silicon, high-temperature resistance over 200 degrees Celsius, and excellent heat dissipation, making it suitable for high-power applications [1]. - SiC has been used in various applications such as 5G communications, electric vehicles (EVs), charging stations, and renewable energy systems, enhancing energy efficiency and performance [1]. Group 2: NVIDIA's Power Revolution - NVIDIA's new generation processor plans to upgrade the silicon intermediary layer to SiC, aiming for full-scale production of the 800V high-voltage direct current (HVDC) data center architecture by 2027 [2]. - The power consumption of AI servers is expected to increase from kilowatt (KW) levels to 1 million watts (MW), indicating a nearly 100-fold rise in future power demand [2]. - The traditional 54V architecture is nearing its limits in terms of copper loss, space, and conversion efficiency, necessitating the shift to SiC for improved efficiency and power density [2]. Group 3: Challenges and Considerations - While SiC offers significant advantages for high-performance server cabinets, it does not completely replace silicon in chip design and manufacturing, as silicon remains essential for CPU and GPU designs [3]. - The adoption of SiC is hindered by its high cost and the previous low voltage requirements of data centers, which limited the realization of SiC's benefits [4]. - Implementing SiC components requires careful design and wiring, complicating the control and safety verification of power systems, and necessitating an upgrade of the entire supply chain to accommodate the new architecture [4]. Group 4: Industry Implications - SiC is becoming a key material upgrade for power supply manufacturers, who are integrating SiC power components into server power supply units (PSUs) and HVDC distribution modules, highlighting the importance of technical expertise in this transition [5].
湾芯展2025再升级:展区扩容50%,百亿级产业机遇蓄势爆发
半导体行业观察· 2025-08-19 01:24
Core Viewpoint - The 2025 Bay Area Semiconductor Industry Eco-Expo aims to showcase the innovation and business opportunities within the global semiconductor industry, featuring a significant scale upgrade and a comprehensive industry ecosystem [1][17]. Group 1: Event Overview - The expo will take place from October 15 to 17, 2025, at the Shenzhen Convention Center, with a total exhibition area exceeding 60,000 square meters, which is equivalent to eight standard football fields [1]. - The event will gather over 600 leading industry companies and is expected to attract 60,000 professional visitors, along with hosting more than 20 cutting-edge technology summits and industry forums [1][9]. Group 2: Industry Coverage - The expo will feature four core exhibition areas: wafer manufacturing, compound semiconductors, IC design, and advanced packaging, covering the entire industry chain from upstream materials and equipment to downstream applications [4][7]. - Each exhibition area is meticulously planned to not only showcase the latest technological achievements but also to focus on practical application scenarios, providing an immersive industry experience for exhibitors and visitors [4]. Group 3: Innovative Display Modes - The expo introduces an innovative "technology + application ecosystem" display mode, with three ecological zones dedicated to AI chip ecosystems, RISC-V ecosystems, and Chiplet and advanced packaging ecosystems [6]. - This approach allows visitors to deeply experience semiconductor technology in various application scenarios, including AI computing centers, robotics, smart vehicles, smart cities, Industry 4.0, and consumer electronics [6]. Group 4: Business Opportunities - The wafer manufacturing exhibition area will showcase top global wafer manufacturing equipment and materials suppliers, presenting comprehensive solutions for the entire wafer manufacturing process, including key technological breakthroughs [7]. - The expo is expected to unlock over 10 billion yuan in industrial cooperation opportunities across various fields, including equipment procurement, technology licensing, production line construction, and material supply [9]. Group 5: Year-Round Service Ecosystem - The expo will establish a year-round service ecosystem, breaking the traditional three-day exhibition time limitation, and will include a demand database and supplier resource library for precise matching before, during, and after the event [10][19]. - An innovative "project procurement exhibition" model will be introduced, focusing on project demand to facilitate efficient matching between suppliers and buyers [11]. Group 6: Collaborative Development - The expo will connect six major semiconductor industry cities in China, leveraging local industrial characteristics and resource advantages to form a collaborative development pattern [12]. - It will provide a platform for global product launches, technical exchanges, and precise procurement matching, inviting key downstream purchasers from the industry [12][14]. Group 7: Comprehensive Professional Services - The organizers will offer a full range of professional services throughout the exhibition process, including pre-exhibition demand research, on-site business coordination, and post-exhibition project tracking [19]. - The expo aims to promote the deep integration of the global semiconductor industry ecosystem, contributing to the transition of China's semiconductor industry from "technology following" to "innovation leading" [17].
意法半导体(STM):FY25Q2业绩点评及业绩说明会纪要:受重组、减值等影响,25Q2 单季度亏损
Huachuang Securities· 2025-07-27 02:45
Investment Rating - The report assigns a neutral investment rating for the company, indicating expectations of performance within a range of -10% to +10% relative to the benchmark index over the next six months [58]. Core Insights - In Q2 2025, the company reported revenue of $2.77 billion, which is a quarter-over-quarter increase of 9.9% but a year-over-year decrease of 14%, exceeding the midpoint of the guidance [2][8]. - The gross margin for Q2 2025 was 33.5%, showing a slight increase of 0.1 percentage points quarter-over-quarter but a decline of 6.6 percentage points year-over-year, primarily due to an unfavorable product mix and increased costs from underutilized capacity [2][8]. - The net loss for Q2 2025 was $97 million, compared to a profit of $353 million in the same period last year, mainly impacted by asset impairment and restructuring costs [2][8]. Revenue Breakdown - The revenue from the industrial sector in Q2 2025 grew approximately 15% quarter-over-quarter but declined about 8% year-over-year, confirming Q1 as the market bottom [3][21]. - The automotive sector saw a quarter-over-quarter revenue increase of about 14% but a year-over-year decline of approximately 24%, with expectations for continued growth in Q3 despite specific customer dynamics affecting order shipment ratios [3][20]. - Personal electronics revenue increased about 3% quarter-over-quarter and decreased about 5% year-over-year, performing better than expected [3][23]. - Revenue from communication devices and computer peripherals grew approximately 6% quarter-over-quarter and declined about 5% year-over-year, also exceeding expectations [3][23]. Future Guidance - For Q3 2025, the revenue guidance midpoint is set at $3.17 billion, representing a quarter-over-quarter increase of 14.6% and a year-over-year decrease of 2.5%, with all end markets expected to recover except for automotive [4][24]. - The gross margin guidance for Q3 2025 remains at 33.5%, with expected fluctuations of 200 basis points, accounting for costs related to underutilized capacity and negative impacts from currency and restructuring plans [4][24]. - The company plans to maintain its net capital expenditure for 2025 between $2 billion and $2.3 billion, primarily for executing manufacturing restructuring plans [4][24]. Strategic Focus Areas - The company is focusing on the industrial sector, automotive sector, personal electronics, and communication devices and computer peripherals as key strategic areas for growth [19][20][23]. - The "China for China" strategy aims to localize manufacturing and support to enhance competitiveness in the Chinese market, which currently contributes about 13-14% of total revenue [27][41].
Nvidia 定义电力电子的未来
半导体行业观察· 2025-07-14 01:16
Core Viewpoint - Nvidia is redefining the characteristics and functionalities of power electronic devices for AI data centers, despite not designing or manufacturing power devices itself [2][9]. Group 1: Nvidia's Influence on Power Electronics - Nvidia's push for AI data centers is creating momentum for Gallium Nitride (GaN) technology, similar to how Silicon Carbide (SiC) benefited from Tesla's early adoption [6]. - Nvidia is collaborating with various partners, including Infineon, MPS, Navitas, and others, to transition to an 800V High Voltage Direct Current (HVDC) power infrastructure for data centers [3][10]. - The company is moving away from traditional 54V rack power distribution technology due to its inability to meet the increasing power demands of large GPU clusters [8][9]. Group 2: Technical Requirements and Innovations - The new 800V HVDC architecture will necessitate a range of new power devices and semiconductors, with a focus on converting 800V to lower voltages for server motherboards [10]. - Infineon indicates that SiC is leading in high power and voltage solutions, while GaN is more suited for high-frequency applications due to space constraints [11]. - New semiconductor-based relays will be required for the high voltage DC AI data centers to ensure safe control of overcurrent and surge currents [12]. Group 3: Competitive Landscape and Market Dynamics - Nvidia's proactive approach in announcing its power infrastructure plans is driving industry dialogue and may render existing standards like the Open Compute Project (OCP) obsolete [16]. - The market for GaN is expected to grow faster than SiC, with GaN devices having higher voltage potential and applications in both DC/DC and AC/DC conversions [19].